Ke alakaʻi nei ka ʻenehana laser i ka hoʻololi ʻana o ka ʻenehana hoʻoponopono silika carbide substrate

 

1. Nānā nui oʻāpana kalapona silikaʻenehana hana

ʻO kēia manawaʻāpana kalapona silika ʻO ka hana ʻana i nā ʻanuʻu: ka wili ʻana i ka pōʻai o waho, ka ʻoki ʻana, ka chamfering, ka wili, ka polishing, ka hoʻomaʻemaʻe, a me nā mea ʻē aʻe. I kēia manawa, ka ʻoki ʻana onā mea hoʻoheheʻe kalapona silikaʻo ka ʻoki uwea ka nui. ʻO ka ʻoki slurry multi-wire ke ʻano ʻoki uea maikaʻi loa i kēia manawa, akā aia nō nā pilikia o ka maikaʻi ʻole o ka ʻoki ʻana a me ka poho ʻoki nui. E hoʻonui ka nalowale o ka ʻoki uea me ka hoʻonui ʻana o ka nui o ka substrate, ʻaʻole kūpono i kaʻāpana kalapona silikanā mea hana e hoʻokō i ka hōʻemi kumukūʻai a me ka hoʻomaikaʻi maikaʻi. I ka ʻoki ʻana8-inihi kalapona kalapona nā mea pani, He ʻilihune ke ʻano o ka ʻili o ka substrate i loaʻa ma ka ʻoki uea, a ʻaʻole maikaʻi nā hiʻohiʻona helu e like me WARP a me BOW.

He hana koʻikoʻi ka ʻoki ʻana i ka hana semiconductor substrate. Ke ho'āʻo mau nei ka ʻoihana i nā ʻano ʻokiʻoki hou, e like me ke ʻoki uwea daimana a me ka wehe ʻana i ka laser. Ua ʻimi nui ʻia ka ʻenehana huki laser i kēia manawa. ʻO ka hoʻokomo ʻana i kēia ʻenehana e hōʻemi i ka ʻoki ʻana a hoʻomaikaʻi i ka ʻoki ʻana i ka pono mai ke kumu ʻenehana. He koi kiʻekiʻe ka hopena o ka hoʻopau ʻana i ka laser no ke kiʻekiʻe o ka automation a koi aku i ka ʻenehana thinning e hui pū me ia, e like me ka hoʻomohala ʻana i ka wā e hiki mai ana o ka hoʻoili ʻana o ka silicon carbide substrate. He 1.5-1.6 ka nui o ka hua o ka oki uwea moka kahiko. Hiki i ka hoʻokomo ʻana i ka ʻenehana huki laser ke hoʻonui i ka hua ʻāpana i kahi 2.0 (e nānā i nā lako DISCO). I ka wā e hiki mai ana, e like me ka piʻi ʻana o ka ʻenehana huki ʻana i ka laser, hiki ke hoʻomaikaʻi hou ʻia ka hua ʻāpana; i ka manawa like, hiki i ka huki ʻana i ka laser ke hoʻomaikaʻi nui i ka pono o ka ʻoki ʻana. Wahi a ka noiʻi mākeke, ʻoki ka alakaʻi ʻoihana ʻo DISCO i kahi ʻāpana ma kahi o 10-15 mau minuke, ʻoi aku ka maikaʻi ma mua o ka ʻoki ʻana i ka uwea mortar o kēia manawa he 60 mau minuke i kēlā me kēia ʻāpana.

ʻO nā ʻanuʻu kaʻina o ka ʻoki uea kuʻuna o nā substrates silicon carbide ʻo ia: ʻoki uea-wili ʻili-wili maikaʻi-wiliwili maikaʻi-ʻiliʻili a me ka polishing maikaʻi. Ma hope o ka hoʻololi ʻana o ke kaʻina hoʻoheheʻe laser i ka ʻoki uea, hoʻohana ʻia ke kaʻina hana thinning e pani i ke kaʻina wili, e hōʻemi ana i ka nalowale o nā ʻāpana a hoʻomaikaʻi i ka hana pono. Hoʻokaʻawale ʻia ke kaʻina o ka ʻoki ʻana i ka ʻokiʻoki, ka wili ʻana a me ka polishing o nā substrates silicon carbide i ʻekolu mau ʻanuʻu: ka nānā ʻana i ka ʻili laser-ka hoʻoneʻe substrate-ingot flattening: ʻo ka nānā ʻana i ka ʻili laser e hoʻohana i nā pulse laser ultrafast e hana i ka ʻili o ka ingot e hana i kahi hoʻololi. papa i loko o ka ingot; ʻO ka wehe ʻana o ka substrate e hoʻokaʻawale i ka substrate ma luna o ka papa i hoʻololi ʻia mai ka ingot e nā ʻano kino; ʻO ka hoʻopili ʻana i ka ingot ka wehe ʻana i ka papa i hoʻololi ʻia ma ka ʻili o ka ingot e hōʻoia i ka palahalaha o ka ʻili.
ʻO ke kaʻina hoʻoneʻe ʻana i ka laser carbide silikon

 

2. ʻO ka holomua o ka honua i ka ʻenehana wehe ʻana i ka laser a me nā ʻoihana i komo i ka ʻoihana

Ua hoʻohana mua ʻia ke kaʻina hana huki laser e nā hui ʻē aʻe: I ka makahiki 2016, ua hoʻomohala ʻo DISCO o Iapana i kahi ʻenehana hoʻoheheʻe laser hou KABRA, ka mea i hana i kahi papa hoʻokaʻawale a hoʻokaʻawale i nā wafers i kahi hohonu i kuhikuhi ʻia ma ka hoʻomau mau ʻana i ka ingot me ka laser, hiki ke hoʻohana ʻia no nā ʻano like ʻole. nā ʻano o ka SiC ingots. I Nowemapa 2018, ua loaʻa iā Infineon Technologies iā Siltectra GmbH, kahi hoʻomaka ʻoki ʻoki wafer, no 124 miliona euros. Ua hoʻomohala ka mea hope i ke kaʻina hana Cold Split, kahi e hoʻohana ai i ka ʻenehana laser patented e wehewehe i ka ʻāpana hoʻokaʻawale, ʻaʻahu i nā mea polymer kūikawā, ka ʻōnaehana hoʻomalu i hoʻoulu ʻia i ke koʻikoʻi, ʻoki pono i nā mea, a wili a maʻemaʻe e hoʻokō i ka ʻoki wafer.

I nā makahiki i hala iho nei, ua komo pū kekahi mau ʻoihana kūloko i ka ʻoihana ʻenehana hoʻopale laser: ʻo nā hui nui ʻo Han's Laser, Delong Laser, West Lake Instrument, Universal Intelligence, China Electronics Technology Group Corporation a me ka Institute of Semiconductors o ka Chinese Academy of Science. Ma waena o lākou, ua lōʻihi ka lōʻihi o ka hoʻonohonoho ʻana o nā hui ʻo Han's Laser a me Delong Laser, a ke hōʻoia ʻia nei kā lākou huahana e nā mea kūʻai aku, akā he nui nā laina huahana o ka hui, a ʻo nā mea hoʻolele laser hoʻokahi wale nō o kā lākou ʻoihana. ʻO nā huahana o nā hōkū e piʻi aʻe e like me West Lake Instrument ua loaʻa i nā hoʻouna kauoha maʻamau; ʻO Universal Intelligence, China Electronics Technology Group Corporation 2, ka Institute of Semiconductors o ka Chinese Academy of Sciences a me nā hui ʻē aʻe i hoʻokuʻu i ka holomua o nā lako.

 

3. Nā kumu hoʻokele no ka hoʻomohala ʻana i ka ʻenehana huki laser a me ke kani o ka hoʻolauna mākeke

ʻO ka hoʻemi ʻana o ke kumu kūʻai o nā substrates silicon carbide 6-inch i ka hoʻomohala ʻana i ka ʻenehana wehe ʻana i ka laser: I kēia manawa, ua hāʻule ke kumukūʻai o nā substrates silicon carbide 6-inch ma lalo o 4,000 yuan / ʻāpana, kokoke i ke kumu kūʻai o kekahi mau mea hana. He kiʻekiʻe ka hopena o ke kaʻina hana hoʻoneʻe laser a me ka loaʻa kālā ikaika, kahi e hoʻonui ai i ka nui o ke komo ʻana o ka ʻenehana huki laser.

ʻO ka mānoanoa o 8-inch silicon carbide substrates e hoʻoikaika i ka hoʻomohala ʻana i ka ʻenehana hoʻokaʻawale ʻana i ka laser: ʻO ka mānoanoa o 8-inch silicon carbide substrates i kēia manawa he 500um, a ke ulu nei i kahi mānoanoa o 350um. ʻAʻole maikaʻi ke kaʻina ʻoki uea i ka hana 8-inch silicon carbide (ʻaʻole maikaʻi ka ʻili o ka substrate), a ua emi nui nā waiwai BOW a me WARP. Manaʻo ʻia ʻo Laser stripping he ʻenehana hana pono no ka 350um silicon carbide substrate processing, ka mea e hoʻonui ai i ka piʻi ʻana o ka ʻenehana laser stripping.

Nā manaʻolana o ka mākeke: ʻO ka SiC substrate laser stripping nā mea pono mai ka hoʻonui ʻana o 8-inch SiC a me ka hōʻemi ʻana o ka 6-inch SiC. Ke neʻe mai nei ke kūlana koʻikoʻi o ka ʻoihana i kēia manawa, a e wikiwiki loa ka hoʻomohala ʻana i ka ʻoihana.