WaferʻO ka ʻoki ʻana kekahi o nā loulou koʻikoʻi i ka hana semiconductor mana. Hoʻolālā ʻia kēia ʻanuʻu no ka hoʻokaʻawale pono ʻana i nā kaapuni i hoʻohui ʻia a i ʻole nā ʻāpana mai nā wafers semiconductor.
ʻO ke kī iwaferhiki i ka ʻoki ʻoki ke hoʻokaʻawale i nā ʻāpana pākahi me ka hōʻoia ʻana i ka hoʻopili ʻia ʻana o nā hale a me nā kaapuni i loko o kawaferaole i poino. ʻO ka holomua a iʻole ka hanaʻole o kaʻokiʻokiʻanaʻaʻole e pili wale i ka maikaʻi o ka hoʻokaʻawaleʻana a me ka hua o ka chip, akā pili pono hoʻi i ka pono o ke kaʻina hana holoʻokoʻa.
▲ ʻEkolu ʻano maʻamau o ka ʻoki wafer | Puna: KLA CHINA
I kēia manawa, ka mea maʻamauwaferHoʻokaʻawale ʻia nā kaʻina hana ʻoki i:
ʻOki lāʻau: kumu kūʻai haʻahaʻa, hoʻohana maʻamau no ka mānoanoawafers
ʻO ka ʻoki laser: ke kumu kūʻai kiʻekiʻe, hoʻohana pinepine ʻia no nā wafers me ka mānoanoa o ʻoi aku ma mua o 30μm
ʻO ka ʻoki ʻana i ka plasma: ke kumu kūʻai kiʻekiʻe, ʻoi aku nā palena, hoʻohana maʻamau no nā wafers me ka mānoanoa o lalo o 30μm
ʻOki ʻoki mīkini
ʻO ka ʻoki ʻana i ka maka he kaʻina o ka ʻoki ʻana ma ka laina kākau me kahi diski wiliwili kiʻekiʻe (blade). Hana ʻia ka ʻili i nā mea daimana abrasive a i ʻole ultra-thin, kūpono no ka ʻoki ʻana a i ʻole ke kāʻei ʻana i nā wafer silika. Eia nō naʻe, ma ke ʻano he ʻoki ʻoki mīkini, hilinaʻi ka ʻoki ʻoki i ka wehe ʻana i nā mea kino, hiki ke alakaʻi maʻalahi i ka ʻoki ʻana a i ʻole ka haki ʻana o ka ʻaoʻao chip, no laila e pili ana i ka maikaʻi o ka huahana a hōʻemi i ka hua.
Hoʻopili ʻia ka maikaʻi o ka huahana hope i hana ʻia e ke kaʻina sawing mechanical e nā ʻāpana he nui, e like me ka wikiwiki o ka ʻoki ʻana, ka mānoanoa o ka ʻili, ke anawaena o ka ʻili, a me ka wikiwiki o ka hoʻololi ʻana.
ʻO ke ʻoki piha ʻo ia ke ʻano o ka ʻoki ʻoki maʻamau, kahi e ʻoki loa ai i ka mea hana ma ke ʻoki ʻana i kahi mea paʻa (e like me ka lipine slicing).
▲ ʻoki ʻoki piha ʻana i ka pahi mīkini | Pūnaewele kumu kiʻi
ʻO ka hapalua ʻoki kahi ʻano hana e hana ai i kahi ʻoki ma ka ʻoki ʻana i ka waena o ka mea hana. Ma ka hoʻomau mau ʻana i ke kaʻina hana grooving, hiki ke hana ʻia nā kikoʻī a me ke ʻano o ka nila.
▲ ʻoki ʻoki ʻoki ʻia ka ʻāpana mīkini | Pūnaewele kumu kiʻi
ʻO ke ʻoki ʻelua he ʻano hana e hoʻohana ana i kahi ʻoki ʻoki pālua me ʻelua wili e hana i nā ʻoki piha a hapalua paha ma nā laina hana ʻelua i ka manawa like. ʻElua koʻi wiliwili i ka ʻili ʻoki pālua. Hiki ke hoʻokō i ka hana kiʻekiʻe ma o kēia kaʻina hana.
▲ ʻoki ʻelua ʻoki ʻoki ʻana i ka pahi mīkini | Pūnaewele kumu kiʻi
Hoʻohana ʻia ka ʻoki ʻanuʻu i kahi ʻoki ʻoki pālua me ʻelua mau milo e hana i nā ʻoki piha a me ka hapalua i ʻelua pae. E hoʻohana i nā ʻāpana i hoʻopaʻa ʻia no ka ʻoki ʻana i ka papa uwea ma ka ʻili o ka wafer a me nā lau i hoʻopaʻa ʻia no ke koena silika aniani hoʻokahi e hoʻokō i ka hana kiʻekiʻe.
▲ ʻOki ʻoki ʻana i ka maka mīkini – ʻoki ʻanuʻu | Pūnaewele kumu kiʻi
ʻO ka ʻoki ʻana i ka bevel kahi ʻano hana e hoʻohana ai i kahi pahi me ka ʻaoʻao V-like ma ka ʻaoʻao hapa ʻoki e ʻoki i ka wafer i ʻelua mau ʻanuʻu i ka wā o ke kaʻina hana ʻoki. Hana ʻia ke kaʻina chamfering i ka wā o ka ʻoki ʻana. No laila, hiki ke hoʻokō ʻia ka ikaika mold kiʻekiʻe a me ka hana kiʻekiʻe.
▲ ʻOki ʻana i ka ʻili mīkini – ʻoki ʻili | Pūnaewele kumu kiʻi
ʻOki laser
ʻO ka ʻoki ʻoki ʻana he ʻenehana ʻokiʻoki wafer non-contact e hoʻohana ana i kahi kukuna laser i hoʻokaʻawale ʻia e hoʻokaʻawale i nā ʻāpana pākahi mai nā wafers semiconductor. Hoʻopili ʻia ka kukuna laser kiʻekiʻe ma ka ʻili o ka wafer a hoʻoheheʻe a wehe paha i nā mea ma ka laina ʻoki i koho mua ʻia ma o ka ablation a i ʻole nā kaʻina decomposition thermal.
▲ Hoʻokiʻekiʻe kiʻi laser | Puna kiʻi: KLA CHINA
ʻO nā ʻano lasers i hoʻohana nui ʻia i kēia manawa ʻo nā lasers ultraviolet, nā laser infrared, a me nā lasers femtosecond. I waena o lākou, hoʻohana pinepine ʻia nā laser ultraviolet no ka ablation anuanu ma muli o ko lākou ikehu photon kiʻekiʻe, a he liʻiliʻi loa ka wahi i hoʻopilikia ʻia i ka wela, hiki ke hoʻemi pono i ka hopena o ka pōʻino wela i ka wafer a me nā ʻāpana a puni. ʻOi aku ka maikaʻi o nā laser infrared no nā wafers mānoanoa no ka mea hiki iā lākou ke komo hohonu i loko o ka mea. Loaʻa i nā lasers Femtosecond ke kiʻekiʻe a me ka hoʻoneʻe ʻana i nā mea me ka negligible hoʻoili wela ma o nā pulses māmā ultrashort.
ʻOi aku ka maikaʻi o ka ʻoki ʻoki laser ma mua o ka ʻoki ʻoki maʻamau. ʻO ka mea mua, ma ke ʻano he kaʻina non-contact, ʻaʻole pono ka ʻoki ʻana i ka laser i ke kaomi kino ma ka wafer, e hōʻemi ana i ka ʻāpana a me nā pilikia maʻamau maʻamau i ka ʻoki ʻana. Hana kēia hiʻohiʻona i ka ʻokiʻoki laser i kūpono no ka hoʻoponopono ʻana i nā wafers palupalu a lahilahi paha, ʻoi aku ka poʻe me nā hale paʻakikī a i ʻole nā hiʻohiʻona maikaʻi.
▲ Hoʻokiʻekiʻe kiʻi laser | Pūnaewele kumu kiʻi
Eia kekahi, ʻo ke kiʻekiʻe kiʻekiʻe a me ka pololei o ka ʻoki ʻana i ka laser e hiki ai iā ia ke hoʻohuli i ka kukuna laser i kahi liʻiliʻi liʻiliʻi loa, kākoʻo i nā hiʻohiʻona ʻoki paʻakikī, a hoʻokō i ka hoʻokaʻawale ʻana o ka palena liʻiliʻi ma waena o nā chips. He mea koʻikoʻi kēia hiʻohiʻona no nā polokalamu semiconductor holomua me ka nui o ka emi ʻana.
Eia nō naʻe, loaʻa i ka ʻoki laser kekahi mau palena. Ke hoʻohālikelike ʻia me ka ʻoki ʻana i ka maka, ʻoi aku ka lohi a ʻoi aku ka pipiʻi, ʻoi aku ka nui o ka hana nui. Eia kekahi, ʻo ke koho ʻana i ke ʻano laser kūpono a me ka hoʻonui ʻana i nā ʻāpana e hōʻoia i ka lawe ʻana i nā mea pono a me ka liʻiliʻi o ka wela wela hiki ke paʻakikī no kekahi mau mea a me nā mānoanoa.
ʻOki ʻoki ablation laser
I ka wā o ka ʻoki ʻoki ʻana i ka laser, ua kālele pono ʻia ka kukuna laser ma kahi i kuhikuhi ʻia ma ka ʻili o ka wafer, a alakaʻi ʻia ka ikehu laser e like me ke ʻano ʻoki i koho mua ʻia, e ʻoki mālie ana i ka wafer i lalo. Ma muli o nā koi ʻoki, hana ʻia kēia hana me ka laser pulsed a i ʻole ka laser hawewe mau. No ka pale ʻana i ka pōʻino o ka wafer ma muli o ka hoʻomehana ʻana o ka laser, hoʻohana ʻia ka wai hoʻomaha e hoʻomaha a pale i ka wafer mai ka pōʻino wela. I ka manawa like, hiki i ka wai hoʻoluʻu ke hoʻoneʻe maikaʻi i nā ʻāpana i hana ʻia i ka wā o ke kaʻina ʻokiʻoki, pale i ka haumia a hōʻoia i ka ʻoki ʻana i ka maikaʻi.
Laser ʻoki ʻike ʻole ʻia
Hiki ke hoʻopaʻa ʻia ka laser no ka hoʻoili ʻana i ka wela i loko o ke kino nui o ka wafer, kahi ʻano i kapa ʻia ʻo "invisible laser cutting". No kēia ʻano, hana ka wela mai ka laser i nā āpau i nā ala kākau. Loaʻa i kēia mau wahi nāwaliwali ka hopena komo like me ka haki ʻana i ka wā e kikoo ʻia ka wafer.
▲Ka hana nui o ka ʻoki ʻike ʻole ʻia o ka laser
ʻO ke kaʻina hana ʻoki i ʻike ʻole ʻia he kaʻina laser absorption kūloko, ma mua o ka ablation laser kahi e komo ai ka laser ma ka ʻili. Me ka ʻoki ʻike ʻole ʻia, hoʻohana ʻia ka ikehu kukuna laser me ka lōʻihi o ka nalu i semi-transparent i ka mea wafer substrate. Hoʻokaʻawale ʻia ke kaʻina hana i ʻelua mau ʻanuʻu nui, hoʻokahi kahi kaʻina hana laser, a ʻo kekahi ka hana hoʻokaʻawale mechanical.
▲Hoʻokumu ka kukuna laser i kahi perforation ma lalo o ka ʻili wafer, a ʻaʻole pili ka ʻaoʻao mua a me hope | Pūnaewele kumu kiʻi
I ka ʻanuʻu mua, i ka nānā ʻana o ka kukuna laser i ka wafer, ua kālele ka kukuna laser i kahi kikoʻī i loko o ka wafer, e hana ana i kahi pohā i loko. Hoʻokumu ka ikehu beam i nā māwae i loko, ʻaʻole i hoʻonui i ka mānoanoa holoʻokoʻa o ka wafer a hiki i ka ʻili o luna a lalo.
▲ Ka hoʻohālikelike ʻana o 100μm mānoanoa silicon wafers i ʻoki ʻia e ke ʻano blade a me ke ʻano ʻoki ʻike ʻole ʻia o ka laser | Pūnaewele kumu kiʻi
Ma ka ʻanuʻu ʻelua, ua hoʻonui kino ʻia ka lipine chip ma lalo o ka wafer, kahi e hoʻoulu ai i ke koʻikoʻi tensile i nā māwae i loko o ka wafer, i hoʻoulu ʻia i ke kaʻina laser i ka hana mua. ʻO kēia koʻikoʻi ka mea e hoʻolōʻihi i nā māwae i luna a me lalo o ka wafer, a laila e hoʻokaʻawale i ka wafer i mau ʻāpana ma kēia mau wahi ʻoki. I ka ʻoki ʻike ʻole ʻia, hoʻohana mau ʻia ka ʻoki ʻoki hapa a i ʻole ka ʻaoʻao lalo e hoʻomaʻamaʻa i ka hoʻokaʻawale ʻana o nā wafers i loko o nā ʻāpana a i ʻole nā ʻāpana.
ʻO nā pōmaikaʻi nui o ka ʻoki ʻana i ka laser ʻike ʻole ma luna o ka ablation laser:
• ʻAʻole pono ka mea hoʻomaʻamaʻa
• ʻAʻohe ʻōpala i hana ʻia
• ʻAʻohe wahi wela i hiki ke hoʻopōʻino i nā kaapuni pili
ʻOki plasma
ʻO ka ʻoki plasma (ʻike pū ʻia ʻo plasma etching a i ʻole etching maloʻo) kahi ʻenehana ʻoki wafer holomua e hoʻohana ana i ka reactive ion etching (RIE) a i ʻole ka hohonu reactive ion etching (DRIE) e hoʻokaʻawale i nā ʻāpana pākahi mai nā wafers semiconductor. Loaʻa ka ʻenehana i ka ʻoki ʻana ma o ka wehe ʻana i nā mea ma nā laina ʻoki i koho mua ʻia me ka plasma.
I ka wā o ka ʻoki ʻana i ka plasma, ua hoʻokomo ʻia ka wafer semiconductor i loko o kahi keʻena vacuum, ua hoʻokomo ʻia kahi hui kino reactive controled i loko o ke keʻena, a ua hoʻohana ʻia kahi māla uila e hana i kahi plasma i loaʻa kahi kiʻekiʻe o nā ion reactive a me nā radical. Hoʻopili kēia mau ʻano hoʻolalelale me ka mea wafer a hoʻoneʻe koho i nā mea wafer ma ka laina kākau ma o ka hui pū ʻana o ka hopena kemika a me ka sputtering kino.
ʻO ka pōmaikaʻi nui o ka ʻoki ʻana i ka plasma ʻo ia ka hōʻemi ʻana i ke koʻikoʻi mechanical ma ka wafer a me ka chip a hōʻemi i ka pōʻino i hoʻokumu ʻia e ka pili kino. Eia nō naʻe, ʻoi aku ka paʻakikī o kēia kaʻina hana ma mua o nā ʻano hana ʻē aʻe, ʻoi aku hoʻi i ka wā e pili ana i nā wafers mānoanoa a i ʻole nā mea me ke kūpaʻa etching kiʻekiʻe, no laila ua kaupalena ʻia kāna noi i ka hana nui.
▲ Pūnaehana kumu kiʻi
I ka hana semiconductor, pono e koho ʻia ke ʻano o ka ʻoki wafer ma muli o nā kumu he nui, e komo pū me nā waiwai wafer, ka nui o ka chip a me ka geometry, koi ʻia ka pololei a me ka pololei, a me ka uku hana holoʻokoʻa a me ka pono.
Ka manawa hoʻouna: Sep-20-2024