Ho beha mouoane oa lik'hemik'hale(CVD)ke theknoloji e sebelisoang ka ho fetisisa indastering ea semiconductor bakeng sa ho kenya lisebelisoa tse fapaneng, ho kenyeletsoa mefuta e mengata e fapaneng ea lisebelisoa tsa insulating, lisebelisoa tse ngata tsa tšepe le lisebelisoa tsa tšepe tse kopaneng.
CVD ke theknoloji e tloaelehileng ea ho lokisa lifilimi. Molao-motheo oa eona ke ho sebelisa li-precursors tsa gaseous ho senya likarolo tse itseng ka pele ho karabelo ea lik'hemik'hale lipakeng tsa liathomo le limolek'hule, ebe ho etsa filimi e tšesaane holim'a substrate. Litšobotsi tsa motheo tsa CVD ke: liphetoho tsa lik'hemik'hale (karabelo ea lik'hemik'hale kapa ho senyeha ha mocheso); lisebelisoa tsohle tsa filimi li tsoa mehloling e ka ntle; li-reactants li tlameha ho kenya letsoho karabelong ea mofuta oa khase.
Low pressure chemical vapor deposition (LPCVD), plasma enhanced chemical vapor deposition (PECVD) le high density plasma chemical vapor deposition (HDP-CVD) ke litheknoloji tse tharo tse tloaelehileng tsa CVD, tse nang le phapang e kholo tabeng ea ho beha thepa, litlhoko tsa thepa, maemo a tshebetso, joalo-joalo. .Se latelang ke tlhaloso e bonolo le papiso ea litheknoloji tsena tse tharo.
1. LPCVD (Low Pressure CVD)
Molao-motheo: Mokhoa oa CVD tlas'a maemo a tlaase a khatello. Molao-motheo oa eona ke ho kenya khase ka kamoreng ea karabelo tlas'a vacuum kapa tikoloho e tlaase ea khatello, ho senya kapa ho itšoara ka khase ka mocheso o phahameng, le ho etsa filimi e tiileng e behiloeng holim'a substrate. Kaha khatello e tlaase e fokotsa ho thulana ha khase le moferefere, ho tšoana le boleng ba filimi li ntlafatsoa. LPCVD e sebelisoa haholo ka silicon dioxide (LTO TEOS), silicon nitride (Si3N4), polysilicon (POLY), khalase ea phosphosilicate (BSG), khalase ea borophosphosilicate (BPSG), polysilicon e nang le doped, graphene, carbon nanotubes le lifilimi tse ling.
Likaroloana:
▪ Mocheso oa tshebetso: hangata pakeng tsa 500 ~ 900 ° C, mocheso oa ts'ebetso o batla o phahame;
▪ Lebelo la khatello ea khase: tikoloho e tlaase ea khatello ea 0.1 ~ 10 Torr;
▪ Boleng ba filimi: boleng bo phahameng, ho tšoana hantle, ho teteana hantle, le mefokolo e fokolang;
▪ Sekhahla sa deposition: sekhahla sa deposition butle;
▪ Uniformity: e loketse li-substrates tsa boholo bo boholo, deposition e tšoanang;
Melemo le go tlhoka mesola:
▪ E ka beha lifilimi tse tšoanang le tse teteaneng haholo;
▪ E sebetsa hantle ho li-substrates tsa boholo bo boholo, tse loketseng tlhahiso ea bongata;
▪ Theko e tlaase;
▪ Mocheso o phahameng, o sa tšoaneleheng bakeng sa lisebelisoa tse thibelang mocheso;
▪ Sekhahla sa deposition se ea lieha 'me tlhahiso e batla e le tlase.
2. PECVD (Plasma Enhanced CVD)
Molao-motheo: Sebelisa plasma ho kenya tšebetsong likhato tsa khase ka mocheso o tlase, ho ionize le ho bola limolek'hule ka har'a khase e arabelang, ebe u beha lifilimi tse tšesaane sebakeng sa substrate. Matla a plasma a ka fokotsa haholo mocheso o hlokahalang bakeng sa karabelo, 'me a na le mefuta e mengata ea lits'ebetso. Lifilimi tse fapaneng tsa tšepe, lifilimi tsa inorganic le lifilimi tsa tlhaho li ka lokisoa.
Likaroloana:
▪ Mocheso oa tšebetso: hangata o pakeng tsa 200 ~ 400°C, mocheso o batla o le tlaase;
▪ Lekhalo la khatello ea khase: hangata ke makholo a mTorr ho ea ho Torr e 'maloa;
▪ Boleng ba filimi: le hoja ho tšoana ha filimi ho le ntle, ho teteana le boleng ba filimi ha li tšoane le LPCVD ka lebaka la liphoso tse ka hlahisoang ke plasma;
▪ Sekhahla sa deposition: sekhahla se phahameng, katleho e phahameng ea tlhahiso;
▪ Ho tšoana: e ka tlaase hanyenyane ho LPCVD ho li-substrates tsa boholo bo boholo;
Melemo le go tlhoka mesola:
▪ Lifilimi tse tšesaane li ka behoa maemong a mocheso a tlaase, a loketseng lintho tse thibelang mocheso;
▪ Lebelo la ho beha ka potlako, le loketseng tlhahiso e sebetsang hantle;
▪ Mokhoa o feto-fetohang, litšobotsi tsa filimi li ka laoloa ka ho lokisa likarolo tsa plasma;
▪ Plasma e ka hlahisa bofokoli ba lifilimi tse kang li-pinholes kapa ho se tšoane;
▪ Ha ho bapisoa le LPCVD, ho teteana ha filimi le boleng ba eona li mpefala hanyane.
3. HDP-CVD (High Density Plasma CVD)
Molao-motheo: Theknoloji e khethehileng ea PECVD. HDP-CVD (eo hape e tsejoang e le ICP-CVD) e ka hlahisa boima bo phahameng ba plasma le boleng ho feta lisebelisoa tsa setso tsa PECVD ka mocheso o tlase oa deposition. Ntle le moo, HDP-CVD e fana ka hoo e batlang e le boikemelo ba ion flux le taolo ea matla, e ntlafatsa bokhoni ba ho tlatsa foro kapa lesoba bakeng sa ho beoa ha filimi e batlang, joalo ka liphahlo tse thibelang ho bonts'a, ho beoa ha thepa e tlase ea dielectric, jj.
Likaroloana:
▪ Mocheso oa mocheso: mocheso oa kamore ho 300 ℃, mocheso oa ts'ebetso o tlase haholo;
▪ Lekhalo la khatello ea khase: pakeng tsa 1 le 100 mTorr, ka tlaase ho PECVD;
▪ Boleng ba filimi: plasma e teteaneng haholo, filimi ea boleng bo holimo, e tšoana hantle;
▪ Sekhahla sa deposition: sekhahla sa deposition se lipakeng tsa LPCVD le PECVD, se phahame hanyane ho feta LPCVD;
▪ Ho tšoana: ka lebaka la plasma e phahameng haholo, ho tšoana ha filimi ke ntho e ntle haholo, e loketse libaka tse nang le sebōpeho se rarahaneng sa substrate;
Melemo le go tlhoka mesola:
▪ E khona ho beha lifilimi tsa boleng bo holimo mochesong o tlase, tse loketseng haholo lisebelisoa tse sa utloeng mocheso;
▪ Ho tšoana hantle ha filimi, ho teteana le ho boreleli holimo;
▪ Tšebeliso e phahameng ea plasma e ntlafatsa ho tšoana ha plasma le ponahalo ea filimi;
▪ Thepa e rarahaneng le litšenyehelo tse phahameng;
▪ Lebelo la ho beha mali le lieha, ’me matla a mangata a plasma a ka baka tšenyo e nyenyane.
Amohela bareki leha e le bafe ba tsoang lefats'eng lohle ho re etela bakeng sa puisano e eketsehileng!
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Nako ea poso: Dec-03-2024