A waferinofanirwa kupfuura nekuchinja katatu kuti ive chaiyo semiconductor chip: kutanga, iyo block-shaped ingot inochekwa kuita wafers; muchiitiko chechipiri, ma transistors akanyorwa pamberi pechifukidzo kuburikidza nemaitiro apfuura; pakupedzisira, kurongedza kunoitwa, ndiko kuti, kuburikidza nenzira yekucheka, iyowaferinova yakakwana semiconductor chip. Zvinogona kuoneka kuti kurongedza maitiro ndeyekumashure-yekupedzisira maitiro. Mukuita uku, wafer inochekwa kuita akati wandei hexahedron munhu machipisi. Iyi nzira yekuwana yakazvimirira machipi inonzi "Singulation", uye maitiro ekuona bhodhi rewafer mumacuboids akazvimirira anonzi "wafer cut (Die Sawing)". Munguva pfupi yapfuura, nekuvandudzwa kwesemiconductor kubatanidzwa, ukobvu hwezvimeduyave yakaonda uye yakaonda, izvo zvechokwadi zvinounza kuoma kwakawanda kune "singulation" maitiro.
Iko kushanduka kwewafer dicing
Kumberi-kumagumo uye kumashure-kumashure maitiro akavepo kuburikidza nekudyidzana munzira dzakasiyana siyana: shanduko yemashure-yekupedzisira maitiro anogona kuona chimiro uye chinzvimbo cheiyo hexahedron madiki machipisi akaparadzaniswa kubva kufa pane.wafer, pamwe chete nekugadzirisa uye nzvimbo yemapadhi (magwara ekubatanidza magetsi) pamucheka; pane zvinopesana, kushanduka kwemaitiro ekupedzisira-mberi kwakashandura nzira uye nzira yewaferkumashure kuonda uye "kufa dicing" mumashure-ekupedzisira maitiro. Naizvozvo, iyo inowedzera kuomarara kutaridzika kwepakeji ichave nemhedzisiro yakakura pane yekumashure-yekupedzisira maitiro. Uyezve, iyo nhamba, maitiro uye rudzi rwekudhiza ichachinjawo zvinoenderana nekuchinja mukutaridzika kwepakeji.
Scribe Dicing
Mumazuva ekutanga, "kutyora" nekushandisa simba rekunze ndiyo chete nzira yekudhiza yaigona kupatsanurawafermuhexahedron inofa. Zvisinei, iyi nzira ine zvipingamupinyi zvekucheka kana kuputika kwemucheto wediki chip. Mukuwedzera, sezvo mabhura ari pamusoro pesimbi asina kubviswa zvachose, iyo yakachekwa yakachekwa zvakare yakaoma kwazvo.
Kuti ugadzirise dambudziko iri, nzira yekucheka "Scribing" yakatanga, ndiko kuti, isati "yaputsika", pamusoro pewaferinochekwa kusvika hafu yekudzika. “Kunyora”, sezvinoratidzwa nezita racho, zvinoreva kushandisa chinofemesa kuona (hafu-cheka) rutivi rwemberi rwechingwa pachine nguva. Mumazuva ekutanga, mawafer akawanda ari pasi pe 6 inches akashandisa nzira iyi yekucheka yekutanga "kucheka" pakati pemachipisi uyezve "kupwanya".
Blade Dicing kana Blade Sawing
Nzira ye "Scribing" yekucheka zvishoma nezvishoma yakatanga kuva "Blade dicing" yekucheka (kana sawing), iyo nzira yekucheka uchishandisa blade kaviri kana katatu mumutsara. Iyo "Blade" yekucheka nzira inogona kugadziridza chiitiko chediki machipisi anoputika kana "kutyoka" mushure me "scribing", uye anogona kudzivirira madiki machipisi panguva ye "singulation" maitiro. Kucheka kwe "blade" kwakasiyana necheka "dicing" yapfuura, ndiko kuti, mushure mekucheka kwe "blade", haisi "kuputsa", asi kucheka zvakare nemucheka. Nokudaro, inonziwo "step dicing" nzira.
Kuti udzivirire mucheka kubva pakukuvadza kwekunze panguva yekucheka, firimu ichashandiswa kune yakasvibiswa nguva isati yasvika kuti ive nechokwadi chekuchengetedza "singling". Munguva ye "back grinding" process, iyo firimu ichabatanidzwa pamberi pechifukidziro. Asi pane zvinopesana, mu "blade" yekucheka, iyo firimu inofanira kusungirirwa kumashure kwechingwa. Munguva ye eutectic kufa bonding (kufa bonding, kugadzirisa akapatsanurwa machipisi paPCB kana yakamisikidzwa furemu), firimu rakanamirwa kumusana rinobva radonha. Nekuda kwekukweshana kukuru panguva yekucheka, DI mvura inofanirwa kupfapfaidzwa nguva dzose kubva kumativi ese. Mukuwedzera, iyo impeller inofanira kusungirirwa nedhaimondi particles kuitira kuti zvimedu zvigove zviri nani. Panguva ino, kuchekwa (blade ukobvu: groove width) inofanira kunge yakafanana uye haifaniri kudarika hupamhi hwegorofu.
Kwenguva refu, kusona kwave kuri kunyanyo shandiswa kwechinyakare nzira yekucheka. Kubatsira kwayo kukuru ndeyekuti inokwanisa kucheka nhamba yakakura yewafers munguva pfupi. Nekudaro, kana kukurumidza kwekudya kwechimedu kwakawedzera zvakanyanya, mukana wechiplet edge peeling uchawedzera. Nokudaro, nhamba yekutenderera kwe impeller inofanira kudzorwa kanenge ka30,000 paminiti. Zvinogona kuonekwa kuti teknolojia ye semiconductor process inowanzova chakavanzika chakaunganidzwa zvishoma nezvishoma kuburikidza nenguva yakareba yekuunganidza uye kuedza uye kukanganisa (muchikamu chinotevera pamusoro pe eutectic bonding, tichakurukura zvinyorwa pamusoro pekucheka uye DAF).
Dicing usati wakuya (DBG): kucheka kutevedzana kwakachinja nzira
Kana kucheka kweblade kuchiitwa pane 8-inch dhayamita wafer, hapana chikonzero chekunetseka nezve chiplet edge kupeuka kana kuputika. Asi sezvo dhayamita rewafer richiwedzera kusvika 21 inches uye ukobvu hunoita hutete zvakanyanya, kusvuuka nekutsemuka kunotanga kuoneka zvakare. Kuti uderedze zvakanyanya kukanganiswa kwemuviri pamucheka panguva yekucheka, nzira yeDBG ye "dicing isati yakuya" inotsiva tsika yekucheka kutevedzana. Kusiyana neyechinyakare "blade" yekucheka nzira inoramba ichicheka, DBG inotanga kuita "blade" kucheka, uye zvishoma nezvishoma inotetepa kukora kwewaferi nekuramba ichitetepa kuseri kusvika chip chapatsanurwa. Zvinogona kutaurwa kuti DBG ishanduro yakagadziridzwa yeiyo yapfuura "blade" yekucheka nzira. Nekuti inogona kuderedza kukanganisa kwechipiri chekucheka, nzira yeDBG yakakurumidza kufarirwa mu "wafer-level packaging".
Laser Dicing
Iyo wafer-level chip scale package (WLCSP) maitiro anonyanya kushandisa laser kucheka. Kucheka kweLaser kunogona kuderedza zviitiko zvakadai sekupenengura uye kutsemuka, nekudaro kuwana machipisi emhando yepamusoro, asi kana hutete hwewaferi hwadarika 100μm, kugadzirwa kuchaderedzwa zvakanyanya. Naizvozvo, inonyanya kushandiswa pazvimedu zvine ukobvu husingasviki 100μm (zvakati nhete). Laser yekucheka inocheka silicon nekuisa yakakwirira-simba laser kune wafer's munyori groove. Nekudaro, kana uchishandisa yakajairwa laser (Conventional Laser) yekucheka nzira, firimu rekudzivirira rinofanira kuiswa kune wafer pamusoro pepamberi. Nekuda kwekudziya kana kudhiza pamusoro pewafer nelaser, aya mabatiro emuviri anoburitsa grooves pamusoro peiyo wafer, uye zvimedu zvakachekwa zvesilicon zvinonamatirawo pamusoro. Zvinogona kuoneka kuti iyo yechinyakare laser yekucheka nzira zvakare inocheka zvakananga pamusoro peiyo wafer, uye mune izvi, yakafanana neye "blade" yekucheka nzira.
Stealth Dicing (SD) inzira yekutanga kucheka mukati mewafer nelaser simba, wobva waisa kumanikidza kwekunze kune tepi inonamirwa kumashure kuti iparadze, nekudaro ichipatsanura chip. Kana kudzvinyirirwa kunoshandiswa kune tepi kumusana, chifukidziro chichasimudzwa pakarepo kumusoro nekuda kwekutambanudza tepi, nokudaro kuparadzanisa chip. Zvakanakira SD pamusoro pechinyakare laser yekucheka nzira ndeiyi: chekutanga, hapana silicon tsvina; chechipiri, kerf (Kerf: hupamhi hwemunyori groove) yakamanikana, saka mamwe machipisi anogona kuwanikwa. Uye zvakare, iyo peeling uye kupaza chiitiko chinozoderedzwa zvakanyanya uchishandisa iyo SD nzira, iyo yakakosha kune iyo yese mhando yekucheka. Naizvozvo, iyo SD nzira ingangove yakanyanya kufarirwa tekinoroji mune ramangwana.
Plasma Dicing
Plasma yekucheka tekinoroji ichangobva kugadzirwa iyo inoshandisa plasma etching kucheka panguva yekugadzira (Fab) maitiro. Plasma yekucheka inoshandisa semi-gasi zvinhu pachinzvimbo chezvinwiwa, saka kukanganisa kwezvakatipoteredza kudiki. Uye nzira yekucheka chifukidziro chose panguva imwe inogamuchirwa, saka "kucheka" kukurumidza kunokurumidza. Nekudaro, iyo nzira yeplasma inoshandisa makemikari reaction gasi seyakagadzirwa, uye iyo etching maitiro akaomesesa, saka maitiro ayo ekuyerera anonetsa. Asi kana tichienzanisa ne "blade" kucheka uye kucheka kwelaser, kucheka kweplasma hakukonzere kukuvadza kune wafer pamusoro, nekudaro kudzikisa chiyero chekuremara uye kuwana mamwe machipisi.
Munguva ichangopfuura, sezvo kukora kwewaferi kwakaderedzwa kusvika 30μm, uye yakawanda yemhangura (Cu) kana yakaderera dielectric zvinogara zvinhu (Low-k) inoshandiswa. Naizvozvo, kuitira kudzivirira burrs (Burr), nzira dzekucheka plasma dzichafarirwawo. Ehe, tekinoroji yekucheka plasma iri kuramba ichikura. Ndinotenda kuti munguva pfupi iri kutevera, rimwe zuva hakuzove nekudikanwa kwekupfeka maski yakakosha paunenge uchiisa, nekuti iyi ndiyo huru yekuvandudza kutungamira kwekucheka kweplasma.
Sezvo ukobvu hwemawafer hwave huchiramba huchideredzwa kubva pa100μm kusvika 50μm uyezve kusvika 30μm, nzira dzekucheka dzekuwana machipisi akazvimirira dzave dzichichinja uye dzichikura kubva ku "kupwanya" uye "blade" kucheka kune laser kucheka uye plasma kucheka. Kunyange zvazvo nzira dzekucheka dziri kuwedzera dzakawedzera mari yekugadzira yekucheka pachayo, kune rumwe rutivi, nekuderedza zvakanyanya zvinhu zvisingadikanwi zvakadai sekuputika uye kuputika zvinowanzoitika mu semiconductor chip cutting uye kuwedzera nhamba yemachipisi anowanikwa pane imwe unit wafer. , mutengo wekugadzirwa kwechipi chimwe chete wakaratidza kuderera. Ehezve, kuwedzera kwehuwandu hwemachipisi anowanikwa pane imwe unit nzvimbo yewaferi ane hukama zvakanyanya nekudzikiswa kwehupamhi hwemugwagwa we dicing. Uchishandisa kucheka kweplasma, ingangoita 20% mamwe machipisi anogona kuwanikwa kana achienzaniswa nekushandisa "blade" yekucheka nzira, chiri zvakare chikonzero chikuru nei vanhu vachisarudza plasma yekucheka. Nekuvandudzwa uye shanduko yewafers, chitarisiko chechip uye nzira dzekurongedza, nzira dzakasiyana dzekucheka senge wafer processing tekinoroji uye DBG zvakare iri kubuda.
Nguva yekutumira: Oct-10-2024