Waferyankan yana ɗaya daga cikin mahimman hanyoyin haɗin gwiwar samar da semiconductor. An ƙirƙiri wannan matakin don raba daidaitattun haɗaɗɗun da'irori ko kwakwalwan kwamfuta daga wafers na semiconductor.
Makullin zuwawaferyankan shine samun damar raba kwakwalwan kwamfuta guda ɗaya yayin tabbatar da cewa ƙaƙƙarfan sifofi da da'irori sun haɗa a cikinwaferba a lalace ba. Nasarar ko gazawar tsarin yanke ba kawai yana shafar ingancin rabuwa da yawan amfanin guntu ba, amma kuma yana da alaƙa kai tsaye da ingantaccen tsarin samarwa duka.
▲ Nau'i uku na yankan waina | Source: KLA CHINA
A halin yanzu, na kowawaferYanke hanyoyin sun kasu zuwa:
Yankan ruwa: ƙananan farashi, yawanci ana amfani dashi don kauriwafers
Laser yankan: babban farashi, yawanci ana amfani da wafers tare da kauri fiye da 30μm
Yanke Plasma: babban farashi, ƙarin hani, yawanci ana amfani dashi don wafers tare da kauri na ƙasa da 30μm
Yanke ruwan inji
Yanke ruwa wani tsari ne na yanke tare da layin marubuci ta hanyar faifai mai jujjuyawa mai sauri (blade). Yawanci ana yin ruwan wuka ne da kayan lu'u-lu'u masu ƙyalƙyali ko ƙwanƙwasa, wanda ya dace da yanka ko tsagi akan wafern siliki. Koyaya, azaman hanyar yankan inji, yankan ruwa ya dogara da cire kayan jiki, wanda zai iya haifar da guntu cikin sauƙi ko fashe gefen guntu, don haka yana shafar ingancin samfur da rage yawan amfanin ƙasa.
Ingancin samfurin ƙarshe da aka samar ta hanyar aikin injin inji yana shafar sigogi da yawa, gami da saurin yanke, kauri, diamita na ruwa, da saurin jujjuya ruwa.
Cikakkun yanke shine mafi mahimmancin hanyar yankan ruwa, wanda ke yanke aikin gaba ɗaya ta hanyar yanke zuwa ƙayyadaddun abu (kamar tef ɗin yanka).
▲ Mechanical ruwa yankan-cikakken yanke | Cibiyar sadarwa tushen hoto
Rabin yanke hanya ce ta sarrafawa wacce ke samar da tsagi ta yanke zuwa tsakiyar kayan aikin. Ta ci gaba da aiwatar da aikin tsagi, za a iya samar da tsefe da maki masu siffar allura.
▲ Mechanical ruwa yankan rabin yanke | Cibiyar sadarwa tushen hoto
Yanke sau biyu hanyar sarrafawa ce da ke amfani da zato guda biyu tare da dunƙule guda biyu don aiwatar da yanke cikakke ko rabi akan layin samarwa guda biyu a lokaci guda. Zadon yanka biyu yana da gatari biyu na sandal. Ana iya samun babban kayan aiki ta wannan tsari.
▲ Mechanical ruwa yankan-biyu yanke | Cibiyar sadarwa tushen hoto
Yanke mataki yana amfani da zato guda biyu tare da dunƙule biyu don yin cikakken yanke da rabi a matakai biyu. Yi amfani da ruwan wukake da aka inganta don yanke layin wayoyi a saman wafer da ruwan wukake da aka inganta don ragowar siliki guda kristal don cimma aiki mai inganci.
▲ Yanke ruwan wukake - yankan mataki | Cibiyar sadarwa tushen hoto
Yanke bevel hanyar sarrafawa ce da ke amfani da wuka mai siffar V a gefen da aka yanke rabin don yanke wafer a matakai biyu yayin aikin yanke mataki. Ana yin aikin chamfering yayin aiwatar da yankan. Sabili da haka, ana iya samun ƙarfin ƙira mai ƙarfi da aiki mai inganci.
▲ Yanke ruwan wukake - yankan bevel | Cibiyar sadarwa tushen hoto
Laser yankan
Yanke Laser fasaha ce ta yankan wafer mara lamba wacce ke amfani da katakon Laser da aka mayar da hankali don raba kwakwalwan kwamfuta guda ɗaya daga wafers na semiconductor. Laser katako mai ƙarfi mai ƙarfi yana mai da hankali kan saman wafer kuma yana ƙafe ko cire kayan tare da ƙayyadaddun yankan layin ta hanyar ɓarna ko ɓarnawar thermal.
▲ Tsarin yankan Laser | Tushen hoto: KLA CHINA
Nau'o'in Laser da ake amfani da su a halin yanzu sun haɗa da laser ultraviolet, laser infrared, da laser na femtosecond. Daga cikin su, ana amfani da laser na ultraviolet don daidaitaccen zubar da sanyi saboda yawan makamashin photon da suke da shi, kuma yankin da ke fama da zafi yana da ƙanƙanta sosai, wanda zai iya rage haɗarin zafin zafi ga wafer da guntuwar da ke kewaye. Laser infrared sun fi dacewa da wafers masu kauri saboda suna iya shiga zurfi cikin kayan. Laser na Femtosecond sun cimma madaidaicin madaidaici da ingantaccen cire kayan aiki tare da kusan canja wurin zafi ta hanyar ƙwanƙwasa hasken ultrashort.
Yanke Laser yana da fa'idodi masu mahimmanci akan yankan ruwan wukake na gargajiya. Na farko, a matsayin tsarin da ba a haɗa shi ba, yankan Laser baya buƙatar matsa lamba na jiki akan wafer, rage raguwa da ƙwanƙwasa matsaloli na yau da kullum a cikin yankan inji. Wannan fasalin yana sa yankan Laser musamman dacewa don sarrafa wafers maras ƙarfi ko ƙwanƙwasa, musamman waɗanda ke da sifofi masu rikitarwa ko fasali mai kyau.
▲ Tsarin yankan Laser | Cibiyar sadarwa tushen hoto
Bugu da kari, babban madaidaici da daidaiton yankan Laser yana ba shi damar mai da hankali kan katako na Laser zuwa ƙaramin ƙaramin tabo, tallafawa hadadden tsarin yankan, da cimma rabuwa da ƙaramin tazara tsakanin kwakwalwan kwamfuta. Wannan fasalin yana da mahimmanci musamman ga na'urorin semiconductor na ci gaba tare da raguwa masu girma.
Duk da haka, Laser yankan kuma yana da wasu gazawa. Idan aka kwatanta da yankan ruwa, yana da sannu a hankali kuma yana da tsada, musamman wajen samar da manyan kayayyaki. Bugu da ƙari, zabar nau'in laser da ya dace da haɓaka sigogi don tabbatar da ingantaccen cire kayan aiki da ƙananan yanki da ke fama da zafi na iya zama ƙalubale ga wasu kayan da kauri.
Laser ablation yankan
A lokacin yankan cirewar Laser, katakon Laser yana mai da hankali kan takamaiman wuri a saman wafer, kuma ana jagorantar makamashin Laser bisa ga tsarin yankan da aka ƙaddara, a hankali yanke ta cikin wafer zuwa ƙasa. Dangane da buƙatun yankan, ana yin wannan aikin ta amfani da Laser pulsed ko Laser mai ci gaba. Don hana lalacewa ga wafer saboda yawan dumama na'urar laser, ana amfani da ruwa mai sanyaya don kwantar da hankali da kuma kare wafer daga lalacewar zafi. A lokaci guda kuma, ruwa mai sanyaya zai iya kawar da barbashi da aka samar a lokacin yankan, hana kamuwa da cuta da tabbatar da ingancin yanke.
Laser ganuwa yankan
Laser kuma za a iya mayar da hankali ga canja wurin zafi a cikin babban jikin wafer, hanyar da ake kira "yanke laser marar ganuwa". Don wannan hanya, zafi daga Laser yana haifar da raguwa a cikin hanyoyin rubutun. Wadannan wuraren da suka raunana sannan suna samun irin wannan tasirin shiga ta hanyar karya lokacin da aka shimfiɗa wafer.
▲Main tsari na Laser ganuwa yankan
Tsarin yankan da ba a iya gani shine tsarin ɗaukar laser na ciki, maimakon ablation na laser inda Laser ke tunawa a saman. Tare da yankan da ba a iya gani, ana amfani da makamashin katako na Laser tare da tsayin raƙuman raƙuman ruwa wanda ke da tsaka-tsaki ga kayan wafer. Tsarin ya kasu kashi biyu manyan matakai, daya shine tsarin tushen laser, ɗayan kuma shine tsarin rabuwa na inji.
▲Laser beam yana haifar da huɗa a ƙasan wafer, kuma gefen gaba da baya ba ya shafar | Cibiyar sadarwa tushen hoto
A mataki na farko, yayin da katakon Laser ke duba wafer, katakon laser yana mai da hankali kan takamaiman wuri a cikin wafer, yana samar da wurin tsagewa a ciki. Ƙarfin katako yana haifar da jerin tsagewa a ciki, waɗanda har yanzu ba su wuce ta cikin dukan kauri na wafer zuwa saman da kasa ba.
▲ Kwatanta 100μm kauri silicon wafers yanke ta hanyar ruwa hanya da Laser ganuwa yankan Hanyar | Cibiyar sadarwa tushen hoto
A mataki na biyu, guntu tef ɗin da ke ƙasan wafer ɗin yana faɗaɗa ta jiki, wanda ke haifar da damuwa mai ƙarfi a cikin tsagewar da ke cikin wafer, waɗanda ke haifar da aikin laser a matakin farko. Wannan damuwa yana haifar da tsagewar don shimfiɗa a tsaye zuwa saman sama da ƙasa na wafer, sa'an nan kuma raba wafer zuwa guntu tare da waɗannan wuraren yanke. A cikin yankan da ba a iya gani ba, ana amfani da yankan rabin-yanke ko ƙasa-gefen rabin-yanke yawanci don sauƙaƙe rabuwar wafers zuwa guntu ko guntu.
Babban fa'idodin yankan Laser mara ganuwa akan ablation na laser:
• Babu mai sanyaya da ake buƙata
Ba a samar da tarkace ba
• Babu yankunan da zafi ya shafa wanda zai iya lalata da'irori masu mahimmanci
Yankewar Plasma
Yanke Plasma (wanda kuma aka sani da Plasma etching ko bushe etching) fasaha ce ta ci gaba ta wafer da ke amfani da reactive ion etching (RIE) ko zurfin reactive ion etching (DRIE) don raba kwakwalwan mutum ɗaya daga wafers na semiconductor. Fasaha ta cimma yankewa ta hanyar cire abubuwa ta hanyar sinadarai tare da ƙayyadaddun layukan yanke ta amfani da plasma.
A lokacin aikin yankan plasma, ana sanya wafer na semiconductor a cikin ɗaki mai ɗaki, ana shigar da cakuda iskar gas mai sarrafawa a cikin ɗakin, kuma ana amfani da filin lantarki don samar da plasma mai ɗauke da babban taro na ions da radicals. Waɗannan nau'ikan masu amsawa suna yin hulɗa tare da kayan wafer kuma suna zaɓin cire kayan wafer tare da layin marubuci ta hanyar haɗin sinadarai da sputter na zahiri.
Babban fa'idar yankan plasma shine yana rage damuwa na inji akan wafer da guntu kuma yana rage yuwuwar lalacewa ta hanyar saduwa ta jiki. Duk da haka, wannan tsari ya fi rikitarwa da cin lokaci fiye da sauran hanyoyin, musamman ma lokacin da ake hulɗa da wafers ko kayan da ke da tsayin daka, don haka aikace-aikacensa a cikin samar da yawa yana iyakance.
▲ Cibiyar sadarwa ta tushen hoto
A cikin masana'antar semiconductor, ana buƙatar zaɓin hanyar yankan wafer bisa dalilai da yawa, gami da kaddarorin kayan wafer, girman guntu da lissafi, daidaito da daidaito da ake buƙata, da ƙimar samarwa gabaɗaya da inganci.
Lokacin aikawa: Satumba-20-2024