Qee cov organic thiab inorganic yuav tsum tau koom nrog hauv kev tsim khoom semiconductor. Tsis tas li ntawd, txij li cov txheej txheem ib txwm ua nyob rau hauv chav huv nrog tib neeg kev koom tes, semiconductorwafersyog inevitably paug los ntawm ntau yam impurities.
Raws li qhov chaw thiab qhov xwm txheej ntawm cov kab mob, lawv tuaj yeem muab faib ua plaub pawg: cov khoom, cov organic, hlau ions thiab oxides.
1. Particle:
Cov khoom feem ntau yog qee cov polymers, photoresists thiab etching impurities.
Cov kab mob zoo li no feem ntau vam khom rau cov rog sib xyaw ua ke rau adsorb rau saum npoo ntawm wafer, cuam tshuam rau kev tsim cov duab geometric thiab cov hluav taws xob tsis zoo ntawm cov cuab yeej photolithography txheej txheem.
Cov kab mob zoo li no feem ntau raug tshem tawm los ntawm maj mam txo lawv qhov chaw sib cuag nrog rau qhov chaw ntawm qhov chawwaferlos ntawm kev siv lub cev lossis tshuaj lom neeg.
2. Organic teeb meem:
Cov peev txheej ntawm cov organic impurities yog qhov dav, xws li tib neeg cov tawv nqaij roj, cov kab mob, cov roj tshuab, lub tshuab nqus tsev roj, photoresist, ntxuav cov kuab tshuaj, thiab lwm yam.
Cov kab mob zoo li no feem ntau tsim cov yeeb yaj kiab organic rau ntawm qhov chaw ntawm wafer los tiv thaiv cov kua ntxuav kom tsis txhob ncav cuag qhov chaw ntawm lub wafer, uas ua rau kev tu tsis tiav ntawm wafer nto.
Kev tshem tawm cov kab mob no feem ntau ua tiav hauv thawj kauj ruam ntawm kev ntxuav, feem ntau yog siv cov tshuaj xws li sulfuric acid thiab hydrogen peroxide.
3. Hlau ions:
Cov hlau tsis huv muaj xws li hlau, tooj liab, txhuas, chromium, cam khwb cia hlau, titanium, sodium, potassium, lithium, thiab lwm yam. Cov khoom siv tseem ceeb yog ntau yam khoom siv, kav dej, tshuaj reagents, thiab hlau ua paug thaum hlau sib txuas ua haujlwm.
Hom impurity no feem ntau raug tshem tawm los ntawm cov txheej txheem tshuaj los ntawm kev tsim cov hlau ion complexes.
4. Oxide:
Thaum semiconductorwafersraug rau ib puag ncig uas muaj oxygen thiab dej, ib txheej oxide ntuj yuav tsim rau ntawm qhov chaw. Cov yeeb yaj kiab oxide no yuav cuam tshuam ntau cov txheej txheem hauv kev tsim khoom semiconductor thiab tseem muaj qee yam hlau impurities. Nyob rau hauv tej yam kev mob, lawv yuav tsim hluav taws xob tsis xws luag.
Kev tshem tawm ntawm cov yeeb yaj kiab oxide no feem ntau ua tiav los ntawm soaking hauv dilute hydrofluoric acid.
Kev tu ib ntus
Cov impurities adsorbed rau saum npoo ntawm semiconductorwaferstuaj yeem muab faib ua peb hom: molecular, ionic thiab atomic.
Ntawm lawv, lub zog adsorption ntawm molecular impurities thiab saum npoo ntawm wafer tsis muaj zog, thiab hom impurity hais yog yooj yim tshem tawm. Lawv feem ntau oily impurities nrog cov yam ntxwv hydrophobic, uas tuaj yeem muab cov npog ntsej muag rau ionic thiab atomic impurities uas paug rau saum npoo ntawm semiconductor wafers, uas tsis tsim nyog rau kev tshem tawm ob hom impurities. Yog li ntawd, thaum tshuaj ntxuav semiconductor wafers, molecular impurities yuav tsum tau muab tshem tawm ua ntej.
Yog li ntawd, cov txheej txheem ntawm semiconductorwafertxheej txheem ntxuav yog:
De-molecularization-deionization-de-atomization-deionized dej yaug.
Tsis tas li ntawd, txhawm rau tshem tawm cov txheej txheem oxide nyob rau saum npoo ntawm lub wafer, yuav tsum tau ntxiv cov txheej txheem ntawm cov amino acid dilute. Yog li ntawd, lub tswv yim ntawm kev tu yog thawj zaug tshem tawm cov organic paug ntawm qhov chaw; ces yaj txheej oxide; Thaum kawg tshem tawm cov khoom thiab cov kab mob hlau, thiab passivate saum npoo tib lub sijhawm.
Cov txheej txheem ntxuav
Cov txheej txheem tshuaj feem ntau yog siv los ntxuav cov semiconductor wafers.
Kev tu tshuaj yog hais txog cov txheej txheem ntawm kev siv ntau yam tshuaj reagents thiab cov kuab tshuaj organic los ua haujlwm lossis yaj cov impurities thiab cov roj stains rau ntawm qhov chaw ntawm wafer kom desorb impurities, thiab tom qab ntawd yaug nrog ntau cov dej ntshiab kub thiab txias deionized kom tau txais. ib qho chaw huv.
Kev ntxuav tshuaj tuaj yeem muab faib ua cov tshuaj ntxhua ntub dej thiab tshuaj ntxuav kom qhuav, cov tshuaj ntxuav cov ntub dej tseem yog qhov tseem ceeb.
Kev ntxuav dej ntub dej
1. Kev ntxuav dej ntub dej:
Cov tshuaj ntxuav ntub dej feem ntau suav nrog kev daws teeb meem, kev txhuam txhuam, ultrasonic tu, megasonic tu, rotary spraying, thiab lwm yam.
2. Kev daws teeb meem immersion:
Kev daws immersion yog ib txoj hauv kev tshem tawm cov kab mob ntawm qhov chaw los ntawm immersing lub wafer rau hauv cov tshuaj tov tshuaj. Nws yog txoj kev siv ntau tshaj plaws hauv cov tshuaj ntub dej ntxuav. Cov kev daws teeb meem sib txawv tuaj yeem siv los tshem tawm ntau hom kab mob ntawm qhov chaw ntawm wafer.
Feem ntau, txoj kev no tsis tuaj yeem tshem tawm cov impurities nyob rau saum npoo ntawm wafer, yog li kev ntsuas lub cev xws li cua sov, ultrasound, thiab nplawm feem ntau siv thaum immersing.
3. Mechanical scrubbing:
Kev txhuam cov tshuab feem ntau yog siv los tshem tawm cov khoom lossis cov organic residues ntawm qhov chaw ntawm lub wafer. Feem ntau nws tuaj yeem muab faib ua ob txoj hauv kev:manual scrubbing thiab txhuam los ntawm ib tug wiper.
Kev tuav txhuamyog txoj kev txhuam yooj yim tshaj plaws. Cov txhuam hniav stainless hlau yog siv los tuav lub pob uas ntub dej hauv cov dej tsis muaj dej ethanol lossis lwm cov kuab tshuaj organic thiab maj mam txhuam cov wafer hauv tib qho kev taw qhia kom tshem tawm cov wax zaj duab xis, plua plav, cov kua nplaum residual los yog lwm yam khoom siv. Txoj kev no yooj yim ua rau khawb thiab ua paug hnyav.
Lub wiper siv kev sib hloov tshuab los txhuam qhov saum npoo ntawm wafer nrog txhuam txhuam los yog txhuam txhuam. Txoj kev no zoo heev txo cov khawb ntawm lub wafer. Lub tshuab hluav taws xob siab yuav tsis khawb lub wafer vim tsis muaj kev sib txhuam ntawm cov khoom siv, thiab tuaj yeem tshem tawm cov kab mob hauv qhov zawj.
4. Ultrasonic tu:
Ultrasonic tu yog ib txoj kev tu siv dav hauv kev lag luam semiconductor. Nws qhov zoo yog cov nyhuv tu zoo, kev ua haujlwm yooj yim, thiab tuaj yeem ntxuav cov khoom siv thiab cov ntim khoom.
Txoj kev ntxuav no yog nyob rau hauv qhov kev txiav txim ntawm cov ultrasonic tsis muaj zog (feem ntau siv ultrasonic zaus yog 20s40kHz), thiab qhov sib txawv thiab ntom yuav raug tsim tawm hauv cov kua nruab nrab. Qhov sparse yuav tsim ib lub tshuab nqus tsev vacuum npuas. Thaum cov kab noj hniav npuas ploj lawm, lub zog hauv zos yuav raug tsim nyob ze nws, rhuav tshem cov tshuaj lom neeg hauv cov molecules kom yaj cov impurities ntawm lub wafer nto. Ultrasonic tu yog qhov zoo tshaj plaws rau tshem tawm cov insoluble lossis insoluble flux residues.
5. Megasonic tu:
Megasonic tu tsis tsuas yog muaj qhov zoo ntawm ultrasonic tu, tab sis kuj overcomes nws shortcomings.
Megasonic tu yog ib txoj hauv kev ntawm kev ntxuav wafers los ntawm kev sib txuas lub zog siab (850kHz) zaus vibration nyhuv nrog cov tshuaj tiv thaiv ntawm cov tshuaj ntxuav cov tshuaj. Thaum lub sij hawm ntxuav, cov tshuaj molecules yog ceev los ntawm megasonic yoj (qhov siab tshaj plaws instantaneous ceev yuav ncav cuag 30cmVs), thiab cov high-ceev kua nthwv dej tsis tu ncua cuam tshuam rau saum npoo ntawm lub wafer, kom cov pa phem thiab zoo particles txuas mus rau saum npoo ntawm lub wafer. wafer raug yuam kom tshem tawm thiab nkag mus rau cov tshuaj ntxuav. Ntxiv acidic surfactants rau cov tshuaj ntxuav, ntawm ib sab, tuaj yeem ua tiav lub hom phiaj ntawm kev tshem tawm cov khoom thiab cov organic teeb meem ntawm polishing nto los ntawm adsorption ntawm surfactants; Ntawm qhov tod tes, los ntawm kev sib koom ua ke ntawm surfactants thiab acidic ib puag ncig, nws tuaj yeem ua tiav lub hom phiaj ntawm kev tshem tawm cov hlau paug ntawm qhov chaw ntawm daim ntawv polishing. Txoj kev no tuaj yeem ua si ib txhij ua lub luag haujlwm ntawm kev siv tshuab so thiab tshuaj ntxuav.
Tam sim no, txoj kev tu megasonic tau dhau los ua txoj hauv kev zoo rau kev ntxuav cov nplooj ntawv polishing.
6. Rotary txau txoj kev:
Cov txheej txheem rotary txau yog ib txoj hauv kev uas siv cov cuab yeej siv los tig lub wafer ntawm kev kub ceev, thiab tsis tu ncua txau cov kua (high-purity deionized dej los yog lwm yam kua ntxuav) rau ntawm qhov chaw ntawm lub wafer thaum lub sij hawm kev sib hloov kom tshem tawm impurities ntawm lub nto ntawm wafer.
Txoj kev no siv cov kab mob sib kis rau ntawm qhov chaw ntawm wafer kom yaj hauv cov tshuaj txau (lossis tshuaj lom neeg nrog rau nws kom yaj), thiab siv cov nyhuv centrifugal ntawm kev sib hloov ceev kom cov kua uas muaj impurities cais tawm ntawm qhov chaw ntawm lub wafer. hauv lub sijhawm.
Cov txheej txheem rotary tsuag muaj qhov zoo ntawm cov tshuaj ntxuav, kua tshuab ntxhua khaub ncaws, thiab kev txhuam kom siab. Tib lub sijhawm, txoj kev no tuaj yeem ua ke nrog cov txheej txheem ziab. Tom qab ib lub sij hawm ntawm deionized dej tshuaj ntxuav, cov tshuaj tsuag dej yog nres thiab siv cov tshuaj tsuag roj. Nyob rau tib lub sijhawm, kev sib hloov ceev tuaj yeem nce ntxiv kom lub zog centrifugal kom sai sai dehydrate ntawm lub wafer.
7.Qhuav tshuaj ntxuav
Kev tu kom qhuav yog hais txog kev tu tshuab uas tsis siv cov kev daws teeb meem.
Cov thev naus laus zis tu qhuav siv tam sim no suav nrog: plasma tu tshuab, roj theem tu tshuab, beam tu tshuab, thiab lwm yam.
Qhov zoo ntawm kev tu kom qhuav yog cov txheej txheem yooj yim thiab tsis muaj kuab paug ib puag ncig, tab sis tus nqi siab thiab qhov kev siv tsis loj rau lub sijhawm.
1. Plasma tu tshuab:
Plasma tu feem ntau yog siv rau hauv cov txheej txheem tshem tawm photoresist. Ib qho me me ntawm cov pa oxygen nkag mus rau hauv cov tshuaj tiv thaiv plasma. Nyob rau hauv qhov kev txiav txim ntawm lub zog hluav taws xob, cov pa oxygen generates plasma, uas sai sai oxidizes photoresist mus rau hauv lub volatile gas xeev thiab muab rho tawm.
Lub tshuab ntxuav no muaj qhov zoo ntawm kev ua haujlwm yooj yim, kev ua haujlwm siab, huv si, tsis muaj khawb, thiab yog qhov tsim nyog los xyuas kom meej cov khoom zoo hauv cov txheej txheem degumming. Tsis tas li ntawd, nws tsis siv cov kua qaub, alkalis thiab cov kuab tshuaj organic, thiab tsis muaj teeb meem xws li kev pov tseg thiab kev ua qias tuaj ib puag ncig. Yog li ntawd, nws yog nce nqi los ntawm tib neeg. Txawm li cas los xij, nws tsis tuaj yeem tshem tawm cov pa roj carbon thiab lwm yam hlau tsis muaj hluav taws xob lossis hlau oxide impurities.
2. Gas theem tu tshuab:
Gas theem tu yog hais txog ib txoj kev tu uas siv cov roj theem sib npaug ntawm cov khoom sib xws hauv cov txheej txheem ua kua kom cuam tshuam nrog cov khoom tsis huv ntawm cov wafer kom ua tiav lub hom phiaj ntawm kev tshem tawm impurities.
Piv txwv li, nyob rau hauv cov txheej txheem CMOS, wafer tu siv cov kev sib cuam tshuam ntawm roj theem HF thiab dej vapor kom tshem tawm oxides. Feem ntau, cov txheej txheem HF uas muaj dej yuav tsum tau nrog cov txheej txheem tshem tawm, thaum siv roj theem HF ntxuav tshuab tsis tas yuav muaj cov txheej txheem tshem tawm cov khoom tom ntej.
Qhov txiaj ntsig tseem ceeb tshaj plaws piv rau cov txheej txheem HF aqueous yog HF tsawg dua kev siv tshuaj lom neeg thiab ua kom huv dua.
Txais tos txhua tus neeg muas zaub los ntawm thoob plaws lub ntiaj teb tuaj xyuas peb rau kev sib tham ntxiv!
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Post lub sij hawm: Aug-13-2024