Chii chinonzi planarization mechanism yeCMP?

Dual-Damascene inzira tekinoroji inoshandiswa kugadzira simbi inobatana mumaseketi akabatanidzwa. Iko kumwe kusimudzira kwemaitiro eDhamasiko. Nekuumba kuburikidza nemakomba uye grooves panguva imwechete mune imwechete nhanho nhanho uye nekuizadza nesimbi, iyo yakabatanidzwa kugadzirwa kwesimbi interconnects inowanikwa.

Nei ichinzi Dhamasiko?

Guta reDhamasiko ndiro guta guru reSyria, uye minondo yeDhamasiko yakakurumbira nokuda kwokupinza uye magadzirirwo awo akanaka. Rudzi rweinlay process inodiwa: kutanga, iyo pateni inodiwa inotemerwa pamusoro peDhamasiko simbi, uye zvinhu zvakafanogadzirirwa zvakaiswa zvakasimba mumigero yakavezwa. Mushure mokunge inlay yapera, nzvimbo yacho inogona kunge isina kuenzana. Mhizha inoikwenenzvera kuti ive nechokwadi chekutsvedzerera kwese. Uye iyi maitiro ndiyo prototype yehuviri Dhamasiko maitiro echip. Kutanga, grooves kana maburi akanyorwa mu dielectric layer, uye ipapo simbi inozadzwa mavari. Mushure mekuzadza, simbi yakawandisa ichabviswa ne cmp.

Matanho makuru eiyo mbiri damascene maitiro anosanganisira:

▪ Kuiswa kwedielectric layer:

Deposit layer ye dielectric material, senge silicon dioxide (SiO2), pane semiconductor.wafer.

▪ Photolithography kutsanangura patani:

Shandisa photolithography kutsanangura maitiro e vias uye migero pane dielectric layer.

▪Etching:

Chinja pateni ye vias uye migero kune dielectric layer kuburikidza neyakaoma kana kunyorova etching process.

▪ Kuiswa kwesimbi:

Deposit simbi, yakadai semhangura (Cu) kana aruminiyamu (Al), mu vias uye migero kuumba simbi inobatana.

▪ Chemical mechanical polishing:

Kemikari mechanical polishing yesimbi pamusoro kubvisa simbi yakawandisa uye flatten pamusoro.

Kuenzaniswa neyechinyakare simbi yekubatanidza yekugadzira maitiro, iyo mbiri damascene maitiro ane zvinotevera zvakanakira:

▪Matanho ekuita akareruka:nokuumba vias uye migero panguva imwe chete muitiro danho, muitiro matanho uye kugadzira nguva inoderedzwa.

▪Kuvandudzwa kwekugadzira zvinhu:nekuda kwekuderedzwa kwematanho ekuita, iyo mbiri damascene process inogona kuvandudza kugadzira kwekugadzira uye kuderedza mutengo wekugadzira.

▪Kunatsiridza kushanda kwesimbi dzinobatanidza:iyo mbiri damascene process inogona kuwana yakamanikana simbi yekubatanidza, nekudaro ichivandudza kubatanidzwa uye kuita kwemaseketi.

▪Deredzai parasitic capacitance uye kuramba:kuburikidza nekushandisa yakaderera-k dielectric zvinhu uye optimizing chimiro chesimbi chinobatana, parasitic capacitance uye kuramba inogona kuderedzwa, kuvandudza kukurumidza uye kushandiswa kwesimba kushanda kwemaseketi.