Lipheo tsa ho hlapali sebelisoa haholo indastering ea elektroniki le ea tlhahisoleseling, joalo ka lipotoloho tse kopaneng, polokelo ea tlhahisoleseling, lipontšo tsa kristale ea metsi, mehopolo ea laser, lisebelisoa tsa taolo ea elektroniki, joalo-joalo. thepa, mocheso o phahameng oa ho hanyetsa kutu , lihlahisoa tse khabisitsoeng tse phahameng le liindasteri tse ling.
Sputtering ke e 'ngoe ea mekhoa e ka sehloohong ea ho lokisetsa lisebelisoa tse tšesaane tsa filimi.E sebelisa li-ion tse hlahisoang ke mehloli ea ion ho potlakisa le ho bokellana ka har'a vacuum ho theha maballo a matla a lebelo le phahameng, ho phunya bokaholimo bo tiileng, le ho fapanyetsana matla a kinetic lipakeng tsa li-ion le liathomo tse tiileng tsa bokaholimo. Liathomo tse holim'a sebaka se tiileng li tloha ho tiileng 'me li behoa holim'a substrate. Seliba se bomotsoeng ke thepa e tala ea ho beha lifilimi tse tšesaane ka ho fafatsa, e bitsoang sputtering target. Mefuta e fapaneng ea lisebelisoa tsa lifilimi tse tšesaane e se e sebelisitsoe haholo lipotolohong tse kopaneng tsa semiconductor, mecha ea phatlalatso ea ho rekota, lipontšo tsa phanele e sephara le likoaelo tsa bokaholimo ba mosebetsi.
Har'a liindasteri tsohle tsa kopo, indasteri ea semiconductor e na le litlhoko tse thata ka ho fetisisa tsa boleng bakeng sa lifilimi tse hlabollang tse hlabollang. Ha re nka mohlala oa tlhahiso ea li-chip, re ka bona hore ho tloha sephakeng sa silicon ho ea ho chip, se hloka ho feta lits'ebetsong tse 7 tse kholo tsa tlhahiso, e leng diffusion (Thermal Process), Photo-lithography (Photo-lithography), Etch (Etch), Ion Implantation (IonImplant), Thin Film Growth (Dielectric Deposition), Chemical Mechanical Polishing (CMP), Metalization (Metalization) Mekhoa e lumellana ka bonngoe. Sepheo sa sputtering se sebelisoa ts'ebetsong ea "metallization". Sepheo se hlasetsoe ka likaroloana tse nang le matla a phahameng ka thepa e tšesaane ea ho beha filimi ebe ho thehoa lesela la tšepe le nang le mesebetsi e khethehileng holim'a sephaphatha sa silicon, joalo ka conductive layer, barrier layer. Emela.Kaha lits'ebetso tsa li-semiconductors kaofela li fapane, ho na le maemo a hlokahalang bakeng sa ho netefatsa hore sistimi e teng ka nepo, kahoo re batla mefuta e meng ea lisebelisoa tsa dummy methating e itseng ea tlhahiso ho netefatsa litlamorao.
Nako ea poso: Jan-17-2022