Zoo siab txais tos rau peb lub vev xaib kom paub cov khoom lag luam thiab kev sib tham.
Peb lub vev xaib:https://www.vet-china.com/
Etching ntawm Poly thiab SiO2:
Tom qab qhov no, ntau tshaj Poly thiab SiO2 raug tshem tawm, uas yog, tshem tawm. Lub sijhawm no, kev taw qhiaetchingyog siv. Nyob rau hauv kev faib tawm ntawm etching, muaj kev faib tawm ntawm directional etching thiab non-directional etching. Directional etching hais txogetchingnyob rau hauv ib qho kev taw qhia, thaum uas tsis yog-directional etching yog non-directional (Kuv yuam kev hais ntau dhau lawm. Hauv luv luv, nws yog tshem tawm SiO2 hauv ib qho kev taw qhia los ntawm cov kua qaub thiab cov hauv paus). Hauv qhov piv txwv no, peb siv downward directional etching tshem SiO2, thiab nws yuav zoo li no.
Thaum kawg, tshem tawm cov photoresist. Lub sijhawm no, cov txheej txheem ntawm kev tshem tawm cov photoresist tsis yog kev ua kom los ntawm lub teeb irradiation tau hais los saum toj no, tab sis los ntawm lwm txoj hauv kev, vim tias peb tsis tas yuav txhais qhov loj me rau lub sijhawm no, tab sis tshem tawm tag nrho cov photoresist. Thaum kawg, nws dhau los ua raws li pom hauv daim duab hauv qab no.
Ua li no, peb tau ua tiav lub hom phiaj ntawm kev khaws cov chaw tshwj xeeb ntawm Poly SiO2.
Tsim ntawm qhov chaw thiab ntws:
Thaum kawg, cia peb xav txog yuav ua li cas lub hauv paus thiab qhov ntws tawm. Txhua leej txhua tus tseem nco ntsoov tias peb tau tham txog nws hauv qhov teeb meem kawg. Lub hauv paus thiab ntws yog ion-implanted nrog tib hom ntsiab. Lub sijhawm no, peb tuaj yeem siv photoresist los qhib qhov chaw / qhov dej ntws qhov twg N hom yuav tsum tau cog. Txij li thaum peb tsuas yog coj NMOS ua piv txwv, txhua qhov chaw hauv daim duab saum toj no yuav raug qhib, raws li pom hauv daim duab hauv qab no.
Txij li thaum ib feem them los ntawm photoresist tsis tuaj yeem cog tau (lub teeb raug thaiv), N-hom ntsiab yuav tsuas yog cog rau ntawm qhov xav tau NMOS. Txij li thaum lub substrate nyob rau hauv lub poly yog thaiv los ntawm poly thiab SiO2, nws yuav tsis raug implanted, ces nws yuav zoo li no.
Lub sijhawm no, MOS qauv yooj yim tau ua. Hauv txoj kev xav, yog tias qhov hluav taws xob tau ntxiv rau qhov chaw, ntws, poly thiab substrate, MOS no tuaj yeem ua haujlwm, tab sis peb tsis tuaj yeem nqa ib qho kev sojntsuam thiab ntxiv qhov hluav taws xob ncaj qha mus rau qhov chaw thiab ntws. Lub sijhawm no, MOS thaiv kev xav tau, uas yog, ntawm MOS no, txuas cov xov hlau los txuas ntau MOS ua ke. Cia peb saib cov txheej txheem ntawm kev xaim.
Ua VIA:
Thawj kauj ruam yog los npog tag nrho MOS nrog ib txheej ntawm SiO2, raws li qhia hauv daim duab hauv qab no:
Tau kawg, SiO2 no yog tsim los ntawm CVD, vim tias nws ceev heev thiab txuag sijhawm. Cov hauv qab no tseem yog cov txheej txheem ntawm nteg photoresist thiab nthuav tawm. Tom qab kawg, zoo li no.
Tom qab ntawd siv txoj kev etching rau etch ib lub qhov ntawm SiO2, raws li qhia hauv qhov grey hauv daim duab hauv qab no. Qhov tob ntawm lub qhov no ncaj qha mus rau Si nto.
Thaum kawg, tshem tawm cov photoresist thiab tau txais cov tsos hauv qab no.
Lub sijhawm no, dab tsi yuav tsum tau ua yog sau tus neeg xyuas pib hauv lub qhov no. Yuav ua li cas yog tus conductor no? Txhua lub tuam txhab sib txawv, feem ntau ntawm lawv yog tungsten alloys, yog li cas lub qhov no tuaj yeem sau tau? PVD (Lub Cev Vapor Deposition) txoj kev yog siv, thiab lub hauv paus ntsiab lus zoo ib yam li daim duab hauv qab no.
Siv cov hluav taws xob hluav taws xob siab lossis cov ions rau bombard cov phiaj khoom, thiab cov khoom siv tawg yuav poob rau hauv qab ntawm daim ntawv ntawm cov zauv hauv qab no. Cov khoom siv peb feem ntau pom hauv xov xwm hais txog cov khoom siv ntawm no.
Tom qab sau lub qhov, nws zoo li no.
Tau kawg, thaum peb sau nws, nws tsis tuaj yeem tswj cov tuab ntawm txheej kom sib npaug ntawm qhov tob ntawm lub qhov, yog li yuav muaj qee qhov ntau dhau, yog li peb siv CMP (Chemical Mechanical Polishing) thev naus laus zis, uas suab nrov heev. high-end, tab sis nws yog tiag tiag sib tsoo, sib tsoo tawm ntawm qhov seem. Qhov tshwm sim zoo li no.
Nyob rau ntawm no, peb tau ua tiav cov khoom ntawm ib txheej ntawm viav vias. Ntawm chav kawm, kev tsim ntawm viav vias yog tsuas yog rau kev xaim ntawm cov hlau txheej tom qab.
Hlau txheej ntau lawm:
Raws li cov xwm txheej saum toj no, peb siv PVD los dep lwm txheej hlau. Cov hlau no feem ntau yog tooj liab-raws li alloy.
Tom qab ntawd tom qab raug thiab etching, peb tau txais yam peb xav tau. Tom qab ntawd txuas ntxiv mus kom txog thaum peb ua tau raws li peb xav tau.
Thaum peb kos cov layout, peb yuav qhia koj yuav ua li cas muaj pes tsawg txheej ntawm hlau thiab ntawm cov txheej txheem siv yuav stacked nyob rau hauv feem ntau, uas txhais tau hais tias muaj pes tsawg txheej nws yuav stacked.
Thaum kawg, peb tau txais cov qauv no. Lub ncoo saum toj kawg nkaus yog tus pin ntawm cov nti no, thiab tom qab ntim khoom, nws dhau los ua tus pin peb tuaj yeem pom (ntawm chav kawm, kuv kos nws randomly, tsis muaj qhov tseem ceeb, piv txwv li).
Qhov no yog cov txheej txheem dav dav ntawm kev ua cov nti. Hauv qhov teeb meem no, peb tau kawm txog qhov tseem ceeb tshaj plaws, etching, ion implantation, furnace tubes, CVD, PVD, CMP, thiab lwm yam hauv semiconductor foundry.
Post lub sij hawm: Aug-23-2024