I loko o ka honua paʻakikī o ka ʻenehana hou,wafers, i ʻike ʻia he wafer silika, ʻo ia nā mea nui o ka ʻoihana semiconductor. ʻO ia ke kumu no ka hana ʻana i nā ʻāpana uila like ʻole e like me nā microprocessors, hoʻomanaʻo, sensors, etc. No laila, no ke aha mākou e ʻike pinepine ai i nā wafers 25 i loko o kahi pahu? Aia nō nā noʻonoʻo ʻepekema a me ka hoʻokele waiwai o ka hana ʻenehana ma hope o kēia.
E hōʻike ana i ke kumu he 25 wafers i loko o kahi pahu
ʻO ka mua, e hoʻomaopopo i ka nui o ka wafer. ʻO ka nui o ka wafer maʻamau he 12 ʻīniha a me 15 ʻīniha, ʻo ia ka mea e hoʻololi ai i nā lako hana a me nā kaʻina hana.12-inihi wafersi kēia manawa ke ʻano maʻamau no ka mea hiki iā lākou ke hoʻokomo i nā chips hou aʻe i ke kaulike i ke kumukūʻai hana a me ka pono.
ʻAʻole pōʻino ka helu "25 ʻāpana". Hoʻokumu ʻia ia ma ke ʻano o ka ʻoki ʻana a me ka maikaʻi o ka hoʻopili ʻana o ka wafer. Ma hope o ka hana ʻia ʻana o kēlā me kēia wafer, pono e ʻoki ʻia e hana i nā ʻāpana kūʻokoʻa he nui. ʻO ka ʻōlelo maʻamau, a12-inihi waferhiki ke ʻoki i nā haneli a i ʻole nā tausani o nā ʻāpana. Eia nō naʻe, no ka maʻalahi o ka hoʻokele a me ka lawe ʻana, hoʻopili pinepine ʻia kēia mau ʻāpana i kahi nui, a ʻo 25 mau ʻāpana he koho nui maʻamau no ka mea ʻaʻole nui a nui loa, a hiki iā ia ke hōʻoia i ka paʻa pono i ka wā o ka lawe ʻana.
Eia kekahi, ʻo ka nui o nā ʻāpana 25 e kūpono i ka automation a me ka optimization o ka laina hana. Hiki i ka hana batch ke hōʻemi i ke kumukūʻai hoʻoili o kahi ʻāpana hoʻokahi a hoʻomaikaʻi i ka hana hana. I ka manawa like, no ka mālama ʻana a me ka lawe ʻana, maʻalahi ka hana ʻana i kahi pahu wafer 25-ʻāpana a hoʻemi i ka pilikia o ka haki.
He mea pono e hoʻomaopopo me ka holomua o ka ʻenehana, hiki i kekahi mau huahana kiʻekiʻe ke hoʻohana i ka nui o nā pūʻolo, e like me 100 a i ʻole 200 mau ʻāpana, e hoʻomaikaʻi hou i ka hana hana. Eia nō naʻe, no ka hapa nui o nā mea kūʻai aku a me nā huahana waena, ʻo kahi pahu wafer 25 mau ʻāpana he hoʻonohonoho maʻamau maʻamau.
I ka hōʻuluʻulu ʻana, he 25 mau ʻāpana i loko o kahi pahu wafers, ʻo ia ke koena i ʻike ʻia e ka ʻoihana semiconductor ma waena o ka hana pono, ka mālama kumu kūʻai a me ka maʻalahi o ka logistic. Me ka hoʻomau mau ʻana o ka ʻenehana, hiki ke hoʻoponopono ʻia kēia helu, akā ʻo ke kumu kumu ma hope o ia - ka hoʻonui ʻana i nā kaʻina hana a me ka hoʻomaikaʻi ʻana i nā pono waiwai - ʻaʻole i loli.
Hoʻohana ka 12-inihi wafer fabs i ka FOUP a me ka FOSB, a ʻo 8-inihi a ma lalo (me ka 8-inihi) hoʻohana i ka Cassette, SMIF POD, a me ka pahu wafer waʻa, ʻo ia hoʻi, ka 12-ʻīniha.lawe waferua kapa ʻia ʻo FOUP, a ʻo ka 8 inihalawe waferua kapa ʻia ʻo Cassette. ʻO ka maʻamau, ʻo kahi FOUP kaʻawale ma kahi o 4.2 kg, a ʻo kahi FOUP i hoʻopiha ʻia me 25 wafers ma kahi o 7.3 kg.
Wahi a ka noiʻi a me nā helu o ka hui noiʻi QYResearch, ua hiki ke kūʻai aku i ka mākeke pahu wafer honua i 4.8 biliona yuan ma 2022, a ua manaʻo ʻia e hōʻea i 7.7 biliona yuan ma 2029, me kahi hui ulu makahiki (CAGR) o 7.9%. Ma ke ʻano o ke ʻano huahana, ʻo ka semiconductor FOUP ka hapa nui loa o ka mākeke holoʻokoʻa, ma kahi o 73%. Ma ke ʻano o ka noi huahana, ʻo ka noi nui loa he 12-inch wafers, a ukali ʻia e 8-inch wafers.
ʻOiaʻiʻo, he nui nā ʻano o nā mea lawe wafer, e like me FOUP no ka hoʻoili ʻana i ka wafer i nā mea kanu wafer; FOSB no ka lawe ana ma waena o ka hana wafer silika a me na mea kanu wafer; Hiki ke hoʻohana ʻia nā mea lawe CASSETTE no ka lawe ʻana i waena o ke kaʻina hana a hoʻohana pū me nā kaʻina hana.
KAPE WEHE
Hoʻohana nui ʻia ka OPEN CASSETTE i ka lawe ʻana i waena o nā kaʻina hana a me nā kaʻina hoʻomaʻemaʻe i ka hana wafer. E like me FOSB, FOUP a me nā mea lawe ʻē aʻe, hoʻohana maʻamau ia i nā mea i kū i ka wela, loaʻa nā waiwai mechanical maikaʻi loa, kūpaʻa dimensional, a paʻa, anti-static, haʻahaʻa haʻahaʻa, haʻahaʻa ka ua, a hiki ke hana hou. ʻOkoʻa nā nui wafer, nā node kaʻina hana, a me nā mea i koho ʻia no nā kaʻina hana like ʻole. ʻO nā mea maʻamau he PFA, PTFE, PP, PEEK, PES, PC, PBT, PEI, COP, a me nā mea'ē aʻe.
Hiki ke hoʻohana ʻia ka OPEN CASSETTE me nā mea piliWafer Cassettenā huahana no ka mālama ʻana i ka wafer a me ka lawe ʻana ma waena o nā kaʻina hana e hōʻemi i ka ʻino o ka wafer.
Hoʻohana ʻia ka OPEN CASSETTE me nā huahana Wafer Pod (OHT) i hoʻopili ʻia, hiki ke hoʻohana ʻia i ka hoʻouna ʻana i ka automated, ke komo ʻana a me ka hoʻopaʻa ʻana i hoʻopaʻa ʻia ma waena o nā kaʻina hana i ka hana wafer a me ka hana chip.
ʻOiaʻiʻo, hiki ke hana pololei ʻia ka OPEN CASSETTE i nā huahana CASSETTE. ʻO ka huahana Wafer Shipping Boxes he ʻano like ia, e like me ka mea i hōʻike ʻia ma ke kiʻi ma lalo nei. Hiki iā ia ke hoʻokō i nā pono o ka lawe ʻana i ka wafer mai nā mea kanu wafer i nā mea kanu hana chip. ʻO CASSETTE a me nā huahana ʻē aʻe i loaʻa mai ia mea hiki ke hoʻokō pono i nā pono o ka hoʻouna ʻana, ka mālama ʻana a me ka lawe ʻana i waena o ka hale hana ma waena o nā kaʻina hana i nā hale hana wafer a me nā hale hana chip.
Pahu Hoʻouna Wafer wehe mua FOSB
Hoʻohana nui ʻia ka Front Opening Wafer Shipping Box FOSB no ka lawe ʻana i nā wafers 12-inihi ma waena o nā mea kanu wafer a me nā mea kanu hana chip. Ma muli o ka nui o nā wafers a me nā koi kiʻekiʻe no ka maʻemaʻe; Hoʻohana ʻia nā ʻāpana kūlana kūikawā a me ka hoʻolālā shockproof e hōʻemi i nā haumia i hana ʻia e ka wafer displacement friction; hana ʻia nā mea maka i nā mea haʻahaʻa haʻahaʻa haʻahaʻa, hiki ke hōʻemi i ka pilikia o ka hoʻoheheʻe ʻana i nā wafers. Hoʻohālikelike ʻia me nā pahu wafer halihali ʻē aʻe, ʻoi aku ka maikaʻi o ka ea o ka FOSB. Eia kekahi, ma ka hale hana laina hope hope, hiki ke hoʻohana ʻia ka FOSB no ka mālama ʻana a me ka hoʻoili ʻana o nā wafers ma waena o nā kaʻina hana.
Hana ʻia ka FOSB i 25 mau ʻāpana. Ma waho aʻe o ka mālama ʻana a me ka hoʻihoʻi ʻana ma o ka Automated Material Handling System (AMHS), hiki ke hoʻohana lima ʻia.
Pod Unified Opening
Hoʻohana nui ʻia ka Front Opening Unified Pod (FOUP) no ka pale ʻana, ka lawe ʻana a me ka mālama ʻana i nā wafers i ka hale hana Fab. He ipu lawe koʻikoʻi ia no ka ʻōnaehana lawe ʻokoʻa ma ka hale hana wafer 12-inihi. ʻO kāna hana koʻikoʻi, ʻo ia ka mālama ʻana i kēlā me kēia 25 wafers e pale ʻia e ka lepo i loko o ke kaiapuni waho i ka wā o ka hoʻouna ʻana ma waena o kēlā me kēia mīkini hana, a laila e hoʻopilikia i ka hua. Loaʻa i kēlā me kēia FOUP nā papa hoʻohui like ʻole, nā pine a me nā lua i loaʻa ka FOUP ma ke awa hoʻouka a hoʻohana ʻia e ka AMHS. Hoʻohana ia i nā mea haʻahaʻa haʻahaʻa haʻahaʻa a me nā mea haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa, hiki ke hōʻemi nui i ka hoʻokuʻu ʻana o nā pūhui organik a pale i ka hoʻohaumia ʻana i ka wafer; i ka manawa like, hiki i ka hana hoʻopili maikaʻi a me ka hoʻonui ʻana ke hāʻawi i kahi haʻahaʻa haʻahaʻa haʻahaʻa no ka wafer. Eia hou, hiki ke hoʻolālāʻia ka FOUP i nā kala likeʻole, e like me kaʻulaʻula, kaʻalani, kaʻeleʻele, ka māmā, a me nā mea'ē aʻe, e hoʻokō i nā koi kaʻina hana a hoʻokaʻawale i nā kaʻina hana a me nā kaʻina hana; ʻO ka maʻamau, hoʻonohonoho ʻia ka FOUP e nā mea kūʻai aku e like me ka laina hana a me nā ʻokoʻa mīkini o ka hale hana Fab.
Eia hou, hiki ke hoʻopilikinoʻia ka POUP i nā huahana kūikawā no nā mea hana hoʻopihapiha e like me nā kaʻina hana likeʻole e like me TSV a me FAN OUT i loko o ka chip back-end packaging, e like me SLOT FOUP, 297mm FOUP, a pēlā aku. Hiki ke hana houʻia ka FOUP, aʻo kona ola ola. ma waena o 2-4 mau makahiki. Hiki i nā mea hana FOUP ke hāʻawi i nā lawelawe hoʻomaʻemaʻe huahana e hālāwai me nā huahana haumia e hoʻohana hou ʻia.
Nā Mea Hoʻouna Wafer Horizontal ʻole pili
Hoʻohana nui ʻia ʻo Contactless Horizontal Wafer Shippers no ka lawe ʻana i nā wafers i hoʻopau ʻia, e like me ka mea i hōʻike ʻia ma ke kiʻi ma lalo nei. Hoʻohana ka pahu lawe o Entegris i ke apo kākoʻo e hōʻoia i ka pili ʻole o nā wafers i ka wā o ka mālama ʻana a me ka lawe ʻana, a he sila maikaʻi e pale ai i ka haumia o ka haumia, ʻaʻahu, collision, scratches, degassing, etc. nā wafers i hoʻopaʻa ʻia, a ʻo kāna mau wahi noi e komo pū me 3D, 2.5D, MEMS, LED a me nā semiconductors mana. Hoʻolako ʻia ka huahana me nā apo kākoʻo 26, me ka mana wafer o 25 (me nā mānoanoa like ʻole), a ʻo ka nui o ka wafer he 150mm, 200mm a me 300mm.
Ka manawa hoʻouna: Iulai-30-2024