Nyias zaj duab xis deposition yog txheej txheej ntawm zaj duab xis ntawm lub ntsiab substrate khoom ntawm semiconductor. Cov yeeb yaj kiab no tuaj yeem ua los ntawm ntau yam ntaub ntawv, xws li insulating compound silicon dioxide, semiconductor polysilicon, hlau tooj liab, thiab lwm yam. Cov khoom siv rau txheej yog hu ua nyias zaj duab xis deposition khoom.
Los ntawm txoj kev xav ntawm cov txheej txheem semiconductor nti, nws nyob hauv cov txheej txheem pem hauv ntej.
Cov txheej txheem npaj ua zaj duab xis nyias tuaj yeem muab faib ua ob pawg raws li nws txoj kev tsim cov yeeb yaj kiab: lub cev vapor deposition (PVD) thiab tshuaj vapor deposition(CVD), ntawm cov txheej txheem CVD cov cuab yeej suav nrog ntau dua.
Lub cev vapor deposition (PVD) yog hais txog qhov vaporization ntawm qhov chaw ntawm cov khoom siv thiab tso rau ntawm qhov chaw ntawm lub substrate los ntawm cov pa roj tsawg-plasma, suav nrog evaporation, sputtering, ion beam, thiab lwm yam.
Tshuaj vapor deposition (CVD) hais txog cov txheej txheem ntawm kev tso cov yeeb yaj kiab rau ntawm qhov chaw ntawm silicon wafer los ntawm cov tshuaj tiv thaiv ntawm cov roj sib tov. Raws li cov tshuaj tiv thaiv kab mob (siab, precursor), nws muab faib ua atmospheric siabCVD(APCVD), tsis tshua muaj siabCVD(LPCVD), plasma enhanced CVD (PECVD), high density plasma CVD (HDPCVD) thiab atomic layer deposition (ALD).
LPCVD: LPCVD muaj peev xwm tiv thaiv cov kauj ruam zoo dua, kev sib xyaw ua ke zoo thiab cov qauv kev tswj hwm, kev tso nyiaj ntau thiab cov khoom tso tawm, thiab txo cov pa phem heev. Kev tso siab rau cov cuab yeej siv cua sov ua qhov cua sov kom tswj tau cov tshuaj tiv thaiv, kev tswj qhov kub thiab txias yog qhov tseem ceeb heev. Siv dav hauv Poly txheej tsim ntawm TopCon hlwb.
PECVD: PECVD tso siab rau lub plasma uas tsim los ntawm xov tooj cua zaus induction kom ua tiav qhov kub thiab txias (tsawg dua 450 degrees) ntawm cov txheej txheem nyias zaj duab xis tso tawm. Tsawg kub deposition yog nws lub ntsiab kom zoo dua, yog li txuag lub zog, txo cov nqi, ua kom muaj peev xwm ntau lawm, thiab txo lub neej lwj ntawm cov neeg nqa khoom tsawg hauv silicon wafers tshwm sim los ntawm qhov kub thiab txias. Nws tuaj yeem siv rau cov txheej txheem ntawm ntau lub hlwb xws li PERC, TOPCON, thiab HJT.
ALD: Kev ua yeeb yaj kiab zoo nkauj, ntom thiab tsis muaj qhov, tuaj yeem nqa cov lus qhia tuab (chav sov-400 ℃), yog qhov dav siv rau substrates ntawm cov duab sib txawv, thiab tsis tas yuav tswj qhov sib xws ntawm cov reactant ntws. Tab sis qhov tsis zoo yog tias zaj duab xis tsim nrawm nrawm. Xws li zinc sulfide (ZnS) lub teeb-emitting txheej siv los tsim nanostructured insulators (Al2O3 / TiO2) thiab nyias zaj duab xis electroluminescent zaub (TFEL).
Atomic layer deposition (ALD) yog txheej txheem nqus tsev vacuum uas tsim ib zaj duab xis nyias ntawm cov txheej txheej substrate los ntawm txheej hauv daim ntawv ntawm ib txheej atomic. Thaum ntxov li 1974, Finnish cov ntaub ntawv physicist Tuomo Suntola tau tsim cov thev naus laus zis no thiab yeej 1 lab euro Millennium Technology Award. ALD technology yog Ameslikas siv rau lub vaj huam sib luag electroluminescent, tab sis nws tsis tau siv dav. Nws tsis yog txog thaum pib ntawm lub xyoo pua 21st uas ALD technology pib tau txais los ntawm kev lag luam semiconductor. Los ntawm kev tsim cov khoom siv ultra-nyias high-dielectric los hloov cov tsoos silicon oxide, nws tau ua tiav cov teeb meem tam sim no los ntawm kev txo cov kab dav ntawm cov nyhuv transistors, ua rau Moore txoj cai los txhim kho rau cov kab me me. Dr. Tuomo Suntola ib zaug hais tias ALD tuaj yeem ua kom muaj kev sib xyaw ua ke ntawm cov khoom sib xyaw ua ke.
Cov ntaub ntawv pej xeem qhia tau hais tias ALD thev naus laus zis tau tsim los ntawm Dr. Tuomo Suntola ntawm PICOSUN hauv Finland xyoo 1974 thiab tau ua haujlwm nyob txawv teb chaws, xws li cov yeeb yaj kiab siab dielectric hauv 45/32 nanometer nti tsim los ntawm Intel. Hauv Suav teb, kuv lub tebchaws tau qhia txog ALD thev naus laus zis ntau dua 30 xyoo tom qab lub teb chaws txawv teb chaws. Thaum Lub Kaum Hli 2010, PICOSUN hauv Finland thiab Fudan University tau tuav thawj lub rooj sib tham hauv tsev kawm ntawv ALD, qhia ALD thev naus laus zis rau Tuam Tshoj thawj zaug.
Piv nrog cov tshuaj vapor deposition ib txwm muaj (CVD) thiab lub cev vapor deposition (PVD), qhov zoo ntawm ALD yog zoo heev peb-dimensional conformality, loj cheeb tsam zaj duab xis uniformity, thiab meej thickness tswj, uas yog haum rau loj hlob ultra-nyias films nyob rau hauv complex deg duab thiab siab nam piv qauv.
-Cov ntaub ntawv qhov chaw: Micro-nano ua platform ntawm Tsinghua University—
Nyob rau hauv lub sijhawm tom qab Moore, qhov nyuaj thiab txheej txheem ntim ntawm wafer manufacturing tau zoo heev. Siv cov logic chips ua piv txwv, nrog rau kev nce ntawm cov kab ntau lawm nrog cov txheej txheem hauv qab 45nm, tshwj xeeb tshaj yog cov kab ntau lawm nrog cov txheej txheem ntawm 28nm thiab hauv qab no, cov kev cai rau txheej thickness thiab precision tswj yog siab dua. Tom qab kev qhia txog ntau yam kev siv tshuab, cov txheej txheem ALD thiab cov khoom siv yuav tsum tau nce ntxiv; nyob rau hauv lub tshav pob ntawm lub cim xeeb chips, cov txheej txheem kev tsim khoom tseem ceeb tau hloov zuj zus los ntawm 2D NAND mus rau 3D NAND qauv, cov txheej txheem sab hauv tau nce ntxiv, thiab cov khoom tau maj mam nthuav tawm cov qauv siab, cov qauv zoo sib xws, thiab lub luag haujlwm tseem ceeb. ntawm ALD tau pib tshwm sim. Los ntawm qhov kev xav ntawm kev txhim kho yav tom ntej ntawm semiconductors, ALD thev naus laus zis yuav ua lub luag haujlwm tseem ceeb hauv lub sijhawm tom qab Moore.
Piv txwv li, ALD yog tib txoj kev tso nyiaj tso tawm uas tuaj yeem ua tau raws li qhov yuav tsum tau ua ntawm kev them nyiaj thiab kev ua yeeb yaj kiab ntawm cov txheej txheem 3D stacked nyuaj (xws li 3D-NAND). Qhov no tuaj yeem pom vividly hauv daim duab hauv qab no. Cov yeeb yaj kiab tso rau hauv CVD A (xiav) tsis tas npog qhov qis ntawm cov qauv; Txawm hais tias qee qhov kev hloov kho tau ua rau CVD (CVD B) kom ua tiav cov kev pabcuam, kev ua yeeb yaj kiab thiab tshuaj lom neeg muaj pes tsawg leeg ntawm thaj chaw hauv qab yog qhov tsis zoo (dawb cheeb tsam hauv daim duab); Hauv qhov sib piv, kev siv ALD thev naus laus zis qhia tau hais tias ua tiav cov yeeb yaj kiab, thiab cov khoom zoo thiab cov yeeb yaj kiab zoo sib xws tau ua tiav hauv txhua qhov chaw ntawm cov qauv.
—-Daim duab zoo ntawm ALD technology piv rau CVD (Source: ASM) —-
Txawm hais tias CVD tseem tuav lub lag luam loj tshaj plaws hauv lub sijhawm luv luv, ALD tau dhau los ua ib qho ntawm cov khoom lag luam loj tshaj plaws ntawm wafer fab khoom lag luam. Hauv kev ua lag luam ALD no nrog kev loj hlob muaj peev xwm thiab lub luag haujlwm tseem ceeb hauv kev tsim cov chips, ASM yog lub tuam txhab ua lag luam hauv thaj chaw ntawm ALD cov cuab yeej.
Post lub sij hawm: Jun-12-2024