A mtandaimayenera kudutsa zosintha zitatu kuti ikhale chipangizo chenicheni cha semiconductor: choyamba, ingot yoboola pakati imadulidwa kukhala zowonda; mu njira yachiwiri, ma transistors amalembedwa kutsogolo kwa chofufumitsa kudzera munjira yapitayi; potsiriza, kulongedza kumachitidwa, ndiko kuti, kupyolera mu kudula, ndimtandaimakhala chip chathunthu cha semiconductor. Zitha kuwoneka kuti njira yopangira ma CD ndi ya njira yakumbuyo. Pochita izi, chophikacho chimadulidwa kukhala tchipisi tambiri ta hexahedron. Njira yopezera tchipisi todziyimira payokha imatchedwa "Singulation", ndipo njira yowonera bolodi lokhala ndi ma cuboids odziyimira pawokha imatchedwa "wafer cutting (Die Sawing)". Posachedwapa, ndikuwongolera kwa kuphatikiza kwa semiconductor, makulidwe azopyapyalawakhala wochepa thupi komanso wochepa thupi, zomwe ndithudi zimabweretsa zovuta zambiri pa ndondomeko ya "kuphatikizana".
Kusintha kwa dicing wafer
Njira zakutsogolo ndi zakumbuyo zasintha kudzera muzolumikizana m'njira zosiyanasiyana: kusinthika kwa njira zakumbuyo kumatha kudziwa momwe ma hexahedron amapangidwira tchipisi tating'ono tating'ono tosiyanitsidwa ndi kufa pakufa.mtanda, komanso kapangidwe kake ndi malo a mapepala (njira zolumikizira magetsi) pa mtanda; m'malo mwake, kusinthika kwa njira zakutsogolo kwasintha njira ndi njira yamtandakumbuyo kupatulira ndi "kufa dicing" mu ndondomeko kumbuyo-mapeto. Choncho, mawonekedwe owonjezereka a phukusili adzakhala ndi zotsatira zabwino pa ndondomeko ya kumbuyo. Komanso, chiwerengero, ndondomeko ndi mtundu wa dicing zidzasinthanso molingana ndi kusintha kwa maonekedwe a phukusi.
Mlembi Dicing
M'masiku oyambirira, "kuthyola" pogwiritsa ntchito mphamvu yakunja inali njira yokhayo yogawanitsamtandamu hexahedron amafa. Komabe, njira iyi ili ndi kuipa kwa kukwapula kapena kusweka m'mphepete mwa chip kakang'ono. Kuonjezera apo, popeza ma burrs pazitsulo zachitsulo samachotsedwa kwathunthu, malo odulidwa amakhalanso ovuta kwambiri.
Kuti athetse vutoli, njira yodulira "Scribing" idayamba, ndiye kuti, "isanathyole", pamwamba pa nthaka.mtandaamadulidwa pafupifupi theka la kuya. "Kulemba", monga momwe dzinalo likusonyezera, kumatanthauza kugwiritsa ntchito chopondera kuti awone (odulidwa theka) mbali yakutsogolo ya chophatikizira pasadakhale. M'masiku oyambilira, zowonda zambiri pansi pa mainchesi 6 zidagwiritsa ntchito njira yodulayi poyambira "kudula" pakati pa tchipisi kenako "kuswa".
Kudula masamba kapena kudula masamba
Njira yodulira "Scribing" idayamba pang'onopang'ono kukhala njira ya "Blade dicing" (kapena macheka), yomwe ndi njira yodulira pogwiritsa ntchito mpeni kawiri kapena katatu motsatana. Njira yodulira "Blade" imatha kupanga chodabwitsa cha tchipisi tating'onoting'ono tating'onoting'ono tating'onoting'ono tikakhala "kusweka" pambuyo "kulemba", ndipo imatha kuteteza tchipisi tating'ono panthawi ya "singulation". Kudula "tsamba" kumasiyana ndi kudula "kudula" koyambirira, ndiko kuti, pambuyo pa "tsamba" kudula, sikuli "kuswa", koma kudula kachiwiri ndi tsamba. Choncho, amatchedwanso "step dicing" njira.
Pofuna kuteteza chowotchacho ku kuwonongeka kwa kunja panthawi yodula, filimu idzagwiritsidwa ntchito pazitsulo pasadakhale kuti zitsimikizire kuti "singing" yotetezeka. Panthawi ya "kubwerera kumbuyo", filimuyo idzaphatikizidwa kutsogolo kwa chofufumitsa. Koma m'malo mwake, mu "tsamba" kudula, filimuyo iyenera kumangirizidwa kumbuyo kwa chofufumitsa. Panthawi ya eutectic kufa bonding (kufa kugwirizana, kukonza tchipisi topatukana pa PCB kapena chimango chokhazikika), filimu yomwe imamangiriridwa kumbuyo imagwa yokha. Chifukwa cha kukangana kwakukulu panthawi yodula, madzi a DI ayenera kupopera nthawi zonse kuchokera mbali zonse. Kuphatikiza apo, choyikapocho chiyenera kumangirizidwa ndi tinthu ta diamondi kuti magawowo adulidwe bwino. Panthawi imeneyi, odulidwa (tsamba makulidwe: poyambira m'lifupi) ayenera kukhala yunifolomu ndipo si upambana m'lifupi mwa dicing poyambira.
Kwa nthawi yayitali, kucheka kwakhala njira yodula kwambiri yomwe imagwiritsidwa ntchito kwambiri. Ubwino wake waukulu ndikuti ukhoza kudula mikwingwirima yambiri munthawi yochepa. Komabe, ngati kuthamanga kwa kagawo kumawonjezeka kwambiri, kuthekera kwa peelet m'mphepete kumawonjezeka. Chifukwa chake, kuchuluka kwa kuzungulira kwa choyikapo kuyenera kuyendetsedwa pafupifupi nthawi 30,000 pamphindi. Zitha kuwoneka kuti umisiri wa semiconductor ndondomeko nthawi zambiri chinsinsi anasonkhanitsa pang'onopang'ono mwa nthawi yaitali kudzikundikira ndi mayesero ndi zolakwika (mu gawo lotsatira pa eutectic kugwirizana, tikambirana zili za kudula ndi DAF).
Dicing pamaso akupera (DBG): ndondomeko kudula wasintha njira
Pamene kudula tsamba kumachitidwa pa chowotcha cha mainchesi 8, palibe chifukwa chodera nkhawa za chipset m'mphepete mwa peeling kapena kusweka. Koma m'mimba mwake ikakula kufika mainchesi 21 ndipo makulidwe ake amakhala owonda kwambiri, zochitika zosenda ndi zosweka zimayamba kuwonekeranso. Pofuna kuchepetsa kwambiri kukhudzidwa kwa thupi pa chowotcha panthawi yodula, njira ya DBG ya "dicing pamaso akupera" imalowa m'malo mwa ndondomeko yodula. Mosiyana ndi njira yachikhalidwe yodulira "tsamba" yomwe imadula mosalekeza, DBG imadula "tsamba", kenako imawonda pang'onopang'ono ndikuchepetsa mbali yakumbuyo mpaka chip chigawanika. Titha kunena kuti DBG ndi njira yosinthira ya "tsamba" yam'mbuyomu yodulira. Chifukwa imatha kuchepetsa zotsatira za kudulidwa kwachiwiri, njira ya DBG yadziwika kwambiri mu "packaging-level packaging".
Laser Dicing
The yopyapyala-level Chip lonse phukusi (WLCSP) ndondomeko makamaka amagwiritsa laser kudula. Kudula kwa laser kumatha kuchepetsa zochitika monga kusenda ndi kusweka, potero kupeza tchipisi tabwinoko, koma makulidwe ake akamakula kuposa 100μm, zokolola zidzachepa kwambiri. Choncho, nthawi zambiri amagwiritsidwa ntchito pazitsulo zokhala ndi makulidwe osakwana 100μm (zochepa thupi). Kudula kwa laser kumadula silicon pogwiritsa ntchito laser yamphamvu kwambiri panjira ya mlembi wa wafer. Komabe, mukamagwiritsa ntchito njira yodulira ya laser (Conventional Laser), filimu yoteteza iyenera kuyikidwa pamwamba pake pasadakhale. Chifukwa chotenthetsera kapena kuyatsa pamwamba pa chowotchacho ndi laser, zolumikizana zakuthupi izi zimatulutsa ma grooves pamwamba pa mtanda, ndipo zidutswa za silicon zodulidwa zimamatiranso pamwamba. Zitha kuwoneka kuti njira yachikhalidwe yodulira laser imadulanso pamwamba pa mtanda, ndipo pankhaniyi, ndi yofanana ndi njira yodulira "tsamba".
Stealth Dicing (SD) ndi njira yoyamba kudula mkati mwa chowotcha ndi mphamvu ya laser, kenako ndikuyika kukakamiza kwakunja kwa tepi yomwe imamangiriridwa kumbuyo kuti iswe, potero kulekanitsa chip. Pamene kupanikizika kumagwiritsidwa ntchito pa tepi kumbuyo, chophikacho chidzakwezedwa nthawi yomweyo m'mwamba chifukwa cha kutambasula kwa tepi, potero kulekanitsa chip. Ubwino wa SD pa njira yachikhalidwe yodulira laser ndi: choyamba, palibe zinyalala za silicon; chachiwiri, kerf (Kerf: m'lifupi mwa mlembi poyambira) ndi yopapatiza, kotero tchipisi zambiri angapezeke. Kuphatikiza apo, kukwapula ndi kusweka kumachepetsedwa kwambiri pogwiritsa ntchito njira ya SD, yomwe ndiyofunikira pamtundu wonse wa kudula. Chifukwa chake, njira ya SD ndiyotheka kukhala ukadaulo wodziwika kwambiri mtsogolo.
Kuthamanga kwa Plasma
Kudula kwa Plasma ndiukadaulo wopangidwa posachedwapa womwe umagwiritsa ntchito etching ya plasma kuti idule panthawi yopanga (Fab). Kudula kwa plasma kumagwiritsa ntchito zida za semi-gas m'malo mwa zakumwa, kotero kukhudzidwa kwa chilengedwe kumakhala kochepa. Ndipo njira yodula mtanda wonse panthawi imodzi imatengedwa, kotero kuti "kudula" liwiro ndi mofulumira. Komabe, njira ya plasma imagwiritsa ntchito gasi wamagetsi ngati zida zopangira, ndipo njira yolumikizira imakhala yovuta kwambiri, chifukwa chake kuyenda kwake kumakhala kovuta. Koma poyerekeza ndi kudula "tsamba" ndi kudula kwa laser, kudula kwa plasma sikuwononga pamwamba, potero kumachepetsa chilema ndikupeza tchipisi zambiri.
Posachedwapa, popeza makulidwe opindikawa adachepetsedwa kukhala 30μm, ndipo mkuwa wambiri (Cu) kapena zida zotsika za dielectric (Low-k) zimagwiritsidwa ntchito. Chifukwa chake, pofuna kupewa ma burrs (Burr), njira zodulira plasma zidzakondedwanso. Zachidziwikire, ukadaulo wodula plasma umakhalanso ukukulirakulira. Ndikukhulupirira kuti posachedwapa, tsiku lina sipadzakhala kufunika kuvala chigoba chapadera pamene etching, chifukwa ichi ndi chitukuko chachikulu malangizo a plasma kudula.
Monga makulidwe a zowotcha akhala mosalekeza kuchepetsedwa kuchokera 100μm kuti 50μm ndiyeno 30μm, njira kudula kupeza tchipisi palokha akhala akusintha ndi kukula kuchokera "kuswa" ndi "tsamba" kudula kwa laser kudula ndi plasma kudula. Ngakhale njira okhwima okhwima kudula achulutsa mtengo kupanga ndondomeko kudula palokha, Komano, ndi kuchepetsa kwambiri zochitika osafunika monga peeling ndi akulimbana kuti nthawi zambiri zimachitika semiconductor chip kudula ndi kuonjezera chiwerengero cha tchipisi anapezedwa pa unit wafer. , mtengo wopangira chip umodzi wasonyeza kutsika. Zachidziwikire, kuchuluka kwa tchipisi zomwe zimapezedwa pagawo lililonse la chophatikizira kumagwirizana kwambiri ndi kuchepa kwa m'lifupi mwa msewu wa dicing. Pogwiritsa ntchito kudula kwa plasma, pafupifupi 20% tchipisi zitha kupezeka poyerekeza ndi kugwiritsa ntchito njira yodulira "tsamba", chomwe ndi chifukwa chachikulu chomwe anthu amasankha kudula kwa plasma. Ndi chitukuko ndi kusintha kwa zopyapyala, mawonekedwe a chip ndi njira zoyikamo, njira zosiyanasiyana zodulira monga ukadaulo wopangira mkate ndi DBG zikuwonekeranso.
Nthawi yotumiza: Oct-10-2024