Teknụzụ laser na-eduga mgbanwe nke teknụzụ nhazi mkpụrụ osisi silicon carbide

 

1. Nchịkọta nkesilicon carbide mkpụrụteknụzụ nhazi

Nke ugbu asilicon carbide mkpụrụ nhazi usoro na-agụnye: egweri elu okirikiri, slicing, chamfering, egweri, polishing, ihicha, wdg Slicing bụ ihe dị mkpa nzọụkwụ na semiconductor substrate nhazi na isi nzọụkwụ na converting ingot na mkpụrụ. Ugbu a, ọnwụ nkesilicon carbide substratesbụ tumadi ịcha waya. Multi-waya slurry ọnwụ bụ kacha mma waya usoro ugbu a, ma a ka nwere nsogbu nke adịghị mma ọnwụ mma na nnukwu ọnwụ ọnwụ. Ọnwụ nke ịcha waya ga-abawanye na mmụba nke nha mkpụrụ, nke na-adịghị mma maka yasilicon carbide mkpụrụndị na-emepụta ihe iji nweta mbelata ọnụ ahịa na nkwalite arụmọrụ. Na usoro ịkpụ8-inch silicon carbide ihe eji eme ihe, ọdịdị elu nke mkpụrụ nke enwetara site na ịcha waya adịghị mma, na njirimara ọnụọgụ dị ka WARP na BOW adịghị mma.

Iberibe bụ nzọụkwụ dị mkpa n'ichepụta mkpụrụ nke semiconductor. Ụlọ ọrụ ahụ na-agbalị mgbe niile ụzọ ọhụrụ ịkpụ, dị ka ịcha waya diamond na ịpụpụ laser. Achọsiwo teknụzụ ịwepu laser nke ukwuu n'oge na-adịbeghị anya. Okwu mmeghe nke teknụzụ a na-ebelata mbelata mbelata ma na-eme ka ọ dị mma site na ụkpụrụ teknụzụ. Ngwọta nkedo laser nwere ihe dị elu chọrọ maka ọkwa nke akpaaka ma na-achọ teknụzụ thinning iji kwado ya, nke kwekọrọ na ntụziaka mmepe n'ọdịnihu nke nhazi mkpụrụ osisi silicon carbide. Mpekere nke ịkpụ waya ngwa ngwa ọdịnala na-abụkarị 1.5-1.6. Iwebata teknụzụ ịpụpụ laser nwere ike ịbawanye mkpụrụ nke iberi ruo ihe dịka 2.0 (tụ aka na akụrụngwa DISCO). N'ọdịnihu, dị ka ntozu nke teknụzụ ịdọpụ laser na-abawanye, mkpụrụ nke ibe nwere ike imeziwanye; N'otu oge ahụ, iwepụ laser nwekwara ike imeziwanye arụmọrụ nke slicing. Dị ka nyocha ahịa si kwuo, onye isi ụlọ ọrụ DISCO na-egbutu iberi n'ime ihe dị ka nkeji 10-15, nke na-arụ ọrụ nke ọma karịa ka a na-egbutu waya ngwa agha ugbu a nke nkeji 60 kwa iberi.

Usoro usoro nke ịcha waya ọdịnala nke silicon carbide substrates bụ: waya ịcha-ike egweri-mma egweri-ike polishing na ezi polishing. Mgbe usoro ịwepụ laser na-anọchi anya ịcha waya, a na-eji usoro mkparị mee ihe iji dochie usoro nsị, nke na-ebelata mfu nke mpekere ma na-emeziwanye nhazi nhazi. A na-ekewa usoro iwepụ laser nke ịkpụ, ichicha na polishing nke silicon carbide substrates na nzọụkwụ atọ: laser surface scanning-substrate stripping-ingot flattening: laser surface scanning bụ iji ultrafast laser pulses iji hazie elu nke ingot iji mepụta mgbanwe. oyi akwa n'ime ingot; nkewa nke mkpụrụ osisi bụ ikewapụ mkpụrụ n'elu oyi akwa gbanwetụrụ site na ingot site na usoro anụ ahụ; ingot flattening bụ iwepụ oyi akwa gbanwetụrụ n'elu nke ingot iji hụ na ọ dị larịị nke elu ingot.
Silicon carbide laser iwepụ usoro

 

2. Ọganihu mba ụwa na teknụzụ ịpụpụ laser na ụlọ ọrụ na-esonye na ụlọ ọrụ

Ụlọ ọrụ esenidụt bụ nke mbụ nakweere usoro ịwepụ laser: N'afọ 2016, DISCO Japan mepụtara teknụzụ slicing laser ọhụrụ KABRA, nke na-emepụta oyi akwa nkewa ma kewaa wafers na omimi a kapịrị ọnụ site n'ịga n'ihu na-egbuke egbuke ingot na laser, nke enwere ike iji mee ihe dị iche iche. ụdị SiC ingots. Na Nọvemba 2018, Infineon Teknụzụ nwetara Siltectra GmbH, mmalite mbelata wafer, maka nde euro 124. Nke ikpeazụ mepụtara usoro Cold Split, nke na-eji teknụzụ laser nwere ikike iji kọwaa oke nkewa, kpuchie ihe ndị polymer pụrụ iche, sistemu sistemu na-eme ka ahụ dị jụụ, ihe kewara nke ọma, na-egweri ma dị ọcha iji nweta ịcha wafer.

N'ime afọ ndị na-adịbeghị anya, ụfọdụ ụlọ ọrụ ụlọ abanyekwala n'ụlọ ọrụ na-ewepụ laser: ụlọ ọrụ ndị bụ isi bụ Han's Laser, Delong Laser, West Lake Instrument, Intelligence Universal, China Electronics Technology Group Corporation na Institute of Semiconductor of the Chinese Academy of Sciences. N'ime ha, ụlọ ọrụ ndị edepụtara aha Han's Laser na Delong Laser anọwo na nhazi ogologo oge, na ndị ahịa na-enyocha ngwaahịa ha, mana ụlọ ọrụ ahụ nwere ọtụtụ ahịrị ngwaahịa, na ngwá ọrụ laser bụ naanị otu n'ime azụmahịa ha. Ngwaahịa nke kpakpando na-ebili dị ka West Lake Instrument enwetala mbupu n'usoro; Ọgụgụ isi nke Universal, China Electronics Technology Group Corporation 2, Institute of Semiconductor of the Chinese Academy of Sciences na ụlọ ọrụ ndị ọzọ ewepụtala ọganihu akụrụngwa.

 

3. Ihe ndị na-akwọ ụgbọala maka mmepe nke teknụzụ ịdọpụ laser na ụda nke ntinye ahịa

Mbelata ọnụahịa nke 6-inch silicon carbide substrates na-akpali mmepe nke teknụzụ ịpụpụ laser: Ka ọ dị ugbu a, ọnụahịa nke 6-inch silicon carbide substrates adaala n'okpuru 4,000 yuan / ibe, na-eru nso ọnụahịa nke ụfọdụ ndị nrụpụta. Usoro iwepụ laser nwere ọnụ ọgụgụ dị elu nke mkpụrụ na uru siri ike, nke na-eme ka ọnụ ọgụgụ ntinye nke nkà na ụzụ laser na-abawanye.

Mbelata nke mkpụrụ osisi silicon carbide nke anụ ọhịa 8 na-akpali mmepe nke teknụzụ ịpụpụ laser: ọkpụrụkpụ nke 8-inch silicon carbide substrates bụ ugbu a 500um, ma na-etolite na ọkpụrụkpụ nke 350um. Usoro ịkpụ waya adịghị arụ ọrụ na nhazi silicon carbide 8-inch (elu ala adịghị mma), na ụkpụrụ BOW na WARP emebiwo nke ukwuu. A na-ahụta ịpụpụ laser dị ka teknụzụ nhazi dị mkpa maka nhazi mkpụrụ osisi silicon carbide 350um, nke na-eme ka ọnụego ntinye nke teknụzụ iwepụ laser na-abawanye.

Atụmanya ahịa: SiC substrate laser dọpụ akụrụngwa na-erite uru site na mgbasawanye nke 8-inch SiC yana mbelata ọnụ ahịa nke 6-inch SiC. Isi ihe dị egwu nke ụlọ ọrụ dị ugbu a na-abịaru nso, mmepe nke ụlọ ọrụ ahụ ga-abawanye ngwa ngwa.