Ukadaulo wa laser umatsogolera kusintha kwaukadaulo wa silicon carbide substrate processing

1. Chidule chasilicon carbide gawo lapansiprocessing luso

Apanosilicon carbide gawo lapansi kukonza masitepe akuphatikizapo: akupera bwalo akunja, slicing, chamfering, akupera, kupukuta, kuyeretsa, etc. Slicing ndi sitepe yofunika kwambiri pa semiconductor gawo lapansi processing ndi sitepe yofunika kutembenuza ingot ku gawo lapansi. Pakali pano, kudula kwasilicon carbide magawomakamaka kudula waya. Multi-waya slurry kudula ndi njira yabwino kwambiri yodulira mawaya pakadali pano, komabe pali zovuta zodula bwino komanso kudula kwakukulu. Kutayika kwa waya kudula kudzawonjezeka ndi kukula kwa gawo lapansi, zomwe sizikugwirizana ndisilicon carbide gawo lapansiopanga kuti akwaniritse kuchepetsa mtengo komanso kukonza bwino. M'kati mwa kudula8-inch silicon carbide magawo, mawonekedwe a pamwamba a gawo lapansi omwe amapezedwa ndi kudula waya ndi osauka, ndipo zizindikiro za chiwerengero monga WARP ndi BOW si zabwino.

Kudula ndi gawo lofunikira pakupanga gawo lapansi la semiconductor. Makampaniwa akuyesera njira zatsopano zodulira, monga kudula waya wa diamondi ndi kuvula laser. Ukadaulo wochotsa ma laser wakhala ukufunidwa kwambiri posachedwa. Kukhazikitsidwa kwaukadaulowu kumachepetsa kutayika ndikuwongolera kudula bwino kuchokera kuukadaulo. Njira yochotsera laser ili ndi zofunika kwambiri pamlingo wa automation ndipo imafuna ukadaulo wopatulira kuti ugwirizane nayo, zomwe zikugwirizana ndi chitukuko chamtsogolo cha silicon carbide substrate processing. Zokolola za kagawo kakang'ono kodula waya wamatope nthawi zambiri zimakhala 1.5-1.6. Kukhazikitsidwa kwaukadaulo wa laser stripping kumatha kukulitsa zokolola mpaka pafupifupi 2.0 (onani zida za DISCO). M'tsogolomu, pamene kukhwima kwa luso la laser stripping kumawonjezeka, zokolola za kagawo zikhoza kusinthidwa; nthawi yomweyo, kuvula kwa laser kumathanso kupititsa patsogolo luso la kudula. Malinga ndi kafukufuku wamsika, mtsogoleri wamakampani DISCO amadula kagawo pafupifupi mphindi 10-15, zomwe zimakhala zogwira mtima kwambiri kuposa kudula kwa waya wamtondo wa mphindi 60 pagawo lililonse.

Njira zodulira mawaya amtundu wa silicon carbide ndi: kudula-waya-kupukuta-kupukuta-kupukuta-kupukuta ndi kupukuta bwino. Pambuyo pochotsa laser m'malo mwake kudula waya, njira yopatulira imagwiritsidwa ntchito m'malo mwa akupera, omwe amachepetsa kutayika kwa magawo ndikuwongolera magwiridwe antchito. Kudula kwa laser kudula, kugaya ndi kupukuta kwa silicon carbide substrates kumagawidwa m'magawo atatu: laser pamwamba pa scanning-substrate stripping-ingot flattening: laser pamwamba kupanga sikani ndi kugwiritsa ntchito ultrafast laser pulses pokonza pamwamba pa ingot kupanga kusinthidwa. wosanjikiza mkati mwa ingot; kuvula gawo lapansi ndikulekanitsa gawo lapansi pamwamba pa wosanjikiza wosinthidwa kuchokera ku ingot ndi njira zakuthupi; ingot flattening ndi kuchotsa wosanjikiza kusinthidwa pamwamba pa ingot kuonetsetsa flatness wa ingot pamwamba.
Silicon carbide laser stripping process

 
2. Kupita patsogolo kwapadziko lonse muukadaulo wakuchotsa laser ndi makampani omwe akutenga nawo gawo

Njira yochotsera laser idakhazikitsidwa koyamba ndi makampani akunja: Mu 2016, DISCO yaku Japan idapanga ukadaulo watsopano wa laser slicing KABRA, womwe umakhala wosanjikiza wolekanitsa ndikulekanitsa zopindika mozama ndikuyatsa ingot ndi laser, yomwe ingagwiritsidwe ntchito zosiyanasiyana. mitundu ya SiC ingots. Mu Novembala 2018, Infineon Technologies idapeza Siltectra GmbH, choyambira chodula chophatikizika, kwa ma euro 124 miliyoni. Omalizawa adapanga njira ya Cold Split, yomwe imagwiritsa ntchito ukadaulo wa laser wovomerezeka kutanthauzira mitundu yogawika, kuvala zida zapadera za polima, kuwongolera kuziziritsa komwe kumapangitsa kupsinjika, zida zogawanika molondola, ndikupera ndi kuyeretsa kuti mukwaniritse kudula.

M'zaka zaposachedwa, makampani ena apakhomo adalowanso m'makampani opanga zida za laser: makampani akuluakulu ndi Han's Laser, Delong Laser, West Lake Instrument, Universal Intelligence, China Electronics Technology Group Corporation ndi Institute of Semiconductors ya Chinese Academy of Sciences. Pakati pawo, makampani otchulidwa Han's Laser ndi Delong Laser akhala akukonzedwa kwa nthawi yaitali, ndipo malonda awo akutsimikiziridwa ndi makasitomala, koma kampaniyo ili ndi mizere yambiri ya mankhwala, ndipo zipangizo zochotsera laser ndi imodzi mwa malonda awo. Zogulitsa za nyenyezi zomwe zikukwera monga West Lake Instrument zakwanitsa kutumiza mwadongosolo; Universal Intelligence, China Electronics Technology Group Corporation 2, Institute of Semiconductors ya Chinese Academy of Sciences ndi makampani ena atulutsanso kupita patsogolo kwa zida.

3. Zinthu zoyendetsera chitukuko chaukadaulo wa laser stripping komanso kamvekedwe kakuyambitsa msika

Kuchepetsa mitengo ya magawo 6-inch silicon carbide kumayendetsa chitukuko chaukadaulo wa laser stripping: Pakali pano, mtengo wa 6-inch silicon carbide substrates watsika pansi pa 4,000 yuan/chidutswa, kuyandikira mtengo wamtengo wa opanga ena. Njira yochotsera laser imakhala ndi zokolola zambiri komanso phindu lamphamvu, zomwe zimayendetsa kuchuluka kwa ukadaulo wa laser stripping.

Kupatulira kwa magawo 8-inch silicon carbide kumayendetsa chitukuko chaukadaulo wa laser stripping. Njira yodulira waya siigwira ntchito mu 8-inch silicon carbide processing (gawo la gawo lapansi silili bwino), ndipo mfundo za BOW ndi WARP zawonongeka kwambiri. Kuvula kwa laser kumawonedwa ngati ukadaulo wofunikira wopangira 350um silicon carbide substrate processing, yomwe imayendetsa kuchuluka kwa ukadaulo wa laser stripping.

Zoyembekeza za msika: Zida zochotsera laser za SiC substrate zimapindula ndi kukulitsa kwa 8-inch SiC komanso kutsika mtengo kwa 6-inch SiC. Pakali pano nsonga yofunika kwambiri yamakampani ikuyandikira, ndipo chitukuko cha mafakitale chidzafulumizitsa kwambiri.