Semiconductor process flow-Ⅱ

Kugamuchirwa kune webhusaiti yedu yeruzivo rwechigadzirwa uye kubvunzana.

Webhusaiti yedu:https://www.vet-china.com/

Etching yePoly uye SiO2:
Mushure meizvi, iyo yakawandisa Poly uye SiO2 inoiswa kure, ndiko kuti, inobviswa. Panguva ino, kutungamiraetchinginoshandiswa. Muchikamu che etching, pane kupatsanurwa kwedirection etching uye isiri-directional etching. Directional etching inorevaetchingmune imwe nzira, nepo non-directional etching isiri-directional (Ndakangoerekana ndataura zvakanyanya. Muchidimbu, ndiko kubvisa SiO2 mune imwe nzira kuburikidza nemaasidhi chaiwo uye mabhesi). Mumuenzaniso uyu, isu tinoshandisa yakadzika nzira etching kubvisa SiO2, uye inova seizvi.

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Pakupedzisira, bvisa photoresist. Panguva ino, nzira yekubvisa iyo photoresist haisi iyo activation kuburikidza nechiedza irradiation yakataurwa pamusoro apa, asi kuburikidza nedzimwe nzira, nokuti hatidi kutsanangura hukuru hwakasiyana panguva ino, asi kubvisa photoresist yose. Pakupedzisira, inova sezvinoratidzwa mumufananidzo unotevera.

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Nenzira iyi, takawana chinangwa chekuchengeta iyo chaiyo nzvimbo yePoly SiO2.

Kugadzirwa kweiyo source uye drain:
Pakupedzisira, ngationei kuti tsime uye mvura inogadzirwa sei. Munhu wose achiri kuyeuka kuti takataura nezvazvo mumagazini yakapfuura. Kunobva uye kudonhedza ion-inosimwa nemhando imwechete yezvinhu. Panguva ino, tinogona kushandisa photoresist kuvhura kwainobva/kudonhedza nzvimbo uko mhando yeN inoda kuiswa. Sezvo isu tichingotora NMOS semuenzaniso, zvikamu zvese mumufananidzo uri pamusoro zvichavhurwa, sezvakaratidzwa mumufananidzo unotevera.

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Sezvo chikamu chakafukidzwa nephotoresist chisingagoni kuiswa (chiedza chakavharwa), N-mhando zvinhu zvinongoiswa paNMOS inodiwa. Sezvo iyo substrate iri pasi pepoly yakavharwa nepoly uye SiO2, haizoisirwe, saka inova seizvi.

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Panguva ino, muenzaniso wakapfava weMOS wakagadzirwa. Mune dzidziso, kana voltage yakawedzerwa kune sosi, dhiraivha, poly uye substrate, iyi MOS inogona kushanda, asi isu hatigone kungotora kuferefeta uye kuwedzera voltage zvakananga kune kwainobva uye kudhiraivha. Panguva ino, wiring yeMOS inodiwa, ndiko kuti, paMOS iyi, batanidza waya kuti ubatanidze akawanda MOS pamwechete. Ngatitarisei maitiro e wiring.

Kugadzira VIA:
Danho rekutanga nderekuvhara MOS yese nechikamu cheSiO2, sezvakaratidzwa mumufananidzo uri pasi apa:

Semiconductor process flow (9)

Zvechokwadi, iyi SiO2 inobudiswa neCVD, nokuti inokurumidza uye inochengetedza nguva. Inotevera ichiri nzira yekuisa photoresist uye kufumura. Mushure mekupedzisira, zvinoita seizvi.

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Wobva washandisa iyo etching nzira yekuisa gomba paSiO2, sezvakaratidzwa mune grey chikamu mumufananidzo uri pazasi. Kudzika kwegomba iri kunobata zvakananga Si surface.

Semiconductor process flow (10)

Pakupedzisira, bvisa photoresist uye uwane chitarisiko chinotevera.

Semiconductor process flow (12)

Panguva ino, chinoda kuitwa kuzadza conductor mugomba iri. Kuti chii chinonzi conductor uyu? Kambani imwe neimwe yakasiyana, mazhinji acho matungsten alloys, saka gomba iri ringazadzwa sei? Iyo PVD (Physical Vapor Deposition) nzira inoshandiswa, uye musimboti wakafanana nemufananidzo uri pazasi.

Semiconductor process flow (14)

Shandisa maerekitironi ane simba guru kana maion kubhomba chinhu chiri kutariswa, uye icho chakapwanyika chinodonhedza chinowira pasi muchimiro chemaatomu, nekudaro chigadzira coating pazasi. Zvinhu zvakanangwa zvatinowanzoona munhau zvinoreva izvo zvakanangwa pano.
Mushure mekuzadza gomba, rinotaridzika seizvi.

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Ehe, kana tikazadza, hazvibviri kudzora ukobvu hwejasi kuti huve hwakaenzana nehupamhi hwegomba, saka pachava nekuwedzera, saka tinoshandisa CMP (Chemical Mechanical Polishing) tekinoroji, inonzwika zvakanyanya. yepamusoro-soro, asi iri kugaya, ichikuya zvikamu zvakawandisa. Mhedzisiro yakaita seizvi.

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Panguva ino, isu tapedza kugadzira dhizaini ye via. Ehe, kugadzirwa kweVia kunonyanya kuita wiring yesimbi layer kumashure.

Metal layer kugadzirwa:
Pasi pemamiriro ari pamusoro, tinoshandisa PVD kudzika imwe simbi yesimbi. Iyi simbi inonyanya kushandiswa nemhangura-based alloy.

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Zvino mushure mekuratidzwa uye etching, tinowana zvatinoda. Zvadaro ramba uchiunganidza kusvikira tazadzisa zvatinoda.

Semiconductor process flow (16)

Kana isu tichidhirowa marongero, isu tinokuudza kuti mangani akaturikidzana esimbi uye kuburikidza nemaitiro anoshandiswa anogona kurongedzerwa zvakanyanya, izvo zvinoreva kuti mangani akaturikidzana.
Pakupedzisira, tinowana chimiro ichi. Iyo yepamusoro pedhi ndiyo pini yeiyi chip, uye mushure mekurongedza, inova iyo pini yatinogona kuona (zvechokwadi, ndakaidhirowa zvisina tsarukano, hapana chinoshanda chakakosha, semuenzaniso).

Semiconductor process flow (6)

Iyi ndiyo nzira yakajairika yekugadzira chip. Muchikamu chino, takadzidza pamusoro pekunyanya kukosha, etching, ion implantation, furnace tubes, CVD, PVD, CMP, nezvimwewo mune semiconductor foundry.


Nguva yekutumira: Aug-23-2024
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