Dual-Damascene yog txheej txheem thev naus laus zis siv los tsim cov hlau sib txuas hauv kev sib txuas ua ke. Nws yog kev txhim kho ntxiv ntawm cov txheej txheem Damascus. Los ntawm kev tsim los ntawm qhov thiab grooves nyob rau tib lub sij hawm nyob rau hauv tib cov txheej txheem cov kauj ruam thiab sau lawv nrog hlau, cov kev tsim khoom ntawm hlau interconnects yog pom tau hais tias.
Vim li cas nws thiaj hu ua Damascus?
Lub nroog Damascus yog lub nroog ntawm Syria, thiab Damascus ntaj nto moo rau lawv cov ntse thiab zoo nkauj zoo nkauj. Yuav tsum muaj cov txheej txheem inlay: ua ntej, cov qauv yuav tsum tau kos rau ntawm lub ntsej muag ntawm Damascus steel, thiab cov ntaub ntawv npaj ua ntej yog nruj nreem kaw rau hauv cov grooves engraved. Tom qab lub inlay tiav lawm, qhov saum npoo yuav tsis sib npaug me ntsis. Tus kws ua haujlwm yuav ua tib zoo polish nws kom ntseeg tau tias tag nrho cov smoothness. Thiab cov txheej txheem no yog tus qauv ntawm cov txheej txheem Damascus dual ntawm cov nti. Ua ntej, grooves los yog qhov yog engraved nyob rau hauv lub dielectric txheej, thiab ces hlau yog sau rau hauv lawv. Tom qab sau, cov hlau ntau dhau yuav raug tshem tawm los ntawm cmp.
Cov kauj ruam tseem ceeb ntawm cov txheej txheem dual damascene muaj xws li:
▪ Deposition ntawm dielectric txheej:
Tso ib txheej ntawm cov khoom siv dielectric, xws li silicon dioxide (SiO2), rau ntawm cov khoom siv semiconductorwafer.
▪ Photolithography los txhais cov qauv:
Siv photolithography los txhais cov qauv ntawm vias thiab trenches ntawm txheej dielectric.
▪Etching:
Hloov cov qauv ntawm vias thiab trenches mus rau txheej dielectric los ntawm cov txheej txheem qhuav lossis ntub dej.
▪ Deposition ntawm hlau:
Deposit hlau, xws li tooj liab (Cu) los yog txhuas (Al), nyob rau hauv vias thiab trenches los ua hlau interconnects.
▪ Chemical mechanical polishing:
Tshuaj kho tshuab polishing ntawm cov hlau nto kom tshem tawm cov hlau ntau dhau thiab ua kom lub ntsej muag.
Piv nrog rau cov txheej txheem kev sib txuas ntawm cov hlau tsoos, cov txheej txheem dual damascene muaj qhov zoo hauv qab no:
▪ Cov txheej txheem yooj yim:los ntawm kev tsim vias thiab trenches ib txhij hauv tib cov txheej txheem, cov txheej txheem cov kauj ruam thiab lub sijhawm tsim khoom raug txo.
▪ Txhim kho kev tsim khoom:vim qhov txo qis ntawm cov txheej txheem, cov txheej txheem dual damascene tuaj yeem txhim kho kev tsim khoom thiab txo cov nqi tsim khoom.
▪ Txhim kho kev ua haujlwm ntawm cov hlau sib txuas:cov txheej txheem dual damascene tuaj yeem ua tiav txoj kev sib tshuam ntawm cov hlau me me, yog li txhim kho kev sib koom ua ke thiab kev ua haujlwm ntawm circuits.
▪ Txo cov kab mob parasitic capacitance thiab tsis kam:los ntawm kev siv cov khoom siv hluav taws xob tsawg-k dielectric thiab optimizing cov qauv ntawm cov hlau sib txuas, cov kab mob parasitic capacitance tuaj yeem txo qis, txhim kho kev ceev thiab kev siv hluav taws xob ntawm circuits.
Post lub sij hawm: Nov-25-2024