Gukinisha wafer ni iki?

A waferigomba kunyura mu mpinduka eshatu kugirango ibe chip nyayo ya semiconductor: icya mbere, ingot-imeze nkibice byaciwe muri wafer; murwego rwa kabiri, tristoriste yanditseho imbere ya wafer unyuze mubikorwa byabanjirije; amaherezo, gupakira birakorwa, nibyo, binyuze mugukata inzira ,.waferihinduka icyuma cyuzuye cyuzuye. Birashobora kugaragara ko inzira yo gupakira ari iyinyuma yinyuma. Muri ubu buryo, wafer izacibwa mubice byinshi bya hexahedron. Iyi nzira yo kubona chip yigenga yitwa "Singulation", kandi inzira yo kubona ikibaho cya wafer muri cuboide yigenga yitwa "gukata wafer (Die Sawing)". Vuba aha, hamwe no kunoza igice cya semiconductor, ubunini bwawafersyahindutse yoroheje kandi yoroheje, birumvikana ko izana ingorane nyinshi mubikorwa bya "singulation".

Ubwihindurize bwo gushushanya

Imbere-Impera ninyuma-byimbere byahindutse binyuze mubikorwa muburyo butandukanye: ihindagurika ryibikorwa byinyuma-bishobora kugena imiterere numwanya wa hexahedron uduce duto dutandukanijwe nu rupfu kuriwafer, kimwe n'imiterere n'umwanya wa padi (inzira y'amashanyarazi inzira) kuri wafer; muburyo bunyuranye, ubwihindurize bwibikorwa byanyuma-byahinduye inzira nuburyo bwawaferkunanuka inyuma no "gupfa gushushanya" murwego rwinyuma. Kubwibyo, uburyo bugenda bugaragara bugaragara bwa paki buzagira ingaruka zikomeye kumurongo wanyuma. Byongeye kandi, umubare, uburyo nuburyo bwo gushushanya nabyo bizahinduka ukurikije ihinduka ryimiterere ya paki.

Kwandika

Mu minsi ya mbere, "kumena" ukoresheje imbaraga zo hanze nuburyo bwonyine bwo gushushanya bushobora kugabanyawafermuri hexahedron arapfa. Nyamara, ubu buryo bufite ibibi byo gukata cyangwa gucamo inkombe ya chip nto. Mubyongeyeho, kubera ko burr hejuru yicyuma idakuweho burundu, ubuso bwaciwe nabwo burakabije.
Kugira ngo iki kibazo gikemuke, uburyo bwo guca “Kwandika” bwabayeho, ni ukuvuga mbere yo “kumena”, ubuso bwawaferyaciwe kugeza hafi kimwe cya kabiri cyubujyakuzimu. "Kwandika", nkuko izina ribigaragaza, bivuga gukoresha moteri kugirango abone (igice-cyaciwe) uruhande rwimbere rwa wafer mbere. Mu minsi ya mbere, wafers nyinshi ziri munsi ya santimetero 6 zakoresheje ubu buryo bwo guca mbere "gukata" hagati ya chip hanyuma "kumena".

Kwishushanya cyangwa Kubona Icyuma

Uburyo bwo guca "Kwandika" buhoro buhoro bwateye imbere muburyo bwo gukata (cyangwa gukata) uburyo, bwo gukata ukoresheje icyuma inshuro ebyiri cyangwa eshatu zikurikiranye. Uburyo bwo gukata "Blade" bushobora kuzuza ibintu bya chipi zishishwa iyo "zimenetse" nyuma yo "kwandika", kandi birashobora kurinda uduce duto mugihe cyo "kuririmba". Gukata "Icyuma" bitandukanye no gukata "dising" yabanjirije, ni ukuvuga, nyuma yo gukata "icyuma", ntabwo "kumena", ahubwo byongeye gukata ukoresheje icyuma. Kubwibyo, byitwa kandi "intambwe yo gushushanya".

Mu rwego rwo kurinda wafer ibyangiritse hanze mugihe cyo gutema, hazashyirwa firime kuri wafer mbere kugirango habeho “ingaragu” itekanye. Mugihe cyo "gusya inyuma", firime izahuzwa imbere ya wafer. Ariko muburyo bunyuranye, mugukata "blade", firime igomba kuba ifatanye inyuma ya wafer. Mugihe cyo gupfa kwa eutectic (guhuza gupfa, gutunganya chipi yatandukanijwe kuri PCB cyangwa ikadiri yagenwe), firime ifatanye inyuma izahita igwa. Bitewe no guterana kwinshi mugihe cyo gukata, amazi ya DI agomba guterwa ubudahwema kuva impande zose. Byongeye kandi, uwimura agomba guhuzwa nuduce twa diyama kugirango ibice bishoboke gukata neza. Muri iki gihe, gukata (ubugari bwumubyimba: ubugari bwa groove) bigomba kuba bimwe kandi ntibigomba kurenza ubugari bwikibaho.
Kuva kera, kubona nuburyo bwakoreshejwe cyane muburyo bwo gutema gakondo. Inyungu nini cyane nuko ishobora kugabanya umubare munini wa wafer mugihe gito. Ariko, niba kugaburira umuvuduko wibice byiyongereye cyane, amahirwe yo gukuramo chiplet aziyongera. Kubwibyo, umubare wokuzenguruka kwimuka ugomba kugenzurwa inshuro 30.000 kumunota. Birashobora kugaragara ko tekinoroji yimikorere ya semiconductor ikunze kuba ibanga ryegeranijwe buhoro buhoro mugihe kirekire cyo kwegeranya no kugerageza no kwibeshya (mugice gikurikira kijyanye no guhuza eutectic, tuzaganira kubirimo gukata na DAF).

Gushushanya mbere yo gusya (DBG): gukata gukurikiranye byahinduye uburyo

Iyo gukata ibyuma bikozwe kuri wafer ya santimetero 8, nta mpamvu yo guhangayikishwa no gukuramo chiplet. Ariko nkuko diameter ya wafer yiyongera kuri santimetero 21 hanyuma umubyimba ukaba muto cyane, gukuramo no guturika bitangira kongera kugaragara. Kugirango ugabanye cyane ingaruka zumubiri kuri wafer mugihe cyo gutema, uburyo bwa DBG bwo "gushushanya mbere yo gusya" busimbuza urukurikirane rwa gakondo. Bitandukanye nuburyo gakondo bwo gukata "icyuma" bugabanya ubudahwema, DBG yabanje gukora "icyuma", hanyuma buhoro buhoro inanura umubyimba wafer mukomeza kunanura uruhande rwinyuma kugeza chip igabanijwe. Birashobora kuvugwa ko DBG ari verisiyo yazamuye uburyo bwo guca "icyuma". Kuberako irashobora kugabanya ingaruka zo gukata kabiri, uburyo bwa DBG bwamamaye byihuse muri "wafer-urwego rwo gupakira".

Kumenyekanisha

Urwego rwa wafer urwego rwa chip igipimo (WLCSP) inzira ikoresha cyane cyane gukata laser. Gukata lazeri birashobora kugabanya ibintu nko gutobora no guturika, bityo ukabona chip nziza nziza, ariko mugihe umubyimba wa wafer urenze 100μm, umusaruro uzagabanuka cyane. Kubwibyo, ikoreshwa cyane kuri wafer ifite umubyimba uri munsi ya 100 mm (ugereranije ni muto). Gukata lazeri bigabanya silikoni ukoresheje lazeri ifite ingufu nyinshi kumurongo wa wafer. Ariko, mugihe ukoresheje uburyo busanzwe bwo gukata laser (Conventionional Laser), firime ikingira igomba gukoreshwa hejuru ya wafer mbere. Kuberako gushyushya cyangwa kurasa hejuru ya wafer hamwe na lazeri, iyi mibonano yumubiri izabyara ibiti hejuru ya wafer, kandi ibice bya silikoni yaciwe nabyo bizafatana hejuru. Birashobora kugaragara ko uburyo bwa gakondo bwo gukata lazeri nabwo bugabanya mu buryo butaziguye ubuso bwa wafer, kandi muri urwo rwego, busa nuburyo bwo guca “icyuma”.

Kwiba (SD) nuburyo bwo kubanza gukata imbere muri wafer ukoresheje ingufu za laser, hanyuma ugashyiraho igitutu cyo hanze kuri kaseti ifatanye inyuma kugirango uyimeneke, bityo itandukanya chip. Iyo igitutu gishyizwe kuri kaseti inyuma, wafer izahita izamurwa hejuru kubera kurambura kaseti, bityo gutandukanya chip. Ibyiza bya SD kurenza uburyo bwa gakondo bwo guca laser ni: icya mbere, nta myanda ya silicon; icya kabiri, kerf (Kerf: ubugari bwimyandikire yabanditsi) iragufi, kubwibyo byinshi bishobora kuboneka. Byongeye kandi, gukuramo no guturika bizagabanuka cyane ukoresheje uburyo bwa SD, bukaba ari ingenzi kumiterere rusange yo gukata. Kubwibyo, uburyo bwa SD burashoboka cyane kuba ikoranabuhanga rizwi cyane mugihe kizaza.

Indwara ya plasma
Gukata plasma nubuhanga bwa vuba bwateye imbere bukoresha plasma yo gutema mugihe cyo gukora (Fab). Gukata plasma ikoresha ibikoresho bya gaze ya gaze aho gukoresha amazi, ingaruka rero kubidukikije ni nto. Kandi uburyo bwo guca wafer yose icyarimwe byemewe, bityo umuvuduko wo "gukata" urihuta. Nyamara, uburyo bwa plasma bukoresha gaze ya reaction ya chimique nkibikoresho fatizo, kandi inzira yo gutobora iragoye cyane, kuburyo inzira yayo igenda itoroshye. Ariko ugereranije no gukata “blade” no gukata lazeri, gukata plasma ntabwo bitera kwangirika hejuru ya wafer, bityo kugabanya igipimo cyinenge no kubona chip nyinshi.

Vuba aha, kuva uburebure bwa wafer bwagabanutse kugera kuri 30 mm, kandi hakoreshwa ibikoresho byinshi byumuringa (Cu) cyangwa ibikoresho bya dielectric bihoraho (Low-k). Kubwibyo, kugirango wirinde burrs (Burr), uburyo bwo guca plasma nabwo buzashyigikirwa. Nibyo, tekinoroji yo guca plasma nayo ihora itera imbere. Nizera ko mugihe cya vuba, umunsi umwe bitazaba ngombwa kwambara mask idasanzwe mugihe cyo gutobora, kuko iyi nicyerekezo cyingenzi cyiterambere cyo guca plasma.

Nkuko umubyimba wa wafer wagabanutse kuva kuri 100 mm kugeza kuri 50 mm hanyuma ukagera kuri 30 mm, uburyo bwo gutema bwo kubona chip yigenga nabwo bwagiye buhinduka kandi butera imbere kuva "kumena" no "gukata" gukata no gukata lazeri no gukata plasma. Nubwo uburyo bwo gukata bugenda bukura bwongereye igiciro cyumusaruro wigikorwa cyo gutema ubwacyo, kurundi ruhande, mukugabanya cyane ibintu bitifuzwa nko gutobora no guturika bikunze kugaragara mugukata ibyuma bya semiconductor no kongera umubare wa chipi wabonye kuri buri wafer , ikiguzi cyo gukora chip imwe yerekanye icyerekezo cyo kumanuka. Birumvikana ko kwiyongera kwimibare yabonetse kuri buri gice cya wafer bifitanye isano rya bugufi no kugabanya ubugari bwumuhanda wambukiranya. Ukoresheje gukata plasma, hafi 20% chip irashobora kuboneka ugereranije no gukoresha uburyo bwo gukata "blade", nayo niyo mpamvu nyamukuru ituma abantu bahitamo gukata plasma. Hamwe niterambere hamwe nimpinduka za wafer, isura ya chip nuburyo bwo gupakira, inzira zitandukanye zo guca nka tekinoroji yo gutunganya wafer na DBG nazo ziragaragara.