4 limilione tse! SK Hynix e phatlalatsa matsete a tsoetseng pele a ho paka a semiconductor ho Purdue Research Park

West Lafayette, Indiana - SK hynix Inc. e phatlalalitse merero ea ho tsetela hoo e ka bang $4 limilione tse likete ho aha tlhahiso ea liphutheloana e tsoetseng pele le setsi sa R&D bakeng sa lihlahisoa tsa mahlale a maiketsetso Purdue Research Park. Ho theha sehokelo sa mantlha khoebong ea phepelo ea li-semiconductor ea Amerika West Lafayette ke sehokelo se seholo indastering le mmusong.

"Re thabetse ho aha setsi se tsoetseng pele sa ho paka Indiana," ho boletse CEO oa SK hynix Nianzhong Kuo. "Re lumela hore morero ona o tla rala motheo oa pelo e ncha ea Silicon, e leng semiconductor ecosystem e bohareng ba Delta Midwest. Setsi sena se tla theha mesebetsi e lefang haholo ea lehae le ho hlahisa li-memory chips tsa AI tse nang le bokhoni bo phahameng haholo e le hore United States e ka kenya letsoho ka har'a ketane ea bohlokoa ea phepelo ea li-chip. "

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SK hynix e ikopanya le Bayer, Imec, MediaTek, Rolls-Royce, Saab le lik'hamphani tse ling tse ngata tsa malapeng le tsa machaba ho tliseng boqapi ho pelo ea Amerika. Setsi se secha - se nang le mohala o tsoetseng pele oa semiconductor o tla hlahisa li-chips tsa moloko o latelang oa "high-bandwidth memory" (HBM), e leng karolo ea bohlokoa ea likarolo tsa ts'ebetso ea lits'oants'o tse sebelisetsoang ho koetlisa lits'ebetso tsa AI joalo ka ChatGPT - e lebelletsoe ho fana ka ho feta. mesebetsi e mecha e sekete sebakeng sa toropo ea Lafayette, 'me k'hamphani e rera ho qala tlhahiso ea bongata halofong ea bobeli ea 2028. Morero ona o tšoaea SK Hynix's. matsete a nako e telele le tšebelisano 'moho sebakeng se seholo sa Lafayette. Moralo oa ho etsa liqeto oa k'hamphani o etelletsa pele phaello le boikarabello sechabeng ha o ntse o khothaletsa ts'ebetso ea boitšoaro le boikarabello. Ho tsoa ho nts'etsopele ea meaho e etsang hore phihlello ea lits'ebeletso e be bonolo haholoanyane bakeng sa mananeo a matlafatso ea sechaba joalo ka nts'etsopele ea litsebo le boeletsi, SK Advanced Packaging Manufacturing at hynix Marks A New Era of Collaborative Growth. "Indiana ke moetapele oa lefats'e oa boqapi le tlhahiso ho tsamaisa moruo oa bokamoso, 'me litaba tsa kajeno ke bopaki ba taba eo," ho boletse 'Musisi oa Indiana Eric Holcomb. "Ke motlotlo haholo ho amohela SK Hynix ka molao Indiana, 'me re lumela hore ts'ebelisano ena e ncha e tla ntlafatsa sebaka sa Lafayette-West Lafayette, Univesithi ea Purdue, le naha ea Indiana ka nako e telele. Setsi sena se secha sa semiconductor le ho paka ha se tiise feela boemo ba mmuso lekaleng la thekenoloji e thata, empa ke mohato o mong oa bohlokoa oa ho ntšetsa pele boqapi ba Amerika le polokeho ea naha, e beha Indiana ka pele ho nts'etsopele ea lehae le lefats'e. Ho tsetela ho Midwest le Indiana ho susumetsoa ke bokhabane ba Purdue ho sibolloeng le boqaping, hammoho le R&D e ikhethang le nts'etsopele ea litalenta e bileng teng ka tšebelisano. Likamano lipakeng tsa Univesithi ea Purdue, lekala la likhoebo, le mmuso le mebuso ea mmuso li bohlokoa ho nts'etsopele indasteri ea semiconductor ea US le ho theha sebaka seo joalo ka pelo ea silicon. "SK hynix ke pula-maliboho oa lefats'e le moetapele oa 'maraka oa li-memory chips bakeng sa bohlale ba maiketsetso," ho boletse Mopresidente oa Univesithi ea Purdue Myung-Kyun Kang. Letsete lena la phetoho le bonts'a matla a maholo a mmuso le yunivesithi ea rona ho li-semiconductors, hardware AI, le nts'etsopele ea liphaseje tse thata tsa theknoloji. Hape ke nako ea bohlokoa ea ho phethela phepelo ea naha ea rona bakeng sa moruo oa dijithale ka ho paka li-chips tse tsoetseng pele. E fumaneha Purdue Research Park, setsi sena se seholo ka ho fetisisa univesithing ea Amerika se tla thusa kholo ka boqapi. “Ka 1990, United States e ile ea hlahisa hoo e ka bang karolo ea 40 lekholong ea li-semiconductors tsa lefatše. Leha ho le joalo, ha tlhahiso e fetohetse ho Asia Boroa-bochabela le China, karolo ea Amerika ea matla a lefats'e a tlhahiso ea semiconductor e theohetse ho hoo e ka bang 12%. "SK Hynix haufinyane e tla ba lebitso la lehae Indiana," ho boletse Senator Todd Young oa US. “Letsete lena le makatsang le bonts'a ts'epo ea bona ho basebetsi ba Indiana, 'me ke thabetse ho ba amohela seterekeng sa rona. Molao oa CHIPS le SCIENCE o butse monyetla oa hore Indiana e kene kapele, 'me lik'hamphani tse kang SK Hynix li re thusa ho aha bokamoso ba rona ba theknoloji e phahameng. "Ho tlisa tlhahiso ea semiconductor haufi le hae le ho tsitsisa ketane ea phepelo ea lefats'e, Congress ea US e hlahisitse" Ho fana ka Litšusumetso tse Molemo bakeng sa Molao oa Tlhahiso ea Amerika ea Semiconductors Act (CHIPS and Science Act) ka Phuptjane 11, 2020. Bili e ne e saennoe ke Mopresidente Joe. Biden ka Phato 9, 2022, e ts'ehetsa nts'etsopele ea indasteri ea semiconductor ka kakaretso ka $280 bilione ea lichelete. E ts'ehetsa R&D ea semiconductor ea naha, tlhahiso, le ts'ireletso ea ketane ea phepelo. "Ha Mopresidente Biden a saena Molao oa CHIPS le Saense, o ile a kenya letsoho lefats'eng mme a romella lefats'e hore Amerika e tsotella tlhahiso ea semiconductor," ho boletse Arati Prabhakar, Moeletsi ea ka Sehloohong oa Saense le Theknoloji ho Mopresidente oa United States Joe Biden le Mookameli oa Ofisi ea White House ea Leano la Saense le Thekenoloji. Phatlalatso ea kajeno e tla matlafatsa tšireletso ea moruo le ea naha le ho theha mesebetsi e metle e tšehetsang mosebetsi oa lelapa. Ke kamoo re etsang lintho tse kholo Amerika. "Purdue Research Park ke e 'ngoe ea litsi tse kholo ka ho fetisisa tse amanang le univesithi naheng, tse kopanyang ho sibolloa le ho fana ka phihlello e bonolo ho litsebi tsa lefapha la semiconductor tsa Purdue, baithuti ba batloang haholo le lisebelisoa tse ngata tsa lipatlisiso tsa Purdue. Sebaka sa boikhathollo se boetse se fana ka phihlello e bonolo ea lipalangoang tsa basebetsi le li-semi-lori, metsotso e seng mekae ho tloha I-65.

Phatlalatso ena ea nalane ke mohato o latelang morerong o tsoelang pele oa Purdue oa bokhabane ba semiconductor e le karolo ea Morero oa Compute oa Purdue. Liphatlalatso tsa morao-rao li kenyelletsa tšebelisano ea maano ea Purdue's Integrated Semiconductor le Microelectronics Program le Dassault Systèmes ho ntlafatsa, ho potlakisa le ho fetola basebetsi ba semiconductor moetapele oa theknoloji ea Europe imec e bula setsi sa boqapi Univesithing ea Purdue Lenaneo la pele la naha le kopaneng la semiconductor degree ecosystem e ntle bakeng sa naha le naha Green2Gold, tšebelisano lipakeng tsa Ivy Tech Community College le Univesithi ea Purdue ho holisa basebetsi ba boenjiniere Indiana.

SK hynix, ntlo-kholo ea hae Korea Boroa, ke mofani oa thepa ea semiconductor ea maemo a holimo lefatšeng, e fanang ka li-memory memory chips (DRAM), flash memory chips (NAND flash) le CMOS image sensors (CIS) ho bareki ba tummeng lefatšeng ka bophara.

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Nako ea poso: Jul-09-2024
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