Munyika yakaoma ye tekinoroji yemazuva ano,zvimedu, inozivikanwawo sesilicon wafers, ndiyo yakakosha zvikamu zveiyo semiconductor indasitiri. Ndiwo hwaro hwekugadzira zvakasiyana-siyana zvemagetsi senge microprocessors, ndangariro, masensa, nezvimwewo, uye imwe neimwe wafer inotakura zvinogoneka zvisingaverengeki zvemagetsi zvikamu. Saka nei tichiwanzoona 25 wafers mubhokisi? Iko kune chaizvo kufunga kwesainzi uye hupfumi hwekugadzirwa kwemaindasitiri kuseri kweizvi.
Kuburitsa chikonzero nei paine 25 wafers mubhokisi
Kutanga, nzwisisa hukuru hwechingwa. Saizi dzewafesi dzakajairwa dzinowanzo 12 inches uye 15 inches, inova yekuenderana neyakasiyana michina yekugadzira uye maitiro.12-inch wafersparizvino ndiwo anonyanya kufarirwa nekuti anogona kugarisa mamwe machipisi uye ari pakati nepakati mumutengo wekugadzira uye kugona.
Nhamba "25 zvidimbu" haisi netsaona. Iyo yakavakirwa pane yekucheka nzira uye kurongedza kugona kwewafe. Mushure mega yega wafer yagadzirwa, inoda kucheka kuti igadzire akawanda akazvimirira machipisi. Kazhinji kutaura, a12-inch waferinogona kucheka mazana kana kunyange zviuru zvemachipisi. Nekudaro, kuti zvireruke manejimendi uye zvekufambisa, machipisi aya anowanzo kurongedzerwa mune imwe huwandu, uye zvidimbu makumi maviri neshanu isarudzo yakajairika yehuwandu nekuti haina kunyanyokurisa kana kunyanyokurisa, uye inogona kuvimbisa kugadzikana kwakakwana panguva yekufambisa.
Uye zvakare, huwandu hwezvikamu makumi maviri neshanu zvakare hunobatsira kune otomatiki uye optimization yemutsetse wekugadzira. Kugadzirwa kweBatch kunogona kuderedza mutengo wekugadzirisa wechidimbu chimwe chete uye kunatsiridza kugadzirwa kwakanaka. Panguva imwecheteyo, yekuchengetedza uye kutakura, bhokisi re 25-piece wafer iri nyore kushanda uye inoderedza dambudziko rekuputsika.
Zvakakosha kucherechedza kuti nekufambira mberi kwetekinoroji, zvimwe zvigadzirwa zvepamusoro-soro zvinogona kutora huwandu hukuru hwemapakeji, senge zvidimbu zana kana mazana maviri, kuti uenderere mberi nekuvandudza kugona kwekugadzira. Nekudaro, kune akawanda evatengi-giredhi uye epakati-renji zvigadzirwa, 25-chidimbu wafer bhokisi ichiri yakajairwa yakajairwa gadziriro.
Muchidimbu, bhokisi remawaferi rinowanzo kuve nezvidimbu makumi maviri neshanu, inova chiyero chinowanikwa neindasitiri yesemiconductor pakati pekuita basa rekugadzira, kudzora mutengo uye kugadzirisa zvinhu. Nekuenderera mberi kwekuvandudza tekinoroji, nhamba iyi inogona kugadziridzwa, asi iyo yekutanga logic kumashure kwayo - kugadzirisa maitiro ekugadzira uye kuvandudza mabhenefiti ehupfumi - haisati yachinja.
12-inch wafer machira anoshandisa FOUP neFOSB, uye 8-inch uye pazasi (kusanganisira 8-inch) shandisa Cassette, SMIF POD, uye wafer boat box, kureva, 12-inch.wafer carrierpamwe chete inonzi FOUP, uye iyo 8-inchwafer carrierpamwe chete inonzi Cassette. Kazhinji, FOUP isina chinhu inorema 4.2 kg, uye FOUP yakazadzwa ne25 wafer inorema 7.3 kg.
Zvinoenderana nekutsvagisa nehuwandu hwechikwata chekutsvaga cheQYResearch, kutengeswa kwemusika wepasi rose kwakasvika 4.8 bhiriyoni yuan muna 2022, uye inotarisirwa kusvika 7.7 bhiriyoni yuan muna 2029, iine musanganiswa wepagore kukura (CAGR) ye7.9%. Panyaya yemhando yechigadzirwa, semiconductor FOUP inotora chikamu chikuru chemusika wese, ingangoita 73%. Panyaya yekushandiswa kwechigadzirwa, iyo yakakura application ndeye 12-inch wafers, inoteverwa ne8-inch wafers.
Muchokwadi, kune akawanda marudzi ewafer anotakura, akadai seFOUP yekufambiswa kwewafer mumiti yekugadzira wafer; FOSB yekufambisa pakati pesilicon wafer kugadzirwa uye wafer kugadzira zvidyarwa; CASSETTE vatakuri vanogona kushandiswa kune inter-process yekufambisa uye kushandiswa pamwe chete nemaitiro.
Vhura CASSETTE
Vhura CASSETTE inonyanya kushandiswa mu-inter-process yekufambisa uye yekuchenesa maitiro mukugadzira wafer. Kufanana neFOSB, FOUP nemamwe anotakura, inowanzoshandisa zvinhu zvisingaite tembiricha, zvine hunyanzvi hwemuchina, kugadzikana kwedimensional, uye zvinogara, anti-static, yakaderera kunze-gassing, yakaderera kunaya, uye inodzokororwa. Yakasiyana saizi yewafer, process node, uye zvinhu zvakasarudzirwa maitiro akasiyana zvakasiyana. The general materials PFA, PTFE, PP, PEEK, PES, PC, PBT, PEI, COP, etc. Chigadzirwa chacho chinowanzogadzirwa nehukuru hwezvikamu makumi maviri neshanu.
Vhura CASSETTE inogona kushandiswa pamwe chete neinoenderanaWafer Cassettezvigadzirwa zvekuchengetera wafer uye zvekufambisa pakati pemaitiro ekudzikisa kusvibiswa kwewafer.
Vhura CASSETTE inoshandiswa pamwe chete neyakagadzirirwa Wafer Pod (OHT) zvigadzirwa, izvo zvinogona kuiswa kune otomatiki kutapurirana, otomatiki kuwana uye yakawanda yakavharwa kuchengetedza pakati pemaitiro mukugadzira wafer uye chip kugadzira.
Ehe, Vhura CASSETTE inogona kugadzirwa zvakananga kuita CASSETTE zvigadzirwa. Chigadzirwa Wafer Shipping Mabhokisi ane chimiro chakadaro, sezvakaratidzwa mumufananidzo uri pazasi. Iyo inogona kusangana nezvinodiwa zvewafer yekufambisa kubva kune wafer kugadzira zvidyarwa kuenda kune chip kugadzira zvidyarwa. CASSETTE uye zvimwe zvigadzirwa zvakatorwa kubva mairi zvinokwanisa kuzadzisa zvinodiwa zvekutapurirana, kuchengetedza uye kupindirana kwefekitari yekufambisa pakati pemaitiro akasiyana mumafekitori ewafer uye chip mafekitori.
Mberi Kuvhura Wafer Shipping Bhokisi FOSB
Front Opening Wafer Shipping Bhokisi FOSB inonyanya kushandiswa kutakura 12-inch wafers pakati pemafeki ekugadzira zvidyarwa uye chip kugadzira zvidyarwa. Nekuda kwehukuru hukuru hwewafers uye zvakakwirira zvinodiwa zvehutsanana; akakosha ekumisikidza zvidimbu uye shockproof dhizaini inoshandiswa kuderedza kusvibiswa kunogadzirwa newafer displacement friction; iyo mbishi inogadzirwa neakaderera-outgassing zvinhu, izvo zvinogona kuderedza njodzi yekubuda-gassing inosvibisa mawafer. Kuenzaniswa nemamwe mabhokisi ewafer ekufambisa, FOSB ine nani-kusimba kwemhepo. Uye zvakare, mune yekumashure-yekupedzisira yekurongedza mutsara fekitori, FOSB inogona zvakare kushandiswa kuchengetedza uye kutamisa mawafer pakati peakasiyana maitiro.
FOSB inowanzogadzirwa kuita zvidimbu makumi maviri neshanu. Pamusoro pekuchengetedza otomatiki uye kudzoreredza kuburikidza neiyo Automated Material Handling System (AMHS), inogona zvakare kushandirwa nemaoko.
Mberi Kuvhura Unified pod
Front Opening Unified Pod (FOUP) inonyanya kushandiswa kuchengetedza, kutakura uye kuchengetedza mawafer muFab fekitori. Iyo yakakosha mutakuri mudziyo weiyo automated conveying system mu 12-inch wafer fekitori. Basa rayo rinonyanya kukosha ndere kuona kuti ese makumi maviri neshanu mawafer anodzivirirwa nawo kuti asasvibiswa neguruva munzvimbo yekunze panguva yekufambisa pakati pemuchina wega wega wekugadzira, zvichikanganisa goho. Imwe neimwe FOUP ine mahwendefa akasiyana-siyana ekubatanidza, mapini nemakomba kuitira kuti FOUP iri pachiteshi chekutakura uye inoshandiswa neAMHS. Inoshandisa yakaderera kunze-gassing zvinhu uye yakaderera mwando absorption zvinhu, izvo zvinogona zvakanyanya kuderedza kuburitswa kwe organic komisheni uye kudzivirira kusvibiswa kwewafer; panguva imwe chete, iyo yakanakisa yekuisa chisimbiso uye inflation basa inogona kupa yakaderera humidity nharaunda yewafer. Pamusoro pezvo, FOUP inogona kugadzirwa nemhando dzakasiyana, senge tsvuku, orenji, dema, pachena, nezvimwewo, kusangana nezvinodiwa zvemaitiro uye kusiyanisa maitiro akasiyana uye maitiro; kazhinji, FOUP inogadziriswa nevatengi zvinoenderana nemutsara wekugadzira uye misiyano yemuchina weFab fekitori.
Pamusoro pezvo, POUP inogona kugadzirwa kuita zvigadzirwa zvakakosha zvevagadziri vekurongedza zvinoenderana nematanho akasiyana seTSV neFAN OUT mune chip back-end packaging, senge SLOT FOUP, 297mm FOUP, nezvimwe. FOUP inogona kushandiswazve, uye hupenyu hwayo pakati pemakore 2-4. Vagadziri veFOUP vanogona kupa zvigadzirwa zvekuchenesa masevhisi kusangana neyakasvibiswa zvigadzirwa kuti zvishandiswe zvakare.
Contactless Horizontal Wafer Shippers
Contactless Horizontal Wafer Shippers anonyanya kushandiswa kutakura akapedzwa wafers, sezvakaratidzwa mumufananidzo uri pazasi. Bhokisi rekutakura reEntegris rinoshandisa mhete yekutsigira kuti ive nechokwadi chekuti mawaferi haabatane panguva yekuchengetedza uye yekufambisa, uye ane chisimbiso chakanaka kudzivirira kusvibiswa kwetsvina, kupfeka, kudhumhana, kukwenya, degassing, etc. Chigadzirwa chacho chinonyanya kukodzera Thin 3D, lens kana mabumped wafers, uye nzvimbo dzayo dzekushandisa dzinosanganisira 3D, 2.5D, MEMS, LED uye simba semiconductors. Chigadzirwa chacho chine mhete dzekutsigira makumi maviri nenhanhatu, iine wafer inokwana makumi maviri neshanu (ine ukobvu hwakasiyana), uye saizi yewafer inosanganisira 150mm, 200mm uye 300mm.
Nguva yekutumira: Jul-30-2024