Sputtering sini fa'aaoga i semiconductor integrated circuits

Sputtering sinie masani ona faʻaaogaina i le eletise ma faʻamatalaga alamanuia, e pei o fesoʻotaʻiga tuʻufaʻatasia, teuina o faʻamatalaga, faʻaaliga tioata vai, manatuaga leisa, masini eletise eletise, ma isi. meafaitino, maualuga-vevela corrosion resistance , oloa teuteu maualuga ma isi alamanuia.

Mama maualuga 99.995% Titanium Sputtering TargetFerrum Sputtering TargetCarbon C Sputtering Target, Graphite Target

Sputtering o se tasi o auala autu mo le saunia o mea manifinifi ata tifaga.E fa'aogaina ai ion e fa'aosoina e puna'oa e fa'avavevave ai ma fa'aputu'e i totonu o se vacuum e fa'atupu ai le saosaoa malosi fa'alava ion, tu'i i luga o le mea malo, ma fa'afesuia'i le malosi o le kinetic i le va o ions ma atoms luga. O atoms i luga o le mea malo e tu'u ai le malo ma e teuina i luga o le mea'ai. O le pomu malosi o le mea mataʻutia mo le teuina o ata manifinifi e ala i le sputtering, lea e taʻua o le sputtering target. 'ese'ese ituaiga o sputtered mea ata manifinifi ua fa'aaogaina lautele i semiconductor integrated circuits, pu'eina ala o faasalalauga, fa'aaliga mafolafola ma workpiece luga coatings.

I totonu o alamanuia talosaga uma, o le semiconductor alamanuia o loʻo i ai le sili ona stringent tulaga manaomia mo sini sputtering films.High-mama uʻamea sputtering sini e masani lava ona faʻaaogaina i le gaosiga o le wafer ma faiga faʻapipiʻi alualu i luma. O le faia o le gaosiga o chip e fai ma faʻataʻitaʻiga, e mafai ona tatou vaʻavaʻai mai i le silicon wafer i se pu, e manaʻomia ona alu i le 7 faʻagasologa o gaosiga tetele, e taʻua o le faʻasalalau (Thermal Process), Photo-lithography (Photo-lithography), Etch (Etch), Ion Implantation (IonImplant), Thin Film Growth (Dielectric Deposition), Chemical Mechanical Polishing (CMP), Metalization (Metalization) O faiga e fetaui ma le tasi. O le sputtering target e faʻaaogaina i le faagasologa o le "metallization". O le sini o loʻo osofaʻia i meaʻai maualuga-malosi e ala i masini faʻapipiʻi ata manifinifi ona fai ai lea o se uʻamea faʻatasi ai ma galuega faʻapitoa i luga o le wafer silicon, e pei o le conductive layer, pa puipui. Faatali. Talu ai ona o le faagasologa o le semiconductor atoa e fesuisuiai ona manaʻomia lea o nisi taimi e faʻamaonia ai o loʻo i ai saʻo le faiga o lea matou te manaʻomia ai nisi ituaiga o mea faʻatauvaʻa i nisi vaega o le gaosiga e faʻamaonia ai aʻafiaga.


Taimi meli: Ian-17-2022
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