Tekinoroji ya Laser iyobora ihinduka rya silicon carbide substrate tekinoroji yo gutunganya

1. Incamake yasilicon karbide substratetekinoroji yo gutunganya

Ibirihosilicon karbide substrate intambwe zo gutunganya zirimo: gusya uruziga rwo hanze, gukata, gutondagura, gusya, gusya, gukora isuku, nibindi. Gukata ni intambwe yingenzi mugutunganya insimburangingo ya semiconductor nintambwe yingenzi muguhindura ingot muri substrate. Kuri ubu, gukata kwasilicon karbide substratesni ugukata insinga. Gukata insinga nyinshi nuburyo bwiza bwo guca insinga muri iki gihe, ariko haracyari ibibazo byo gukata nabi no gutakaza igihombo kinini. Igihombo cyo guca insinga kiziyongera hamwe no kwiyongera kwubunini bwa substrate, butajyanye nasilicon karbide substrateababikora kugirango bagabanye ibiciro no kunoza imikorere. Muburyo bwo gukataCarbide ya santimetero 8 substrates, imiterere yubuso bwa substrate yabonetse mugukata insinga ni mbi, kandi ibiranga imibare nka WARP na BOW ntabwo ari byiza.

Gukata nintambwe yingenzi mubikorwa bya semiconductor substrate. Inganda zihora zigerageza uburyo bushya bwo guca, nko guca insinga za diyama no kwambura laser. Tekinoroji yo kwambura Laser yashakishijwe cyane vuba aha. Kwinjiza iri koranabuhanga bigabanya kugabanya igihombo no kunoza imikorere yo gukata uhereye kumahame ya tekiniki. Igisubizo cya lazeri gifite ibisabwa byinshi kurwego rwo kwikora kandi bisaba tekinoroji yoroheje kugirango ifatanye nayo, ibyo bikaba bijyanye nicyerekezo cyiterambere kizaza cyo gutunganya silicon karbide substrate. Umusaruro wibice byo gukata insinga gakondo ni 1.5-1.6. Kwinjiza tekinoroji yo kwambura laser irashobora kongera umusaruro wibice bigera kuri 2.0 (reba ibikoresho bya DISCO). Mugihe kizaza, uko gukura kwikoranabuhanga rya laser byiyongera, umusaruro wibice urashobora kurushaho kunozwa; icyarimwe, gukuramo laser birashobora kandi kunoza cyane imikorere yo gukata. Nk’uko ubushakashatsi bwakozwe ku isoko bubitangaza, umuyobozi w’inganda DISCO agabanya igice mu minota igera ku 10-15, ibyo bikaba byiza cyane kuruta ubu insinga ya minisiteri igabanya iminota 60 kuri buri gice.

Intambwe yintambwe yo gukata insinga gakondo ya silicon karbide substrate ni: gukata insinga-gusya-gusya-gusya neza-gusya neza no gusya neza. Nyuma yo kwambura lazeri gusimbuza gukata insinga, uburyo bwo kunanura bukoreshwa mugusimbuza uburyo bwo gusya, bigabanya igihombo cyibice kandi bikanoza neza gutunganya. Inzira yo kwambura lazeri yo gukata, gusya no gusya ya silicon karbide substrate igabanijwemo intambwe eshatu: laser surface scanning-substrate stripping-ingot gusibanganya: gusikana hejuru ya laser ni ugukoresha ultrafast laser pulses kugirango itunganyirize hejuru ya ingot kugirango ihindurwe. urwego imbere muri ingot; gukuramo substrate ni ugutandukanya substrate hejuru yurwego rwahinduwe na ingot hakoreshejwe uburyo bwumubiri; gusibanganya ingot ni ugukuraho igorofa ryahinduwe hejuru yingingo kugirango harebwe uburinganire bwubuso.
Silicon carbide laser yambura inzira

 
2. Iterambere mpuzamahanga muma tekinoroji ya laser hamwe namasosiyete yitabira inganda

Igikorwa cyo kwambura lazeri cyemejwe bwa mbere n’amasosiyete yo mu mahanga: Mu mwaka wa 2016, Ubuyapani DISCO bwateje imbere ikoranabuhanga rishya ryo gukata lazeri KABRA, rigizwe n’urwego rutandukanya kandi rigatandukanya wafer ku bujyakuzimu bwihariye mu gukomeza kurasa ingoteri na lazeri, ishobora gukoreshwa mu buryo butandukanye Ubwoko bwa SiC. Mu Gushyingo 2018, Infineon Technologies yaguze Siltectra GmbH, itangira guca wafer, kuri miliyoni 124 z'amayero. Iyanyuma yateje imbere Cold Split, ikoresha tekinoroji ya laser kugirango isobanure intera igabanijwe, ikote idasanzwe ya polymer, kugenzura sisitemu yo gukonjesha itera guhangayika, ibikoresho bigabanijwe neza, no gusya no gusukura kugirango ugabanye wafer.

Mu myaka yashize, amasosiyete amwe n'amwe yo mu gihugu nayo yinjiye mu nganda zikoresha ibikoresho bya laser: amasosiyete akomeye ni Han's Laser, Delong Laser, West Lake Instrument, Universal Intelligence, Isosiyete ikora ibijyanye n’ikoranabuhanga mu Bushinwa hamwe n’ikigo cya Semiconductor yo mu Ishuri Rikuru ry’Ubumenyi ry’Ubushinwa. Muri byo, ibigo byashyizwe ku rutonde Han's Laser na Delong Laser bimaze igihe kinini mu miterere, kandi ibicuruzwa byabo bigenzurwa n’abakiriya, ariko isosiyete ifite imirongo myinshi y’ibicuruzwa, kandi ibikoresho byo kwambura laser ni kimwe mu bucuruzi bwabo. Ibicuruzwa byinyenyeri zizamuka nka West Lake Instrument byageze kubyoherejwe byemewe; Universal Intelligence, Ubushinwa Electronics Technology Group Group 2, Institute of Semiconductor of the Academy of Science of China and other societe nazo zasohoye iterambere ryibikoresho.

3. Gutwara ibintu bigamije iterambere rya tekinoroji ya laser hamwe nigitekerezo cyo kumenyekanisha isoko

Kugabanuka kw'ibiciro bya santimetero 6 za karubide ya karubide itera iterambere rya tekinoroji yo kwambura laser: Kugeza ubu, igiciro cya karubide ya karubide ya santimetero 6 cyamanutse munsi ya 4000 yuan / igice, cyegera igiciro cy’ibikorwa bimwe na bimwe. Inzira yo kwambura laser ifite igipimo cyinshi cyumusaruro ninyungu zikomeye, ibyo bigatuma igipimo cyinjira muburyo bwa tekinoroji yo kwambura laser kwiyongera.

Kugabanuka kwa santimetero 8 za silicon karbide substrate itera iterambere ryubuhanga bwo kwambura laser: Ubunini bwa santimetero 8 za silicon karbide substrate ubu ni 500um, kandi buratera imbere bugana kuri 350um. Igikorwa cyo guca insinga ntigikora neza mugutunganya karbide ya santimetero 8 (ubuso bwa substrate ntabwo ari bwiza), kandi indangagaciro za BOW na WARP zangiritse cyane. Kwambura Laser bifatwa nkubuhanga bukenewe bwo gutunganya 350um silicon karbide substrate itunganya, ibyo bigatuma igipimo cyinjira muburyo bwa tekinoroji yo kwambura laser kwiyongera.

Ibiteganijwe ku isoko: SiC substrate laser yambura ibikoresho byunguka kwaguka kwa SiC-8 na kugabanya ibiciro bya SiC-6. Inganda zigezweho ziri hafi, kandi iterambere ryinganda rizihuta cyane.