Menene tsarin tsara tsarin CMP?

Dual-Damascene fasaha ce ta tsari da ake amfani da ita don kera haɗin haɗin ƙarfe a cikin haɗaɗɗun da'irori. Wani ci gaba ne na tsarin Damascus. Ta hanyar kafa ta cikin ramuka da ramuka a lokaci guda a cikin matakan tsari iri ɗaya da kuma cika su da ƙarfe, haɗin haɗin gwiwar haɗin gwiwar ƙarfe yana samuwa.

Me yasa ake kiranta Damascus?

Birnin Damascus babban birnin kasar Syria ne, kuma takubban Damascus sun shahara da kaifi da kyawu. Ana buƙatar wani nau'i na tsarin shigar da shi: na farko, ana zana tsarin da ake buƙata a saman karfen Damascus, kuma kayan da aka riga aka shirya an sanya su sosai a cikin ramukan da aka zana. Bayan an gama shigarwa, saman na iya zama ɗan rashin daidaituwa. Mai sana'a zai goge shi a hankali don tabbatar da santsi gaba ɗaya. Kuma wannan tsari shine samfurin tsari na Dual Damascus na guntu. Da farko, an zana ramuka ko ramuka a cikin dielectric Layer, sa'an nan kuma an cika ƙarfe a cikinsu. Bayan cikawa, za a cire ƙarancin ƙarfe ta hanyar cmp.

Babban matakai na tsarin damascene dual sun haɗa da:

▪ Zubar da Layer Dielectric:

Ajiye wani Layer na dielectric abu, kamar silicon dioxide (SiO2), a kan semiconductorwafer.

Hotunan hoto don ayyana tsarin:

Yi amfani da hotolithography don ayyana tsarin ta hanyar vias da ramuka akan Layer dielectric.

▪Etching:

Canja wurin tsarin vias da ramuka zuwa dielectric Layer ta hanyar bushe ko rigar etching tsari.

▪ Zubar da ƙarfe:

Ƙarfe na ajiya, kamar tagulla (Cu) ko aluminum (Al), a cikin vias da ramuka don samar da haɗin gwiwar ƙarfe.

▪ goge-goge na injina:

Chemical inji polishing na karfe surface don cire wuce haddi karfe da kuma flatten surface.

Idan aka kwatanta da tsarin ƙirar haɗin gwiwar ƙarfe na gargajiya, tsarin damascene dual yana da fa'idodi masu zuwa:

▪ Sauƙaƙe matakai:ta hanyar kafa vias da ramuka lokaci guda a cikin wannan mataki mataki, da tsari matakai da masana'antu lokaci an rage.

▪Ingantattun ingancin masana'antu:saboda raguwar matakan tsari, tsarin damascene na dual zai iya inganta ingantaccen masana'antu da rage farashin samarwa.

▪ Inganta ayyukan haɗin gwiwar ƙarfe:Tsarin damascene na dual na iya samun ƙananan haɗin haɗin ƙarfe na ƙarfe, don haka inganta haɗin kai da aikin da'irori.

▪ Rage karfin karfin jiki da juriya:ta amfani da ƙananan k dielectric kayan da inganta tsarin ƙarfe interconnects, parasitic capacitance da juriya za a iya rage, inganta gudun da ikon amfani yi na da'irori.