Semiconductor process flow-Ⅱ

Takulandirani kutsamba lathu kuti mudziwe zambiri zamalonda ndi kukambirana.

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Kuyika kwa Poly ndi SiO2:
Pambuyo pake, Poly ndi SiO2 yochulukirapo imachotsedwa, ndiye kuti, imachotsedwa. Panthawi imeneyi, njiraetchingamagwiritsidwa ntchito. M'gulu la etching, pali gulu la etching Directional etching and non-directional etching. Directional etching imatanthawuzaetchingm'njira inayake, pamene etching yosagwirizana ndi njira (ndinayankhula mwangozi kwambiri. Mwachidule, ndikuchotsa SiO2 m'njira inayake kudzera mu ma acid ndi maziko). Muchitsanzo ichi, timagwiritsa ntchito etching yotsika pansi kuti tichotse SiO2, ndipo imakhala motere.

Pomaliza, chotsani photoresist. Panthawi imeneyi, njira kuchotsa photoresist si kutsegula mwa kuwala walitsa tatchulazi, koma mwa njira zina, chifukwa sitiyenera kufotokoza enieni kukula pa nthawi ino, koma kuchotsa photoresist onse. Pomaliza, zimakhala monga momwe zasonyezedwera mu chithunzi chotsatirachi.

Mwanjira imeneyi, takwaniritsa cholinga chosunga malo enieni a Poly SiO2.

Kupanga gwero ndi kukhetsa:
Pomaliza, tiyeni tione momwe gwero ndi kukhetsa zimapangidwira. Aliyense amakumbukirabe kuti tinakambirana m’magazini yapitayi. Gwero ndi kukhetsa zimayikidwa ndi ayoni ndi mtundu womwewo wa zinthu. Panthawiyi, tikhoza kugwiritsa ntchito photoresist kutsegula malo / malo omwe mtundu wa N uyenera kuikidwa. Popeza timangotenga NMOS monga chitsanzo, magawo onse omwe ali pamwambawa adzatsegulidwa, monga momwe tawonetsera pachithunzichi.

Popeza gawo lomwe laphimbidwa ndi photoresist silingayikidwe (kuunika kwatsekedwa), zinthu zamtundu wa N zimangoyikidwa pa NMOS yofunikira. Popeza gawo lapansi pansi pa poly ndi lotsekedwa ndi poly ndi SiO2, silidzayikidwa, kotero limakhala chonchi.

Panthawiyi, chitsanzo chosavuta cha MOS chapangidwa. Mwachidziwitso, ngati magetsi akuwonjezeredwa ku gwero, kukhetsa, poly ndi gawo lapansi, MOS iyi ikhoza kugwira ntchito, koma sitingangotenga kafukufuku ndikuwonjezera magetsi ku gwero ndi kukhetsa. Panthawiyi, mawaya a MOS akufunika, ndiye kuti, pa MOS iyi, gwirizanitsani mawaya kuti agwirizane ndi MOS ambiri. Tiyeni tiwone njira yolumikizira waya.

Kupanga VIA:
Gawo loyamba ndikuphimba MOS yonse ndi wosanjikiza wa SiO2, monga zikuwonekera pachithunzichi:

Inde, SiO2 iyi imapangidwa ndi CVD, chifukwa imathamanga kwambiri ndipo imasunga nthawi. Zotsatirazi zikadali njira yoyika photoresist ndi kuwonetsa. Pambuyo pake, zikuwoneka ngati izi.

Kenako gwiritsani ntchito njira yotsekera kuti mutseke dzenje pa SiO2, monga momwe zasonyezedwera pagawo la imvi pachithunzichi. Kuya kwa dzenjeli kumalumikizana mwachindunji ndi Si pamwamba.

Pomaliza, chotsani photoresist ndikupeza mawonekedwe otsatirawa.

Pa nthawiyi, chimene chiyenera kuchitika ndi kudzaza kondakitala mu dzenje limeneli. Nanga conductor uyu ndi chiyani? Kampani iliyonse ndi yosiyana, ambiri mwa iwo ndi ma aloyi a tungsten, ndiye kuti dzenjelo lingadzazidwe bwanji? Njira ya PVD (Physical Vapor Deposition) imagwiritsidwa ntchito, ndipo mfundoyi ndi yofanana ndi chithunzi chomwe chili pansipa.

Gwiritsani ntchito ma elekitironi amphamvu kwambiri kapena ma ion kuti muphulitse zinthu zomwe mukufuna, ndipo zinthu zomwe zidasweka zimagwera pansi ngati ma atomu, ndikupanga zokutira pansipa. Zomwe timakonda zomwe timaziwona m'nkhani zimatengera zomwe tikufuna pano.
Pambuyo podzaza dzenjelo, zikuwoneka ngati izi.

Inde, tikadzaza, sizingatheke kulamulira makulidwe a zokutira kuti zikhale zofanana ndendende ndi kuya kwa dzenje, kotero padzakhala zowonjezereka, choncho timagwiritsa ntchito teknoloji ya CMP (Chemical Mechanical Polishing), yomwe imamveka kwambiri. apamwamba, koma kwenikweni akupera, akupera mbali owonjezera. Zotsatira zake zimakhala chonchi.

Panthawiyi, tatsiriza kupanga wosanjikiza wa via. Kumene, kupanga kudzera makamaka kwa mawaya a zitsulo wosanjikiza kumbuyo.

Kupanga zitsulo:
Pazimenezi, timagwiritsa ntchito PVD kutsitsa chitsulo china. Chitsulo ichi makamaka ndi aloyi mkuwa.

Kenako pambuyo poyera ndi etching, timapeza zomwe tikufuna. Kenako pitirizani kuunjika mpaka titapeza zosowa zathu.

Tikajambula masanjidwewo, tidzakuuzani kuti ndi zigawo zingati zazitsulo komanso njira zomwe zimagwiritsidwa ntchito zomwe zitha kusungidwa kwambiri, zomwe zikutanthauza kuti ndi magawo angati omwe angapanikizidwe.
Pomaliza, timapeza dongosolo ili. Chipilala chapamwamba ndi pini ya chip ichi, ndipo mutatha kulongedza, imakhala pini yomwe tingathe kuiwona (zowonadi, ndinajambula mwachisawawa, palibe tanthauzo lenileni, mwachitsanzo).

Izi ndizomwe zimapangidwira kupanga chip. M'magazini ino, taphunzira za kuwonetseratu zofunika kwambiri, etching, ion implantation, ng'anjo machubu, CVD, PVD, CMP, etc. mu semiconductor foundry.