Laser thev naus laus zis ua rau kev hloov pauv ntawm silicon carbide substrate ua tshuab

1. Txheej txheem cej luam ntawmsilicon carbide substrateua tshuab

Tam sim nosilicon carbide substrate Kev ua cov kauj ruam muaj xws li: sib tsoo lub voj voog sab nrauv, slicing, chamfering, sib tsoo, polishing, tu, thiab lwm yam. Slicing yog ib qho tseem ceeb hauv kev ua cov semiconductor substrate thiab cov kauj ruam tseem ceeb hauv kev hloov cov ingot mus rau lub substrate. Tam sim no, txiav ntawmsilicon carbide substratefeem ntau yog hlau txiav. Multi-wire slurry txiav yog qhov zoo tshaj plaws hlau txiav txoj kev tam sim no, tab sis tseem muaj teeb meem ntawm kev txiav tsis zoo thiab txiav loj loj. Kev poob ntawm cov hlau txiav yuav nce ntxiv nrog rau qhov nce ntawm substrate loj, uas tsis haum rau lubsilicon carbide substratemanufacturers kom ua tiav cov nqi txo thiab txhim kho efficiency. Nyob rau hauv tus txheej txheem ntawm kev txiav8-nti silicon carbide substrate, cov duab ntawm lub substrate tau los ntawm cov hlau txiav tsis zoo, thiab cov yam ntxwv ntawm tus lej xws li WARP thiab BOW tsis zoo.

Slicing yog ib kauj ruam tseem ceeb hauv semiconductor substrate manufacturing. Kev lag luam niaj hnub sim tshiab txiav txoj kev, xws li pob zeb diamond hlau txiav thiab laser stripping. Laser stripping tshuab tau nrhiav heev tsis ntev los no. Kev taw qhia txog kev siv tshuab no txo ​​qis kev txiav thiab txhim kho kev ua haujlwm ntawm cov txheej txheem kev ua haujlwm. Cov kev daws teeb meem laser stripping muaj cov kev xav tau siab rau qib ntawm automation thiab yuav tsum tau siv thev naus laus zis los koom tes nrog nws, uas yog nyob rau hauv txoj kab nrog kev txhim kho yav tom ntej ntawm silicon carbide substrate ua. Cov qoob loo ntawm cov tsoos mortar hlau txiav feem ntau yog 1.5-1.6. Kev taw qhia txog kev siv tshuab laser stripping tuaj yeem ua rau cov qoob loo nce mus txog 2.0 (saib rau DISCO cov cuab yeej). Nyob rau hauv lub neej yav tom ntej, raws li kev loj hlob ntawm laser stripping technology nce, cov hlais tawm los yuav zoo dua ntxiv; Nyob rau tib lub sijhawm, laser stripping kuj tuaj yeem txhim kho qhov ua tau zoo ntawm slicing. Raws li kev tshawb fawb kev lag luam, tus thawj coj hauv kev lag luam DISCO txiav ib daim hlais li ntawm 10-15 feeb, uas yog qhov ua tau zoo dua li qhov tam sim no mortar hlau txiav ntawm 60 feeb ib daim.

Cov txheej txheem cov txheej txheem ntawm tsoos hlau txiav ntawm silicon carbide substrates yog: hlau txiav- ntxhib sib tsoo-zoo sib tsoo- ntxhib polishing thiab nplua polishing. Tom qab cov txheej txheem laser stripping hloov cov hlau txiav, cov txheej txheem thinning yog siv los hloov cov txheej txheem sib tsoo, uas txo qhov poob ntawm cov hlais thiab txhim kho kev ua haujlwm zoo. Lub laser stripping txheej txheem ntawm kev txiav, sib tsoo thiab polishing ntawm silicon carbide substrates tau muab faib ua peb theem: laser nto scanning-substrate stripping-ingot flattening: laser nto scanning yog siv ultrafast laser pulses los ua cov nto ntawm lub ingot los tsim ib tug hloov. txheej nyob rau hauv lub ingot; substrate stripping yog cais lub substrate saum toj no hloov txheej txheej los ntawm ingot los ntawm lub cev txoj kev; ingot flattening yog tshem tawm cov txheej txheem hloov kho ntawm qhov chaw ntawm lub ingot kom ntseeg tau tias qhov flatness ntawm qhov chaw ingot.
Silicon carbide laser stripping txheej txheem

 
2. Kev vam meej thoob ntiaj teb hauv laser stripping tshuab thiab kev lag luam koom nrog cov tuam txhab

Cov txheej txheem laser stripping yog thawj zaug tau txais los ntawm cov tuam txhab txawv teb chaws: Xyoo 2016, Nyiv lub DISCO tau tsim lub tshuab laser slicing tshiab KABRA, uas tsim cov txheej txheem sib cais thiab cais cov wafers ntawm qhov tob uas tau teev tseg los ntawm kev txuas ntxiv irradiating lub ingot nrog laser, uas tuaj yeem siv rau ntau yam. hom ntawm SiC ingots. Thaum lub Kaum Ib Hlis 2018, Infineon Technologies tau txais Siltectra GmbH, lub wafer txiav pib, rau 124 lab euros. Tom qab tsim cov txheej txheem Cold Split, uas siv patented laser technology los txhais cov kev sib cais, lub tsho tiv no tshwj xeeb polymer cov ntaub ntawv, tswj system txias induced kev nyuaj siab, raug cais cov ntaub ntawv, thiab grind thiab huv si kom tiav wafer txiav.

Nyob rau hauv xyoo tas los no, qee lub tuam txhab hauv tsev kuj tau nkag mus rau hauv kev lag luam laser stripping khoom: cov tuam txhab tseem ceeb yog Han's Laser, Delong Laser, West Lake Instrument, Universal Intelligence, Tuam Tshoj Electronics Technology Group Corporation thiab lub koom haum ntawm Semiconductors ntawm Suav Academy ntawm Sciences. Ntawm lawv, cov tuam txhab teev npe Han's Laser thiab Delong Laser tau teeb tsa tau ntev, thiab lawv cov khoom tau raug txheeb xyuas los ntawm cov neeg siv khoom, tab sis lub tuam txhab muaj ntau cov khoom lag luam, thiab cov khoom siv laser stripping tsuas yog ib qho ntawm lawv cov lag luam. Cov khoom ntawm cov hnub qub nce siab xws li West Lake Instrument tau ua tiav cov khoom xa tuaj; Universal Intelligence, Tuam Tshoj Electronics Technology Group Corporation 2, lub koom haum ntawm Semiconductors ntawm Suav Academy ntawm Sciences thiab lwm lub tuam txhab kuj tau tso tawm cov cuab yeej kev nce qib.

3. Tsav yam tseem ceeb rau txoj kev loj hlob ntawm laser stripping technology thiab lub suab ntawm kev ua lag luam taw qhia

Tus nqi txo ntawm 6-nti silicon carbide substrates tsav txoj kev loj hlob ntawm laser stripping tshuab: Tam sim no, tus nqi ntawm 6-nti silicon carbide substrates tau poob qis dua 4,000 yuan / thooj, nce tus nqi ntawm qee cov tuam ntxhab. Cov txheej txheem laser stripping muaj cov txiaj ntsig zoo thiab muaj txiaj ntsig zoo, uas ua rau kev nkag mus ntawm laser stripping tshuab kom nce.

Lub thinning ntawm 8-nti silicon carbide substrates tsav txoj kev loj hlob ntawm laser stripping tshuab: Lub thickness ntawm 8-nti silicon carbide substrates yog tam sim no 500um, thiab tab tom loj hlob mus rau ib tug tuab ntawm 350um. Cov txheej txheem txiav hlau tsis zoo hauv 8-nti silicon carbide ua haujlwm (lub substrate nto tsis zoo), thiab BOW thiab WARP qhov tseem ceeb tau poob qis heev. Laser stripping yog suav tias yog ib qho tsim nyog ua thev naus laus zis rau 350um silicon carbide substrate ua, uas ua rau kev nkag mus ntawm laser stripping tshuab kom nce.

Kev ua lag luam kev cia siab: SiC substrate laser stripping cov cuab yeej tau txais txiaj ntsig los ntawm kev nthuav dav ntawm 8-nti SiC thiab tus nqi txo ntawm 6-nti SiC. Lub ntsiab lus tseem ceeb ntawm kev lag luam tam sim no tab tom los txog, thiab kev txhim kho kev lag luam yuav nrawm heev.