Sei uchida kuonda?

Muchikamu chekupedzisira chekugadzirisa, iyowafer (silicon waferine masekete kumberi) inoda kutetepa kumusana isati yatevera dicing, welding uye kurongedza kudzikisa pasuru yekukwira kureba, kuderedza chip package vhoriyamu, kuvandudza chip yekupisa kwekushisa kwekushanda, kushanda kwemagetsi, mashandiro emagetsi uye kuderedza huwandu hwe dicing. Kugaya kumashure kune zvakanakira kushanda kwepamusoro uye mutengo wakaderera. Yakatsiva iyo yechinyakare yekunyorova etching uye ion etching maitiro kuti ive yakanyanya kukosha kumashure yekutetepa tekinoroji.

Mucheka wakatetepa

Kuonda sei?

Main process ye wafer kuonda mune yechinyakare kurongedza maitiro

Matanho chaiwo ewaferkuonda ndiko kubatanidza chipfuro kuti chigadziriswe kufirimu iri kutetepa, wobva washandisa vacuum kushambadza firimu rakatetepa uye chip pairi kune porous ceramic wafer table, gadzirisa mukati nekunze denderedzwa bhoti mitsetse yepakati penzvimbo yekushanda. vhiri rekukuya dhaimani rakaita semukombe kusvika pakati pesilicon wafer, uye silicon wafer nevhiri rekukuya zvinotenderedza matemo kucheka-kukuya. Kukuya kunosanganisira matanho matatu: kugaya rough, kugaya zvakanaka uye polishing.

Iyo wafer inobuda mufekitori yewafer inogayiwa-kudzoreredzwa kutetepa kusvika pakukora kunodiwa pakurongedzerwa. Paunenge uchikuya chifukidziro, tepi inoda kuiswa kumberi (Active Area) kuchengetedza nzvimbo yedunhu, uye rutivi rwekumashure runogadzika panguva imwe chete. Mushure mekugaya, bvisa tepi uye uyere kukora.
Maitiro ekukuya ayo akabudirira kuiswa pasilicon wafer kugadzirira anosanganisira rotary tafura kugaya,silicon waferkutenderera kukuya, kukuya kumativi maviri, etc. Nekuwedzera kwekuvandudzwa kwepamusoro pezvinhu zvinodiwa zvekristal silicon wafers, hutsva hutsva hunogara huchirongedzerwa, dzakadai seTAIKO grinding, makemikari mechanical grinding, polishing grinding uye planetary disc grinding.

Rotary tafura kugaya:
Rotary tafura kugaya (rotary tafura kugaya) inguva yekutanga yekukuya inoshandiswa musilicon wafer kugadzirira uye kumashure kutetepa. Nheyo yaro inoratidzwa muMufananidzo 1. Zvipfeko zvesilicon zvakagadziriswa pamakapu ekusveta etafura inotenderera, uye inotenderera synchronously inotungamirirwa netafura inotenderera. Iwo masilicon wafers pachawo haatenderere akatenderedza axis yavo; vhiri rekukuya rinodyiswa axially richitenderera nekumhanya kukuru, uye dhayamita regumbo rekukuya rakakura kudarika dhayamita resilicon wafer. Kune marudzi maviri eku rotary tafura yekukuya: face plunge grinding uye face tangential grinding. Pakurovera kwechiso, hupamhi hwevhiri rekukuya hwakakura kupfuura silicon wafer dhayamita, uye vhiri rekukuya spindle rinodyisa zvichienderera mberi neaxial kwaro kusvika iyo yakawandisa yagadziriswa, uyezve silicon wafer inotenderedzwa pasi pedhiraivha yetafura inotenderera; mukutarisana nekukuya, vhiri rekukuya rinodyisa pamwe neaxial direction, uye silicon wafer inoramba ichitenderedzwa pasi pedhiraivha yedhisiki inotenderera, uye kukuya kunopedzwa nekudzoreredza kudyisa (kudzoreredza) kana kukambaira (creepfeed).

Mufananidzo 1, dhiyabhorosi dhiyagiramu yeinotenderera tafura yekukuya (face tangential) musimboti

Kuenzaniswa nenzira yekukuya, kugaya tafura kunotenderedza kune zvakanakira kubviswa kwakakwira, kukuvara kudiki kwepasi, uye nyore otomatiki. Nekudaro, iyo chaiyo yekukuya nzvimbo (inoshanda kugaya) B uye yakachekwa-mu angle θ (iyo kona iri pakati pedenderedzwa rekunze rekugaya uye denderedzwa rekunze resilicon wafer) mukukuya shanduko inoshanduka nekushandurwa kwenzvimbo yekucheka. yegumbo rekukuya, zvichikonzera simba rekukuya risina kugadzikana, zvichiita kuti zviome kuwana iyo yakakodzera yepamusoro yechokwadi (yakakwirira TTV kukosha), uye nyore kukonzera kukanganisa kwakadai sekudonha kwemucheto uye. kuparara kwemucheto. Iyo inotenderera tafura yekukuya tekinoroji inonyanya kushandiswa kugadzira imwe-crystal silicon wafers pazasi 200mm. Kuwedzera kwehukuru hwema-single-crystal silicon wafers kwaisa pamberi pepamusoro zvinodiwa kuti inyatso kurongeka uye kufamba kweiyo bhenji rekushandisa, saka kukuya kwetafura yekutenderera hakukodzere kukuya kwe-single-crystal silicon wafers pamusoro pe300mm.
Kuti uvandudze kugona kwekukuya, ndege yekutengesa tangential yekukuya michina inowanzo tora yakawanda-inogaya mavhiri chimiro. Semuenzaniso, seti yemavhiri ekukuya ane hutsinye uye seti yemavhiri ekukuya akashongedzerwa pamidziyo, uye tafura inotenderera inotenderedza denderedzwa kuti ipedze kukuya kwakakasharara uye kugaya zvakanaka. Iyi mhando yemidziyo inosanganisira G-500DS yeAmerican GTI Company (Mufananidzo 2).

Mufananidzo 2, G-500DS michina yekukuya tafura yeGTI Company muUnited States.

Silicon wafer kutenderera kukuya:
Kuti usangane nezvinodiwa zveyakakura-saizi silicon wafer kugadzirira uye kumashure kutetepa kugadzirisa, uye kuwana kurongeka kwepamusoro neiyo yakanaka TTV kukosha. Muna 1988, nyanzvi yeJapan Matsui akaronga nzira yesilicon wafer yekutenderera (in-feedgrinding). Nheyo yaro inoratidzwa muMufananidzo 3. The single crystal silicon wafer uye cup-shaped diamond grinding vhiri adsorbed pane workbench inotenderera kumativi ose ematemo avo, uye gumbo rinokuya rinoramba richidyiswa pamwe chete neaxial direction panguva imwe chete. Pakati pavo, iyo dhayamita yevhiri rekukuya yakakura kupfuura dhayamita yeyakagadziriswa silicon wafer, uye denderedzwa rayo rinopfuura nepakati pesilicon wafer. Kuti uderedze simba rekukuya uye kuderedza kupisa kwekukuya, iyo vacuum suction cup inowanzodimburwa kuita convex kana concave shape kana kona iri pakati pekukuya vhiri rekurunga uye yekuyamwa cup spindle axis inogadziriswa kuti ive nechokwadi chekukuya pakati pe vhiri rekukuya nesilicon wafer.

Mufananidzo 3, Schematic diagiramu yesilicon wafer rotary grinding musimboti

Kana tichienzanisa nekukuya tafura inotenderera, kukuya kwesilicon wafer inotenderera kune zvinotevera zvakanakira: ① Kukuya kamwe chete-kamwe-wafer kunogona kugadzira masizi mahombe esilicon pamusoro pe300mm; ② Nzvimbo chaiyo yekukuya B uye kona yekucheka θ inogara iripo, uye simba rekukuya rinenge rakagadzikana; ③ Nekugadzirisa kona yekuyeresa pakati pevhiri rekukuya axis uye silicon wafer axis, chimiro chepamusoro chekristaro chimwe chete chesilicon wafer chinogona kudzorwa zvine simba kuti chiwane kunaka kwechimiro chepamusoro. Pamusoro pezvo, nzvimbo yekugaya uye kona yekucheka θ yesilicon wafer rotary grinding ine zvakanakira kugaya kwakakura, kureruka kwepamhepo uye kuona uye kutonga kwemhando yepamusoro, compact michina chimiro, nyore-multi-station yakasanganiswa kugaya, uye yakakwirira kugaya.
Kuti uvandudze kushanda zvakanaka kwekugadzira uye kusangana nezvinodiwa zvemitsetse yekugadzira semiconductor, zvekutengesa zvekugaya zvichibva pamusimboti wesilicon wafer rotary grinding inotora multi-spindle multi-station chimiro, chinogona kupedzisa kugaya uye kugaya zvakanaka mukutakura uye kurodha. . Yakasanganiswa nezvimwe zvivakwa zvekubatsira, inogona kuona kugayiwa kwakazara kweimwe crystal silicon wafers "dry-in/dry-out" uye "cassette to cassette".

Kukuya-mativi maviri:
Kana iyo silicon wafer rotary kugaya ichiita nzvimbo dzepamusoro uye dzepasi dzesilicon wafer, iyo workpiece inoda kushandurwa uye kuitwa mumatanho, ayo anodzikamisa kushanda. Panguva imwecheteyo, silicon wafer rotary kugaya ine pamusoro pekukopa kukanganisa (kukopwa) uye kugaya mamaki (grindingmark), uye hazvigoneke kunyatso bvisa zvirema zvakaita sewaviness uye taper pamusoro peimwe crystal silicon wafer mushure mekucheka waya. (multi-saw), sezvinoratidzwa muMufananidzo 4. Kukunda kukanganisa pamusoro apa, teknolojia yekukuya yemativi maviri (doublesidegrinding) yakaonekwa 1990s, uye musimboti wayo unoratidzwa muMufananidzo 5. Zvisungo zvakagoverwa symmetrically kumativi ose maviri zvinosungirira imwe crystal silicon wafer mumhete inochengetedza uye inotenderera zvishoma nezvishoma ichityairwa neroller. Mavhiri maviri emukombe-akaumbwa nedhaimani ekukuya mavhiri anowanikwa pamativi ese eimwe crystal silicon wafer. Inotyairwa nemhepo ine electric spindle, inotenderera yakatarisana uye inodyisa axially kuti iwane kukuya kwakapetwa kaviri kweimwe crystal silicon wafer. Sezvinoonekwa kubva pamufananidzo, mativi maviri-kukuya anogona kunyatso bvisa waviness uye taper pamusoro peiyo imwechete crystal silicon wafer mushure mekucheka waya. Zvinoenderana nekurongeka kweiyo axis yekukuya vhiri, kukuya-mativi maviri kunogona kuve kwakachinjika uye kwakatwasuka. Pakati pazvo, kukuya kwakapetwa kaviri-mativi kukuya kunogona kunyatso kudzikisa pesvedzero yesilicon wafer deformation inokonzerwa nehuremu hwakafa hwesilicon wafer pamhando yekukuya, uye zviri nyore kuve nechokwadi kuti kugaya kwemamiriro ezvinhu pamativi ese eiyo imwe crystal silicon. wafer akafanana, uye zvimedu zvinoputika uye machipisi ekukuya hazvisi nyore kugara pamusoro peiyo imwechete crystal silicon wafer. Iyo inzira yakanaka yekukuya.

Mufananidzo 4, "Kukanganisa kopi" uye pfeka maremara musilicon wafer kutenderera kukuya

Mufananidzo 5, dhiyabhorosi dhayagiramu yekaviri-mativi ekukuya musimboti

Tafura 1 inoratidza kuenzanisa pakati pekukuya uye mativi maviri-kukuya kwemhando nhatu dziri pamusoro dzeimwe crystal silicon wafers. Kukuya-kumativi maviri kunonyanya kushandiswa kugadzira silicon wafer iri pasi pe200mm, uye kune goho rewafer. Nekuda kwekushandiswa kweakagadziriswa abrasive grinding mavhiri, kukuya kwe-single-crystal silicon wafers kunogona kuwana yakanyanya kunaka yepamusoro pane iyo yekukuya-mativi maviri. Naizvozvo, ese ari maviri silicon wafer rotary kugaya uye mativi maviri-kukuya anogona kusangana nekugadzirisa zvinodiwa zvemhando yepamusoro 300mm silicon wafers, uye parizvino ndiyo inonyanya kukosha nzira dzekugadzirisa. Paunenge uchisarudza silicon wafer flattening process process, zvinodikanwa kuti utarise zvizere zvinodikanwa zvehupamhi hwedhayamita, mhando yepamusoro, uye polishing wafer processing tekinoroji yeimwe-crystal silicon wafer. Iyo yekuseri kutetepa kwewafer inogona chete kusarudza imwe-sided nzira yekugadzirisa, senge silicon wafer rotary kugaya nzira.

Pamusoro pekusarudza nzira yekukuya musilicon wafer kugaya, zvinodikanwawo kuona kusarudzwa kweanonzwisisika maitiro paramita senge kudzvanywa kwakanaka, kukuya vhiri rezviyo saizi, kugaya vhiri binder, kugaya vhiri kumhanya, silicon wafer kumhanya, kugaya fluid viscosity uye. chiyero chekuyerera, nezvimwewo, uye sarudza nzira inonzwisisika yekuita. Kazhinji, nzira yakakamurwa yekukuya inosanganisira kukuya, semi-kupedza kugaya, kupedzisa kugaya, spark-isina kugaya uye inononoka kutsigira inoshandiswa kuwana imwechete crystal silicon wafers ine yakakwirira kugadzirisa kushanda zvakanaka, yakakwirira pamusoro flatness uye kuderera kwepasi kukuvara.

Tekinoroji nyowani yekukuya inogona kureva zvinyorwa:

Mufananidzo 5, dhiyabhorosi dhizaini yeTAIKO yekukuya musimboti

Mufananidzo 6, dhiyabhorosi dhizaini yepuraneti disk grinding musimboti

Ultra-yakaonda wafer kugaya kutetepa tekinoroji:
Pane wafer carrier grinding thinning technology uye edge grinding technology (Mufananidzo 5).