Waferkucheka ndechimwe chezvakakosha zvinongedzo musimba semiconductor kugadzirwa. Iyi nhanho yakagadzirirwa kunyatsoparadzanisa munhu akabatanidzwa maseketi kana machipisi kubva kune semiconductor wafers.
Kiyi yekutiwaferkucheka ndiko kukwanisa kupatsanura machipisi ega ega uchiona kuti zvimiro zvakatetepa uye maseketi akaiswa mukati.waferhazvina kukuvara. Kubudirira kana kukundikana kwekucheka kwekucheka hakusi kungokanganisa kupatsanurwa kwehutano uye chibereko chechip, asiwo zvakananga zvakananga nekubudirira kwemaitiro ose ekugadzira.
▲ Mhando nhatu dzakajairika dzekucheka kwewafa | Kunobva: KLA CHINA
Parizvino, the commonwafernzira dzekucheka dzakakamurwa kuita:
Kucheka kweblade: mutengo wakaderera, unowanzo shandiswa kukorazvimedu
Laser kucheka: mutengo wakakwira, unowanzo shandiswa kune zvimedu zvine ukobvu hunodarika 30μm
Plasma yekucheka: mutengo wakakwira, zvimwe zvirambidzo, zvinowanzo shandiswa zvimedu zvine ukobvu husingasviki 30μm.
Mechanical blade kucheka
Kucheka kweblade inzira yekucheka uchitevedza mutsara wevanyori nedhisiki yepamusoro inotenderera ichikuya dhisiki (blade). Iyo blade inowanzo gadzirwa neabrasive kana Ultra-yakatetepa madhaimani zvinhu, yakakodzera kucheka kana grooving pasilicon wafers. Nekudaro, senzira yekucheka yemakanika, kucheka blade kunovimba nekubviswa kwezvinhu zvenyama, izvo zvinogona kutungamira nyore kupeta kana kuputika kweiyo chip edge, zvichikanganisa kunaka kwechigadzirwa uye kuderedza goho.
Hunhu hwechigadzirwa chekupedzisira chinogadzirwa ne mechanical sawing process inobatwa neakawanda paramita, kusanganisira kumhanya kwekucheka, ukobvu hweblade, blade dhayamita, uye blade kutenderera kumhanya.
Kucheka kwakazara ndiyo inonyanya kukosha yekucheka blade nzira, iyo inocheka zvachose workpiece nekucheka kune yakagadziriswa (yakadai se slicing tape).
▲ Mechanical blade yekucheka-yakazara kucheka | Image source network
Half cut inzira yekugadzira iyo inoburitsa groove nekucheka kusvika pakati peworkpiece. Nekuenderera mberi nekuita grooving process, muzinga nemapoinzi akaita tsono anogona kugadzirwa.
▲ Mechanical blade yekucheka-hafu yekucheka | Image source network
Kucheka kaviri inzira yekugadzira iyo inoshandisa kaviri slicing saha ine maspindle maviri kuita azere kana hafu kucheka pamitsetse miviri yekugadzira panguva imwe chete. Saha yekucheka kaviri ine matemo maviri ekuruka. High throughput inogona kuwanikwa kuburikidza nekuita uku.
▲ Mechanical blade yekucheka-kaviri kucheka | Image source network
Nhanho yekucheka inoshandisa kaviri slicing saha ine maspindle maviri kuita yakazara nehafu kucheka mumatanho maviri. Shandisa mablades akagadziridzwa kucheka wiring layer pamusoro pewafer uye mashizha akagadziridzwa kune yasara silicon imwe crystal kuti iwane yakakwirira-mhando yekugadzirisa.
▲ Mechanical blade kucheka - kucheka nhanho | Image source network
Bevel yekucheka inzira yekugadzira iyo inoshandisa blade ine V-yakaita mupendero pahafu-yakachekwa kumucheto kucheka wafer mumatanho maviri panguva yekucheka nhanho. Iyo chamfering process inoitwa panguva yekucheka. Naizvozvo, kusimba kwemhando yepamusoro uye yemhando yepamusoro yekugadzirisa inogona kuwanikwa.
▲ Mechanical blade kucheka - bevel kucheka | Image source network
Laser kucheka
Laser yekucheka ndeye isingabatanidzwe wafer yekucheka tekinoroji inoshandisa yakatariswa laser danda kuparadzanisa munhu machipisi kubva semiconductor wafers. Iyo yakakwira-simba laser danda inotariswa pamusoro peiyo wafer uye inoputika kana kubvisa zvinhu pamwe neyakatemerwa yekucheka mutsara kuburikidza neablation kana kupisa kwekuora maitiro.
▲ Laser yekucheka dhayagiramu | Mufananidzo kunobva: KLA CHINA
Mhando dzemalaser ari kushandiswa zvakanyanya anosanganisira ultraviolet lasers, infrared lasers, uye femtosecond lasers. Pakati pavo, ma ultraviolet lasers anowanzo shandiswa pakunyatso kutonhora ablation nekuda kweiyo yakakwira photon simba, uye iyo inopisa-yakakanganiswa nzvimbo idiki zvakanyanya, iyo inogona kunyatso kudzikisa njodzi yekupisa kwekukuvara kwewafer uye machipisi ayo akatenderedza. Infrared lasers inokodzera zvirinani kune akakora wafer nekuti anogona kupinda zvakadzika mukati mezvinhu. Femtosecond lasers inowana yakakwirira-chaiyo uye inoshanda kubviswa kwezvinhu pamwe neinoregeredza kupisa kutamisa kuburikidza ne Ultrashort light pulses.
Laser kucheka kune zvakakosha zvakanakira pamusoro pechinyakare blade kucheka. Chekutanga, senge isiri-yekubata maitiro, laser yekucheka haidi kudzvanywa kwemuviri pane wafer, kudzikisa kutsemuka uye kutsemuka matambudziko akajairika mukucheka mechanika. Iyi ficha inoita kuti laser yekucheka inonyanya kukodzera kugadzirisa isina kusimba kana yekupedzisira-yakaonda mawafers, kunyanya ayo ane akaomarara zvimiro kana yakanaka maficha.
▲ Laser yekucheka dhayagiramu | Image source network
Uye zvakare, iko kurongeka kwepamusoro uye kurongeka kwekucheka kwelaser kunoita kuti itarise danda relaser kune yakanyanya diki nzvimbo saizi, inotsigira yakaoma kucheka mapatani, uye kuwana kupatsanurwa kwediki nzvimbo pakati pemachipisi. Iyi ficha inonyanya kukosha kune epamberi semiconductor zvishandiso zvine saizi inodzikira.
Nekudaro, laser yekucheka zvakare ine zvimwe zvinogumira. Kuenzaniswa nekucheka blade, inononoka uye inodhura, kunyanya mukugadzirwa kwakakura. Uye zvakare, kusarudza iyo chaiyo laser mhando uye optimize paramita kuti ive nechokwadi chekubvisa zvinhu zvakanaka uye kushoma-yakakanganiswa nzvimbo inogona kunetsa kune zvimwe zvinhu uye ukobvu.
Laser ablation yekucheka
Munguva yekucheka kwelaser ablation, danda relaser rinonyatso kutariswa pane yakatsanangurwa nzvimbo pamusoro peiyo wafer, uye iyo laser simba inotungamirwa zvinoenderana neyakafanotemerwa yekucheka pateni, zvishoma nezvishoma ichicheka kuburikidza newafer kusvika pasi. Zvichienderana nezvinodiwa zvekucheka, kuvhiyiwa uku kunoitwa uchishandisa pulsed laser kana inoenderera wave laser. Kuti udzivise kukuvadzwa kwewafer nekuda kwekunyanya kupisa kwenzvimbo kwelaser, mvura inotonhorera inoshandiswa kutonhorera pasi uye kudzivirira wafer kubva mukupisa kwemoto. Panguva imwecheteyo, mvura inotonhorera inogonawo kubvisa zvinobudirira zvimedu zvinogadzirwa panguva yekucheka, kudzivirira kusvibiswa uye kuve nechokwadi chekucheka.
Laser asingaoneki kucheka
Iyo laser inogona zvakare kutariswa kuendesa kupisa mumuviri mukuru wewafer, nzira inonzi "invisible laser cutting". Kune iyi nzira, kupisa kubva kune laser kunogadzira mapundu mumigwagwa yevanyori. Idzi nzvimbo dzisina simba dzinobva dzawana mhedzisiro yakafanana yekupinda nekutyora kana wafer yakatambanudzwa.
▲Main process ye laser isingaonekwe yekucheka
Iyo isingaonekwe yekucheka maitiro ndeyemukati absorption laser process, pane laser ablation uko laser inonyudzwa pamusoro. Nekucheka kusingaonekwe, laser beam simba rine wavelength iri semi-pachena kune wafer substrate zvinhu zvinoshandiswa. Maitiro acho akakamurwa kuita nhanho mbiri huru, imwe ndeye laser-based process, uye imwe yacho ndeyemakanika yekuparadzanisa maitiro.
▲ Laser beam inogadzira peforation pazasi pewafer surface, uye mativi epamberi neshure haakanganisike | Image source network
Munhanho yekutanga, sezvo laser beam inoongorora wafer, danda relaser rinotarisa pane imwe nzvimbo mukati mewafer, richigadzira nzvimbo yekutsemuka mukati. Simba resimbi rinokonzera kutsemuka kwakatevedzana kuumba mukati, izvo zvisati zvatambanudzwa kuburikidza nehupamhi hwese hwewafa kusvika kumusoro uye pasi.
▲Kuenzaniswa kwe100μm gobvu silicon wafers akachekwa neblade nzira uye laser asingaoneki yekucheka nzira | Image source network
Munhanho yechipiri, iyo chip tepi pazasi pechifukidziro inowedzerwa mumuviri, izvo zvinokonzeresa kusagadzikana mukutsemuka mukati mewafer, ayo anokonzereswa mune laser process mudanho rekutanga. Kushushikana uku kunoita kuti mitswe iwedzere yakatwasuka kune yepamusoro nepasi penzvimbo yewaferi, yobva yapatsanura chipfuko kuita machipisi pamwe chete nenzvimbo idzi dzekucheka. Mukucheka kusingaonekwe, hafu-kucheka kana pasi-parutivi hafu-kucheka kunowanzo kushandiswa kufambisa kupatsanurwa kwemawafer kuita machipisi kana machipisi.
Mabhenefiti akakosha easingaonekwe laser yekucheka pamusoro pelaser ablation:
• Hapana chinotonhorera chinodiwa
• Hapana marara anogadzirwa
• Hapana nzvimbo dzakakanganiswa nekupisa dzinogona kukuvadza maseketi anonzwa
Plasma kucheka
Plasma yekucheka (inozivikanwawo seplasma etching kana yakaoma etching) tekinoroji yepamberi yekucheka tekinoroji inoshandisa reactive ion etching (RIE) kana yakadzika reactive ion etching (DRIE) kuparadzanisa machipisi ega kubva kune semiconductor wafers. Iyo tekinoroji inowana kucheka nekubvisa makemikari zvinhu pamwe neakatemerwa mitsara yekucheka uchishandisa plasma.
Munguva yekucheka kweplasma, iyo semiconductor wafer inoiswa mukamuri yevacuum, inodzorwa inogadziriswa gasi musanganiswa inounzwa mukamuri, uye munda wemagetsi unoshandiswa kugadzira plasma ine yakanyanya kuwanda kweiyo reactive ion uye radicals. Aya mapeji ezvimedu anodyidzana newafer material uye achisarudza kubvisa wafer zvinhu zvichitevedza mutsara wevanyori kuburikidza nemusanganiswa wemakemikari reaction uye sputtering.
Kunyanya mukana wekucheka kweplasma ndeyekuti inoderedza kushushikana kwemagetsi pane wafer uye chip uye inoderedza kukuvara kunokonzerwa nekusangana kwemuviri. Nekudaro, maitiro aya akanyanya kuomarara uye anotora nguva kupfuura dzimwe nzira, kunyanya kana uchibata neakakora wafers kana zvinhu zvine high etching resistance, saka kushandiswa kwayo mukugadzirwa kwemazhinji kunogumira.
▲Mufananidzo sosi network
Mukugadzira semiconductor, iyo wafer yekucheka nzira inoda kusarudzwa zvichienderana nezvakawanda zvinhu, zvinosanganisira wafer zvinhu zvivakwa, chip size uye geometry, inodiwa iko kurongeka uye kurongeka, uye mutengo wakazara wekugadzira uye kushanda nesimba.
Nguva yekutumira: Sep-20-2024