Laser tekinoroji inotungamira shanduko yesilicon carbide substrate processing tekinoroji

 

1. Pfupiso yesilicon carbide substratekugadzira michina

The currentsilicon carbide substrate matanho ekugadzirisa anosanganisira: kukuya denderedzwa rekunze, kucheka, chamfering, kugaya, kupurisa, kuchenesa, etc. Kucheka inhanho inokosha mu semiconductor substrate processing uye danho rinokosha pakushandura ingot kune substrate. Parizvino, kuchekwa kwesilicon carbide substratesinonyanya kucheka waya. Multi-waya slurry cutting ndiyo yakanakisa nzira yekucheka waya panguva ino, asi kuchine matambudziko ekushaya kunaka kwekucheka uye kurasikirwa kukuru kwekucheka. Kurasikirwa kwekucheka kwetambo kuchawedzera nekuwedzera kwe substrate saizi, iyo isingakodzeri kunesilicon carbide substratevagadziri kuti vawane kuderedzwa kwemutengo uye kuvandudzwa kwehunyanzvi. Mukati mekucheka8-inch silicon carbide substrates, chimiro chepamusoro che substrate chinowanikwa nekucheka kwetambo yakashata, uye nhamba dzenhamba dzakadai seWARP neBOW hazvina kunaka.

Slicing inhanho yakakosha mukugadzira semiconductor substrate. Iyo indasitiri inogara ichiedza nzira nyowani dzekucheka, senge diamond wire yekucheka uye laser stripping. Laser stripping tekinoroji yakatsvakwa zvakanyanya munguva pfupi yapfuura. Kuunzwa kweiyi tekinoroji kunoderedza kurasikirwa kwekucheka uye kunovandudza kucheka hunyanzvi kubva kuhunyanzvi hwaro. Iyo laser stripping solution ine yakakwira zvinodiwa padanho reotomatiki uye inoda tekinoroji yekutetepa kuti ibatane nayo, inofambirana neremangwana rekusimudzira kutungamira kwesilicon carbide substrate process. Kucheka kwechimedu kwechinyakare dhaka waya yekucheka kazhinji 1.5-1.6. Kuunzwa kwelaser stripping tekinoroji kunogona kuwedzera goho rechidimbu kusvika pa2.0 (tarisa kumidziyo yeDISCO). Mune ramangwana, sezvo kukura kwelaser stripping tekinoroji kunowedzera, goho rechidimbu rinogona kuvandudzwa; panguva imwecheteyo, laser stripping inogona zvakare kuvandudza zvakanyanya kushanda kwekucheka. Zvinoenderana nekutsvaga kwemusika, mutungamiri weindasitiri DISCO anocheka chimedu mukati memaminitsi gumi kusvika gumi nemashanu, iyo inoshanda zvakanyanya kupfuura yazvino dhaka waya yekucheka kwemaminetsi makumi matanhatu pachidimbu.

Matanho echinyakare ekucheka waya yesilicon carbide substrates ndeaya: waya yekucheka-yakaoma kugaya-yakanaka kukuya-yakakasharara kupukuta uye kukwenenzvera. Mushure meiyo laser stripping process inotsiva waya yekucheka, iyo kuonda nzira inoshandiswa kutsiva nzira yekukuya, iyo inoderedza kurasikirwa kwezvimedu uye inovandudza kugadzirisa kushanda. Iyo laser stripping process yekucheka, kugaya uye kukwenenzverwa kwesilicon carbide substrates yakakamurwa kuita matanho matatu: laser surface scanning-substrate stripping-ingot flattening: laser surface scanning ndeye kushandisa ultrafast laser pulses kugadzirisa pamusoro peingot kugadzira yakagadziridzwa. layer mukati meingot; substrate stripping ndeyekuparadzanisa substrate pamusoro peiyo yakagadziridzwa layer kubva kune ingot nenzira dzemuviri; ingot flattening ndeyekubvisa yakagadziridzwa layer pamusoro peiyo ingot kuti ive nechokwadi chekudzikama kweiyo ingot.
Silicon carbide laser stripping process

 

2. Kufambira mberi kwepasi rose mune laser stripping tekinoroji uye maindasitiri anotora chikamu makambani

Iyo laser stripping process yakatanga kugamuchirwa nemakambani ekumhiri kwemakungwa: Muna 2016, DISCO yeJapan yakagadzira tekinoroji nyowani yelaser KABRA, iyo inoumba patsanuro yekuparadzanisa uye inopatsanura mawafer pahupamhi hwakatsanangurwa nekuramba ichivhenekera ingot nelaser, inogona kushandiswa kwakasiyana. mhando dzeSiC ingots. Muna Mbudzi 2018, Infineon Technologies yakawana Siltectra GmbH, yekutanga yekucheka mbichana, ye124 miriyoni euros. Iyo yekupedzisira yakagadzira iyo Cold Split process, iyo inoshandisa patented laser tekinoroji kutsanangura iyo kupatsanurwa siyana, jasi rakakosha polymer zvinhu, kudzora sisitimu inotonhorera inokonzera kushushikana, kunyatsopatsanura zvinhu, uye kukuya uye kuchena kuti uwane wafer kucheka.

Mumakore achangopfuura, mamwe makambani epamba akapindawo muindasitiri yekubvisa michina yelaser: makambani makuru ndiHan's Laser, Delong Laser, West Lake Instrument, Universal Intelligence, China Electronics Technology Group Corporation uye Institute of Semiconductors yeChinese Academy yeSainzi. Pakati pavo, makambani akanyorwa Han's Laser uye Delong Laser anga ari muhurongwa kwenguva yakareba, uye zvigadzirwa zvavo zviri kusimbiswa nevatengi, asi kambani ine mitsetse yakawanda yechigadzirwa, uye laser yekubvisa michina inongova imwe yemabhizinesi avo. Zvigadzirwa zvenyeredzi dziri kusimukira dzakadai seWest Lake Instrument zvakawana kutumirwa kwehurongwa; Universal Intelligence, China Electronics Technology Group Corporation 2, Institute of Semiconductors yeChinese Academy of Sciences nemamwe makambani akaburitsawo kufambira mberi kwemidziyo.

 

3. Kutyaira zvinhu zvekusimudzira laser stripping tekinoroji uye rhythm yekusuma musika

Kudzikiswa kwemutengo kwe6-inch silicon carbide substrates kunofambisa kuvandudzwa kwelaser stripping tekinoroji: Parizvino, mutengo we6-inch silicon carbide substrates wadonha pasi pe4,000 yuan / chidimbu, uchisvika pamutengo wemutengo wevamwe vagadziri. Iyo laser stripping process ine yakakwira goho mwero uye yakasimba pundutso, iyo inotyaira mwero wekupinda welaser stripping tekinoroji kuwedzera.

Kutetepa kwe8-inch silicon carbide substrates kunofambisa kuvandudzwa kwelaser stripping tekinoroji: Ukobvu hwe8-inch silicon carbide substrates parizvino 500um, uye huri kusimukira hwakananga kuhukobvu hwe350um. Iyo nzira yekucheka waya haishande mu8-inch silicon carbide processing (iyo substrate pamusoro haina kunaka), uye iyo BOW neWARP tsika dzakadzikira zvakanyanya. Laser stripping inoonekwa seyakakosha kugadzirisa tekinoroji ye350um silicon carbide substrate process, iyo inofambisa mwero wekupinda kwelaser stripping tekinoroji kuwedzera.

Zvinotarisirwa nemusika: SiC substrate laser stripping equipment inobatsira kubva mukuwedzera kwe8-inch SiC uye kudzikiswa kwemutengo we6-inch SiC. Iyo yazvino indasitiri yakakosha poindi iri kusvika, uye kusimudzira kweindasitiri kuchakwidziridzwa zvakanyanya.