Lefatšeng le rarahaneng la theknoloji ea sejoale-joale,liphaphatha, tse tsejoang hape e le li-wafers tsa silicon, ke likarolo tsa mantlha tsa indasteri ea semiconductor. Ke motheo oa ho etsa likarolo tse fapaneng tsa elektroniki joalo ka li-microprocessors, memori, li-sensor, joalo-joalo, 'me sephaphatha ka seng se na le bokhoni ba likarolo tse ngata tsa elektroniki. Joale ke hobane'ng ha hangata re bona li-wafers tse 25 ka lebokoseng? Ha e le hantle ho na le maikutlo a saense le moruo oa tlhahiso ea indasteri ka mor'a sena.
Ho senola lebaka leo ka lona ho nang le li-wafers tse 25 ka lebokoseng
Pele, utloisisa boholo ba sephaphatha. Boholo ba li-wafer tse tloaelehileng hangata ke lisenthimithara tse 12 le lisenthimithara tse 15, e leng ho ikamahanya le lisebelisoa tse fapaneng tsa tlhahiso le lits'ebetso.Li-wafers tse 12-inchha joale ke mofuta o atileng haholo hobane li khona ho amohela li-chips tse ngata 'me li leka-lekane ka litšenyehelo tsa tlhahiso le katleho.
Nomoro "likotoana tse 25" ha se ka phoso. E ipapisitse le mokhoa oa ho itšeha le ts'ebetso ea ho paka ea wafer. Kamora hore sephaphatha se seng le se seng se hlahisoe, se hloka ho khaoloa ho theha li-chips tse ngata tse ikemetseng. Ka kakaretso, a12-inch sephaphathae ka khaola makholo kapa esita le likete tsa chips. Leha ho le joalo, bakeng sa boiketlo ba tsamaiso le lipalangoang, li-chips tsena hangata li phutheloa ka bongata bo itseng, 'me likotoana tse 25 ke khetho e tloaelehileng ea bongata hobane ha e kholo haholo kapa e kholo haholo,' me e ka netefatsa botsitso bo lekaneng nakong ea lipalangoang.
Ntle le moo, palo ea likotoana tse 25 e boetse e thusa ho iketsetsa le ho ntlafatsa mohala oa tlhahiso. Tlhahiso ea batch e ka fokotsa litšenyehelo tsa ts'ebetso ea sekhechana se le seng le ho ntlafatsa katleho ea tlhahiso. Ka nako e ts'oanang, bakeng sa polokelo le lipalangoang, lebokose la liphaephe tse 25 le bonolo ho sebetsa le ho fokotsa kotsi ea ho senya.
Ke habohlokoa ho hlokomela hore ka tsoelo-pele ea theknoloji, lihlahisoa tse ling tse phahameng li ka nka palo e kholoanyane ea liphutheloana, tse kang likotoana tse 100 kapa tse 200, ho ntlafatsa ts'ebetso ea tlhahiso. Leha ho le joalo, bakeng sa lihlahisoa tse ngata tsa boleng ba bareki le tsa mahareng, lebokose la likotoana tse 25 e ntse e le tlhophiso e tloaelehileng e tloaelehileng.
Ka kakaretso, lebokose la li-wafers hangata le na le likotoana tse 25, e leng tekanyo e fumanoang ke indasteri ea semiconductor pakeng tsa katleho ea tlhahiso, taolo ea litšenyehelo le boiketlo ba thepa. Ka tsoelo-pele e tsoelang pele ea thekenoloji, palo ena e ka 'na ea fetoloa, empa mohopolo oa motheo ka mor'a eona - ho ntlafatsa mekhoa ea tlhahiso le ho ntlafatsa melemo ea moruo - e ntse e sa fetohe.
Masela a li-wafer a 12-inch a sebelisa FOUP le FOSB, le 8-inch le ka tlase (ho kenyeletsoa 8-inch) a sebelisa Cassette, SMIF POD, le lebokose la sekepe sa wafer, ke hore, 12-inch.sejari sa sephaphathaka kakaretso e bitsoa FOUP, le 8-inchsejari sa sephaphathaka kakaretso e bitsoa Cassette. Ka tloaelo, FOUP e se nang letho e boima ba lik'hilograma tse 4.2, 'me FOUP e tletseng li-wafers tse 25 e boima ba lik'hilograma tse 7.3.
Ho latela lipatlisiso le lipalo-palo tsa sehlopha sa lipatlisiso tsa QYResearch, thekiso ea 'maraka oa li-wafer box ea lefatše e fihlile li-yuan tse libilione tse 4.8 ka 2022,' me e lebelletsoe ho fihla li-yuan tse libilione tse 7.7 ka 2029, ka sekhahla sa kholo ea selemo le selemo (CAGR) sa 7.9%. Mabapi le mofuta oa sehlahisoa, semiconductor FOUP e nka karolo e kholo ka ho fetisisa 'marakeng kaofela, e ka bang 73%. Mabapi le ts'ebeliso ea sehlahisoa, ts'ebeliso e kholo ka ho fetisisa ke li-wafers tse 12-inch, tse lateloang ke li-wafers tse 8-inch.
Ha e le hantle, ho na le mefuta e mengata ea li-wafer carriers, tse kang FOUP bakeng sa phetisetso ea liphaephe ho limela tsa ho etsa li-wafer; FOSB bakeng sa lipalangoang pakeng tsa tlhahiso ea silicon wafer le limela tsa tlhahiso ea liphaephe; Bajari ba CASSETTE ba ka sebelisoa bakeng sa lipalangoang tsa li-inter-process le ho sebelisoa hammoho le mekhoa.
BULENG KOSETE
OPEN CASSETTE e sebelisoa haholo-holo mekhoeng ea lipalangoang le ho hloekisa ha ho etsoa liphaephe. Joalo ka FOSB, FOUP le lijari tse ling, ka kakaretso e sebelisa thepa e hananang le mocheso, e nang le thepa e ntle ea mochini, e tsitsitseng, 'me e tšoarella nako e telele, e thibelang boemo, e ntša gassing e tlase, pula e tlase ebile e ka sebelisoa hape. Mefuta e fapaneng ea li-wafer, li-node tsa ts'ebetso, le lisebelisoa tse khethiloeng bakeng sa lits'ebetso tse fapaneng li fapane. Lisebelisoa tse akaretsang ke PFA, PTFE, PP, PEEK, PES, PC, PBT, PEI, COP, joalo-joalo Sehlahisoa ka kakaretso se entsoe ka matla a likotoana tsa 25.
OPEN CASSETTE e ka sebelisoa hammoho le e tsamaellanangKhasete ea Waferlihlahisoa bakeng sa polokelo ea liphaphatha le lipalangoang pakeng tsa mekhoa ea ho fokotsa tšilafalo ea liphaphatha.
OPEN CASSETTE e sebelisoa mmoho le lihlahisoa tse ikhethileng tsa Wafer Pod (OHT), tse ka sebelisoang ho phetiso ea othomathiki, phihlello ea boiketsetso le polokelo e tiisitsoeng haholoanyane lipakeng tsa lits'ebetso tsa tlhahiso ea li-wafer le tlhahiso ea chip.
Ehlile, OPEN CASSETTE e ka etsoa ka kotloloho lihlahisoa tsa CASSETTE. Sehlahisoa sa Wafer Shipping Boxes se na le sebopeho se joalo, joalo ka ha se bonts'itsoe setšoantšong se ka tlase. E ka khotsofatsa litlhoko tsa lipalangoang tsa liphaephe ho tloha ho limela tse etsang li-wafer ho ea ho limela tse etsang li-chip. CASSETTE le lihlahisoa tse ling tse nkiloeng ho eona ha e le hantle li ka fihlela litlhoko tsa phetisetso, polokelo le lipalangoang tse lipakeng tsa lifeme lipakeng tsa lits'ebetso tse fapaneng lifekthering tsa wafer le lifeme tsa chip.
Lebokose la Phatlalatso la ho Bula ka Pele la FOSB
Lebokose la Phatlalatso la Phatlalatso la Pele la ho Bula FOSB e sebelisoa haholo bakeng sa ho tsamaisa li-wafers tse 12-inch lipakeng tsa limela tse etsang li-wafer le lifeme tsa ho etsa li-chip. Ka lebaka la boholo bo boholo ba li-wafers le litlhoko tse phahameng tsa bohloeki; likotoana tse khethehileng tsa ho beha maemo le moralo o ts'oarellang li sebelisoa ho fokotsa litšila tse hlahisoang ke likhohlano tsa phalliso; lisebelisoa tse tala li entsoe ka thepa e fokolang ea khase e fokolang, e ka fokotsang kotsi ea li-wafers tse silafatsang ka ntle ho khase. Ha ho bapisoa le mabokose a mang a liphaephe tsa lipalangoang, FOSB e na le matla a ho thibela moea hantle. Ntle le moo, fekthering ea liphutheloana tsa morao-rao, FOSB e ka sebelisoa hape bakeng sa ho boloka le ho fetisa li-wafers lipakeng tsa lits'ebetso tse fapaneng.
FOSB hangata e entsoe likotoana tse 25. Ntle le ho boloka le ho khutlisa ka mokhoa o itekanetseng ka Automated Material Handling System (AMHS), e ka boela ea sebetsoa ka letsoho.
Phatlalatso ea Ka pele ea Unified Pod
Front Opening Unified Pod (FOUP) e sebelisoa haholo bakeng sa ts'ireletso, lipalangoang le polokelo ea liphaphatha femeng ea Fab. Ke sets'oants'o sa bohlokoa sa sepalangoang bakeng sa sistimi ea phetisetso e ikemetseng fekthering ea 12-inch wafer. Mosebetsi oa eona oa bohlokoa ka ho fetisisa ke ho etsa bonnete ba hore li-wafers tse ling le tse ling tse 25 li sirelelitsoe ke eona ho qoba ho silafatsoa ke lerōle tikolohong e ka ntle nakong ea phetisetso pakeng tsa mochine o mong le o mong oa tlhahiso, kahoo o ama chai. FOUP e 'ngoe le e' ngoe e na le lipoleiti tse hokelang tse fapaneng, lithakhisa le masoba e le hore FOUP e be boema-kepe ba ho kenya thepa mme e sebetsoe ke AMHS. E sebelisa lisebelisoa tse fokolang tsa khase le lisebelisoa tse fokolang tsa mongobo, tse ka fokotsang haholo ho lokolloa ha metsoako ea lintho tse phelang le ho thibela tšilafalo ea liphaphatha; ka nako e ts'oanang, ts'ebetso e babatsehang ea ho tiisa le ho theoha ha theko e ka fana ka tikoloho e tlaase ea mongobo bakeng sa sephaphatha. Ho phaella moo, FOUP e ka etsoa ka mebala e fapaneng, e kang e khubelu, ea lamunu, e ntšo, e hlakileng, joalo-joalo, ho finyella litlhoko tsa ts'ebetso le ho khetholla mekhoa le mekhoa e fapaneng; ka kakaretso, FOUP e etselitsoe bareki ho latela mohala oa tlhahiso le liphapang tsa mochini oa fektheri ea Fab.
Ho feta moo, POUP e ka etsoa lihlahisoa tse khethehileng bakeng sa baetsi ba liphutheloana ho latela mekhoa e fapaneng e kang TSV le FAN OUT ka har'a sephutheloana sa chip back-end, joalo ka SLOT FOUP, 297mm FOUP, joalo-joalo. FOUP e ka sebelisoa hape, 'me nako ea bophelo ba eona ke pakeng tsa lilemo tse 2-4. Baetsi ba FOUP ba ka fana ka lits'ebeletso tsa ho hloekisa lihlahisoa ho kopana le lihlahisoa tse silafetseng tse lokelang ho sebelisoa hape.
Contactless Horizontal Wafer Shippers
Li-Shippers tsa Horizontal Horizontal Wafer li sebelisoa haholo bakeng sa ho tsamaisa liphaephe tse felileng, joalo ka ha ho bonts'itsoe setšoantšong se ka tlase. Lebokose la lipalangoang la Entegris le sebelisa selikalikoe sa tšehetso ho etsa bonnete ba hore li-wafers ha li kopane nakong ea polokelo le lipalangoang, 'me li na le tiiso e ntle ho thibela ho silafala ha litšila, ho roala, ho thulana, li-scratches, degassing, joalo-joalo Sehlahisoa se loketse haholo-holo bakeng sa Thin 3D, lense kapa. li-wafers tse koetsoeng, 'me libaka tsa eona tsa ts'ebeliso li kenyelletsa 3D, 2.5D, MEMS, LED le li-semiconductors tsa matla. Sehlahisoa se na le mehele ea tšehetso e 26, e nang le matla a 25 (e nang le botenya bo fapaneng), 'me boholo ba liphaephe bo kenyelletsa 150mm, 200mm le 300mm.
Nako ea poso: Jul-30-2024