Vim li cas thiaj xav tau thinning?

Nyob rau hauv lub back-end txheej txheem, lubwafer (silicon wafernrog circuits nyob rau hauv pem hauv ntej) yuav tsum tau thinned nyob rau sab nraum qab ua ntej tom qab dicing, vuam thiab ntim kom txo tau lub pob mounting qhov siab, txo cov nti pob ntim, txhim kho lub nti lub thermal diffusion efficiency, hluav taws xob kev ua tau zoo, txhua yam khoom thiab txo tus nqi ntawm cov khoom. dicing. Rov qab sib tsoo muaj qhov zoo ntawm kev ua haujlwm siab thiab tus nqi qis. Nws tau hloov cov tsoos ntub dej etching thiab ion etching txheej txheem los ua qhov tseem ceeb tshaj plaws rov qab thinning tshuab.

Lub thinned wafer

Yuav ua li cas nyias?

Cov txheej txheem tseem ceeb ntawm wafer thinning hauv cov txheej txheem ntim khoom

Cov kauj ruam tshwj xeeb ntawmwaferthinning yog txhawm rau ua cov wafer ua tiav rau cov yeeb yaj kiab thinning, thiab tom qab ntawd siv lub tshuab nqus tsev los nqus cov zaj duab xis nyias thiab cov nti ntawm nws mus rau lub rooj ntxeem tau ceramic wafer, kho cov kab hauv nruab nrab thiab sab hauv lub voj voog ntawm cov chaw ua haujlwm ntawm cov khoom siv. khob-zoo li pob zeb diamond sib tsoo log mus rau qhov chaw ntawm silicon wafer, thiab cov silicon wafer thiab cov sib tsoo log tig ib ncig ntawm lawv cov axes rau kev txiav-hauv kev sib tsoo. Kev sib tsoo muaj peb theem: kev sib tsoo ntxhib, zoo sib tsoo thiab polishing.

Lub wafer tawm los ntawm lub Hoobkas wafer yog rov qab-grinded kom nyias lub wafer mus rau thickness yuav tsum tau rau ntim. Thaum sib tsoo lub wafer, daim kab xev yuav tsum tau siv rau pem hauv ntej (Active Area) los tiv thaiv cheeb tsam Circuit Court, thiab sab nraub qaum yog hauv av tib lub sijhawm. Tom qab sib tsoo, tshem tawm daim kab xev thiab ntsuas lub thickness.
Cov txheej txheem sib tsoo uas tau ua tiav rau kev npaj silicon wafer suav nrog cov lus teb sib tsoo,silicon waferKev sib hloov kev sib tsoo, kev sib tsoo ob sab, thiab lwm yam. Nrog rau kev txhim kho qhov zoo ntawm qhov chaw ntawm ib leeg siv lead ua silicon wafers, cov kev sib tsoo tshiab tau tsim los tas li, xws li TAIKO sib tsoo, tshuaj lom neeg sib tsoo, polishing sib tsoo thiab planetary disc sib tsoo.

Rotary rooj sib tsoo:

Rotary rooj sib tsoo (rotary rooj sib tsoo) yog txheej txheem sib tsoo thaum ntxov siv hauv silicon wafer npaj thiab rov qab thinning. Nws lub hauv paus ntsiab lus yog qhia nyob rau hauv daim duab 1. Lub silicon wafers yog tsau ntawm lub suction khob ntawm lub rotating lub rooj, thiab tig synchronously tsav los ntawm lub rotating lub rooj. Cov silicon wafers lawv tus kheej tsis tig ib ncig ntawm lawv axis; lub log sib tsoo yog pub axially thaum tig ntawm kev kub ceev, thiab txoj kab uas hla ntawm lub log sib tsoo yog loj dua li txoj kab uas hla ntawm silicon wafer. Muaj ob hom kev sib tsoo rooj sib tsoo: ntsej muag plunge sib tsoo thiab ntsej muag tangential sib tsoo. Nyob rau hauv lub ntsej muag plunge sib tsoo, lub sib tsoo lub log dav yog loj dua lub silicon wafer txoj kab uas hla, thiab lub sib tsoo lub spindle feeds tsis tu ncua raws nws axial kev taw qhia kom txog rau thaum tus tshaj yog tiav, thiab ces lub silicon wafer yog tig nyob rau hauv lub tsav ntawm lub rooj teb; Nyob rau hauv lub ntsej muag tangential sib tsoo, lub sib tsoo log pub raws nws axial kev taw qhia, thiab silicon wafer yog txuas ntxiv tig nyob rau hauv lub tsav ntawm lub rotating disk, thiab kev sib tsoo tiav los ntawm reciprocating pub (reciprocation) los yog creep feeding (creepfeed).

Daim duab 1, schematic daim duab ntawm rotary rooj sib tsoo (lub ntsej muag tangential) txoj cai

Piv nrog rau txoj kev sib tsoo, rotary rooj sib tsoo muaj qhov zoo ntawm kev tshem tawm siab, me me kev puas tsuaj, thiab yooj yim automation. Txawm li cas los xij, qhov sib tsoo tiag tiag (kev sib tsoo) B thiab lub kaum sab xis θ (lub kaum sab xis ntawm lub voj voog sab nrauv ntawm lub log sib tsoo thiab lub voj voog sab nrauv ntawm silicon wafer) hauv kev sib tsoo hloov nrog kev hloov ntawm txoj haujlwm txiav. ntawm lub log sib tsoo, ua rau muaj kev sib tsoo tsis ruaj khov, ua rau nws nyuaj kom tau txais qhov zoo tshaj plaws ntawm qhov raug (siab TTV tus nqi), thiab yooj yim ua rau muaj qhov tsis xws luag xws li ntug vau thiab ntug vau. Lub rooj sib tsoo tshuab yog tsuas yog siv rau kev ua ntawm ib leeg-crystal silicon wafers hauv qab 200mm. Qhov nce ntawm qhov loj ntawm ib leeg-crystal silicon wafers tau muab tso rau hauv cov kev xav tau ntau dua rau qhov raug thiab cov lus tsa suab raug ntawm cov cuab yeej ua haujlwm, yog li lub rooj sib tsoo tsis haum rau kev sib tsoo ntawm ib leeg-crystal silicon wafers saum toj 300mm.
Txhawm rau txhim kho kev sib tsoo, kev lag luam dav hlau tangential sib tsoo cov cuab yeej siv feem ntau siv cov qauv sib tsoo ntau. Piv txwv li, cov txheej txheem sib tsoo cov log thiab cov txheej txheem sib tsoo zoo yog nruab rau ntawm cov khoom siv, thiab lub rooj sib hloov tig ib lub voj voog kom tiav cov kev sib tsoo thiab kev sib tsoo zoo nyob rau hauv lem. Cov khoom siv no suav nrog G-500DS ntawm American GTI Company (Daim duab 2).

Daim duab 2, G-500DS rotary rooj sib tsoo khoom ntawm GTI Company hauv Tebchaws Meskas

Silicon wafer rotation sib tsoo:

Txhawm rau ua kom tau raws li qhov xav tau ntawm qhov loj-loj silicon wafer npaj thiab rov qab ua dua tshiab, thiab tau txais qhov tseeb saum npoo nrog zoo TTV tus nqi. Xyoo 1988, tus kws tshawb fawb Nyij Pooj Matsui tau npaj ib txoj kev sib tw silicon wafer sib tsoo (hauv-feedgrinding). Nws lub hauv paus ntsiab lus yog qhia nyob rau hauv daim duab 3. Ib leeg siv lead ua silicon wafer thiab khob-zoo li lub pob zeb diamond sib tsoo log adsorbed ntawm lub workbench tig ib ncig ntawm lawv cov axes, thiab lub sib tsoo log yog tsis tu ncua pub raws axial kev taw qhia tib lub sij hawm. Ntawm lawv, txoj kab uas hla ntawm kev sib tsoo log yog loj dua li txoj kab uas hla ntawm cov txheej txheem silicon wafer, thiab nws ncig hla mus rau qhov chaw ntawm silicon wafer. Txhawm rau txo qhov sib tsoo quab yuam thiab txo qhov sib tsoo kub, lub tshuab nqus tsev nqus lub khob feem ntau yog muab txiav rau hauv ib qho convex los yog concave zoo los yog lub kaum sab xis ntawm lub sib tsoo log spindle thiab lub khob nqus dej ntxaiv axis yog kho kom ntseeg tau tias kev sib cuag ntawm ib nrab ntawm qhov sib tsoo. sib tsoo log thiab silicon wafer.

Daim duab 3, Schematic daim duab ntawm silicon wafer teb sib tsoo txoj cai

Piv nrog cov lus teb sib tsoo, silicon wafer rotary sib tsoo muaj qhov zoo hauv qab no: ① Kev sib tsoo ib zaug ib zaug tuaj yeem ua cov khoom loj-loj silicon wafers tshaj 300mm; ② Qhov sib tsoo tiag tiag B thiab lub kaum sab xis θ yog qhov tsis tu ncua, thiab kev sib tsoo quab yuam kuj ruaj khov; ③ Los ntawm kev kho lub kaum sab xis ntawm kev sib tsoo log axis thiab silicon wafer axis, lub ntsej muag zoo ntawm ib leeg siv lead ua silicon wafer tuaj yeem tswj tau kom tau txais qhov zoo ntawm qhov raug. Tsis tas li ntawd, qhov sib tsoo thiab txiav lub kaum sab xis θ ntawm silicon wafer rotary sib tsoo kuj muaj qhov zoo ntawm cov npoo loj sib tsoo, yooj yim hauv online thickness thiab nrhiav kom tau zoo thiab tswj, cov khoom siv compact, yooj yim ntau chaw nres tsheb sib tsoo, thiab kev sib tsoo siab.
Txhawm rau txhim kho kev ua tau zoo thiab ua tau raws li cov kev xav tau ntawm cov khoom siv semiconductor, cov khoom siv sib tsoo ua lag luam raws li lub hauv paus ntsiab lus ntawm silicon wafer rotary sib tsoo txais yuav ntau tus spindle multi-station qauv, uas tuaj yeem ua tiav kev sib tsoo thiab kev sib tsoo zoo hauv ib qho chaw thau khoom thiab tshem tawm. . Ua ke nrog lwm cov chaw pabcuam, nws tuaj yeem paub qhov kev sib tsoo tsis siv neeg ntawm ib leeg siv lead ua silicon wafers "qhuav-hauv / qhuav-tawm" thiab "cassette rau cassette".

Ob-sided sib tsoo:

Thaum cov silicon wafer sib tsoo cov txheej txheem sab sauv thiab sab qis ntawm silicon wafer, lub workpiece yuav tsum tau muab tig thiab ua raws li cov kauj ruam, uas txwv kev ua haujlwm. Nyob rau tib lub sijhawm, silicon wafer rotary sib tsoo muaj qhov yuam kev ntawm qhov luam tawm (tshwj xeeb) thiab cov cim sib tsoo (sib tsoo), thiab nws tsis tuaj yeem tshem tawm qhov tsis xws luag xws li waviness thiab taper rau saum npoo ntawm ib qho siv lead ua silicon wafer tom qab xaim txiav. (multi-saw), raws li qhia hauv daim duab 4. Txhawm rau kov yeej cov teeb meem saum toj no, ob txoj kev sib tsoo tshuab (doublesidegrinding) tau tshwm sim nyob rau xyoo 1990, thiab nws cov ntsiab lus tau pom nyob rau hauv daim duab 5. Cov clamps symmetrically faib rau ob sab clamp ib leeg siv lead ua silicon wafer nyob rau hauv lub nplhaib tuav thiab tig maj mam tsav los ntawm cov menyuam. Ib khub ntawm lub khob zoo li pob zeb diamond sib tsoo lub log yog nyob ntawm ob sab ntawm ib leeg siv lead ua silicon wafer. Tsav los ntawm cov huab cua bearing hluav taws xob ntxaiv, lawv tig nyob rau hauv opposite lus qhia thiab pub axially kom ua tiav ob sab sib tsoo ntawm ib leeg siv lead ua silicon wafer. Raws li tuaj yeem pom los ntawm daim duab, kev sib tsoo ob sab tuaj yeem tshem tawm cov waviness thiab taper ntawm ib qho siv lead ua silicon wafer tom qab xaim txiav. Raws li kev npaj ntawm kev sib tsoo log axis, ob sab sib tsoo tuaj yeem ua kab rov tav thiab ntsug. Ntawm lawv, kab rov tav ob sab sib tsoo tuaj yeem txo qhov cuam tshuam ntawm silicon wafer deformation los ntawm qhov hnyav ntawm silicon wafer ntawm kev sib tsoo zoo, thiab nws yooj yim los xyuas kom meej tias cov txheej txheem sib tsoo ntawm ob sab ntawm ib leeg siv lead ua silicon. wafer yog tib yam, thiab cov abrasive hais thiab sib tsoo chips tsis yooj yim nyob rau saum npoo ntawm ib leeg siv lead ua silicon wafer. Nws yog ib txoj kev sib tsoo zoo tagnrho.

Daim duab 4, "Yuav ua li cas luam" thiab hnav cov cim tsis xws luag hauv silicon wafer rotation sib tsoo

Daim duab 5, schematic daim duab ntawm ob sab sib tsoo txoj cai

Daim duab 1 qhia txog kev sib piv ntawm kev sib tsoo thiab ob sab sib tsoo ntawm peb hom ntawm ib leeg siv lead ua silicon wafers. Kev sib tsoo ob sab feem ntau yog siv rau kev ua silicon wafer hauv qab 200mm, thiab muaj cov txiaj ntsig siab wafer. Vim yog kev siv lub log sib tsoo ruaj khov, kev sib tsoo ntawm ib leeg-crystal silicon wafers tuaj yeem tau txais qhov zoo dua qhov zoo dua li ntawm ob sab sib tsoo. Yog li ntawd, ob qho tib si silicon wafer teb sib tsoo thiab ob sab sib tsoo tuaj yeem ua tau raws li qhov yuav tsum tau ua ntawm 300mm silicon wafers, thiab tam sim no yog cov txheej txheem tseem ceeb tshaj plaws. Thaum xaiv ib txoj kev ua silicon wafer flattening, nws yog ib qho tsim nyog yuav tsum tau ua tib zoo xav txog qhov yuav tsum tau muaj ntawm txoj kab uas hla loj, nto zoo, thiab polishing wafer ua tshuab ntawm ib leeg-crystal silicon wafer. Lub nraub qaum ntawm lub wafer tsuas tuaj yeem xaiv txoj kev ua haujlwm ib leeg xwb, xws li silicon wafer teb sib tsoo txoj kev.

Ntxiv rau kev xaiv txoj kev sib tsoo hauv silicon wafer sib tsoo, nws tseem yuav tsum tau txiav txim siab xaiv cov txheej txheem tsim nyog xws li lub siab zoo, sib tsoo log loj, sib tsoo log, sib tsoo log ceev, silicon wafer ceev, sib tsoo kua viscosity thiab flow rate, thiab lwm yam, thiab txiav txim siab txoj kev tsim nyog. Feem ntau, cov txheej txheem sib tsoo segmented nrog rau kev sib tsoo ntxhib, kev sib tsoo semi-tiav, kev sib tsoo, tsis muaj kev sib tsoo thiab qeeb rov qab yog siv kom tau txais ib qho siv lead ua silicon wafers nrog kev ua haujlwm siab, siab nto flatness thiab tsis tshua muaj kev puas tsuaj.