Photolithography thev naus laus zis feem ntau tsom rau kev siv cov tshuab kho qhov muag kom nthuav tawm cov qauv hauv Circuit Court ntawm silicon wafers. Qhov tseeb ntawm cov txheej txheem no ncaj qha cuam tshuam rau kev ua haujlwm thiab cov txiaj ntsig ntawm kev sib xyaw ua ke. Raws li ib qho ntawm cov khoom siv saum toj kawg nkaus rau kev tsim cov chips, lub tshuab lithography muaj txog ntau pua txhiab yam khoom. Ob qho tib si optical Cheebtsam thiab cov khoom nyob rau hauv lub lithography system yuav tsum tau high precision los xyuas kom meej Circuit Court kev ua tau zoo thiab raug.SiC ceramicstau siv nyob rau hauvwafer chucksthiab ceramic square iav.
Wafer chuckLub wafer chuck nyob rau hauv lub tshuab lithography bears thiab txav lub wafer thaum lub sij hawm raug. Kev sib raug zoo ntawm lub wafer thiab chuck yog qhov tseem ceeb rau kev ua kom raug cov qauv ntawm qhov chaw ntawm lub wafer.SiC waferchucks paub txog lawv lub teeb yuag, siab qhov ruaj khov thiab tsis tshua muaj thermal expansion coefficient, uas tuaj yeem txo qis inertial loads thiab txhim kho cov lus tsa suab, qhov tseeb thiab ruaj khov.
Ceramic square iav Hauv lub tshuab lithography, cov lus tsa suab synchronization ntawm wafer chuck thiab lub npog ntsej muag yog qhov tseem ceeb, uas cuam tshuam ncaj qha rau lithography qhov tseeb thiab tawm los. Lub square reflector yog ib qho tseem ceeb ntawm wafer chuck scanning positioning tswv yim ntsuas qhov system, thiab nws cov khoom yuav tsum yog lub teeb yuag thiab nruj. Txawm hais tias silicon carbide ceramics muaj lub teeb yuag zoo tagnrho, kev tsim cov khoom siv no yog qhov nyuaj. Tam sim no, cov tuam txhab tsim khoom siv hluav taws xob thoob ntiaj teb siv cov khoom siv xws li fused silica thiab cordierite. Txawm li cas los xij, nrog kev nce qib ntawm thev naus laus zis, Suav cov kws tshaj lij tau ua tiav cov khoom siv loj-loj, complex-shaped, hnyav hnyav, tag nrho cov khoom siv silicon carbide ceramic square tsom iav thiab lwm yam khoom siv kho qhov muag rau cov tshuab photolithography. Lub photomask, tseem hu ua lub aperture, xa lub teeb los ntawm lub npog ntsej muag los tsim cov qauv ntawm cov khoom siv photosensitive. Txawm li cas los xij, thaum EUV lub teeb irradiates lub npog ntsej muag, nws tawm tshav kub, nce qhov kub ntawm 600 txog 1000 degrees Celsius, uas yuav ua rau muaj kev puas tsuaj rau thermal. Yog li ntawd, ib txheej ntawm SiC zaj duab xis feem ntau yog tso rau ntawm daim npog ntsej muag. Ntau lub tuam txhab txawv teb chaws, xws li ASML, tam sim no muab cov yeeb yaj kiab nrog kev xa tawm ntau dua 90% txhawm rau txo kev ntxuav thiab tshuaj xyuas thaum siv lub ntsej muag photomask thiab txhim kho kev ua tau zoo thiab cov khoom lag luam tawm los ntawm EUV photolithography tshuab.
Plasma Etchingthiab Deposition Photomasks, tseem hu ua crosshairs, muaj lub luag haujlwm tseem ceeb ntawm kev xa lub teeb los ntawm lub npog ntsej muag thiab tsim cov qauv ntawm cov khoom siv photosensitive. Txawm li cas los xij, thaum EUV (hnyav ultraviolet) lub teeb irradiates lub photomask, nws emits cua sov, nce qhov kub ntawm 600 thiab 1000 degrees Celsius, uas yuav ua rau thermal puas. Yog li ntawd, ib txheej ntawm silicon carbide (SiC) zaj duab xis feem ntau yog muab tso rau ntawm lub photomask los daws qhov teeb meem no. Tam sim no, ntau lub tuam txhab txawv teb chaws, xws li ASML, tau pib muab cov yeeb yaj kiab nrog qhov pom tseeb ntawm ntau dua 90% txhawm rau txo qhov xav tau kev ntxuav thiab tshuaj xyuas thaum siv lub photomask, yog li txhim kho kev ua tau zoo thiab cov khoom lag luam tawm los ntawm EUV lithography tshuab. . Plasma Etching thiabDeposition Focus Ringthiab lwm yam hauv kev tsim khoom semiconductor, cov txheej txheem etching siv cov kua lossis roj etchants (xws li cov roj fluorine-muaj roj) ionized rau hauv cov ntshav los txhawm rau txhawm rau wafer thiab xaiv tshem tawm cov khoom tsis xav tau kom txog rau thaum cov qauv Circuit Court uas xav tau tseem nyob hauv cov ntshav.wafernto. Nyob rau hauv sib piv, nyias zaj duab xis deposition zoo ib yam li lub rov qab sab ntawm etching, siv ib tug deposition txoj kev mus stack insulating cov ntaub ntawv ntawm cov hlau txheej los ua ib tug nyias zaj duab xis. Txij li thaum ob txheej txheem siv plasma thev naus laus zis, lawv yooj yim rau corrosive los ntawm cov chav thiab cov khoom. Yog li, cov khoom siv hauv cov khoom siv yuav tsum muaj cov ntshav plasma zoo, tsis tshua muaj kev cuam tshuam rau fluorine etching gases, thiab tsis tshua muaj conductivity. Ib txwm etching thiab deposition khoom Cheebtsam, xws li tsom rings, feem ntau yog ua los ntawm cov ntaub ntawv xws li silicon los yog quartz. Txawm li cas los xij, nrog rau kev nce qib ntawm kev sib xyaw ua ke miniaturization, qhov kev thov thiab qhov tseem ceeb ntawm cov txheej txheem etching hauv kev tsim hluav taws xob sib xyaw ua ke tau nce. Ntawm qib microscopic, meej silicon wafer etching yuav tsum muaj zog plasma kom ua tiav cov kab dav me me thiab cov cuab yeej siv ntau dua. Yog li, cov tshuaj vapor deposition (CVD) silicon carbide (SiC) tau maj mam dhau los ua cov txheej txheem nyiam rau etching thiab deposition khoom nrog nws zoo heev lub cev thiab tshuaj zog, siab purity thiab uniformity. Tam sim no, CVD silicon carbide Cheebtsam hauv etching cov cuab yeej muaj xws li tsom rings, roj da dej hau, tais thiab ntug rings. Hauv cov khoom siv deposition, muaj chamber npog, chamber liners thiabSIC-coated graphite substrates.
Vim nws tsis tshua muaj reactivity thiab conductivity rau chlorine thiab fluorine etching gases,CVD silicon carbidetau dhau los ua cov khoom siv zoo tshaj plaws rau cov khoom xws li tsom rings hauv cov khoom siv plasma etching.CVD silicon carbideCov khoom siv hauv cov khoom siv etching muaj xws li tsom rings, roj da dej hau, tais, ntug rings, thiab lwm yam. Siv lub tsom nplhaib ua piv txwv, lawv yog cov khoom tseem ceeb tso rau sab nraum lub wafer thiab nyob rau hauv kev sib cuag nrog lub wafer. Los ntawm kev siv hluav taws xob rau lub nplhaib, lub plasma yog tsom los ntawm lub nplhaib mus rau wafer, txhim kho cov txheej txheem sib xws. Kev lig kev cai, tsom rings yog ua los ntawm silicon los yog quartz. Txawm li cas los xij, raws li kev sib xyaw ua ke ntawm cov khoom siv hluav taws xob miniaturization nce, qhov kev thov thiab qhov tseem ceeb ntawm cov txheej txheem etching hauv kev tsim hluav taws xob txuas ntxiv mus ntxiv. Plasma etching zog thiab lub zog yuav tsum tau nce ntxiv, tshwj xeeb tshaj yog nyob rau hauv capacitively coupled plasma (CCP) etching cov cuab yeej, uas yuav tsum tau siab zog plasma. Yog li ntawd, kev siv cov nplhaib ua kom pom tseeb ua los ntawm cov khoom siv silicon carbide yog nce.
Post lub sij hawm: Oct-29-2024