1. Bayani nasilicon carbide substratefasahar sarrafawa
A halin yanzusilicon carbide substrate Matakan sarrafawa sun haɗa da: niƙa da'irar waje, slicing, chamfering, niƙa, gogewa, tsaftacewa, da sauransu. Slicing mataki ne mai mahimmanci a cikin sarrafa substrate na semiconductor kuma muhimmin mataki na canza ingot zuwa ma'auni. A halin yanzu, yanke nasilicon carbide substratesyafi yankan waya. Multi-waya slurry yankan shine mafi kyawun hanyar yankan waya a halin yanzu, amma har yanzu akwai matsalolin rashin ingancin yankan da babban asarar yanke. Asarar yankan waya za ta karu tare da karuwar girman substrate, wanda bai dace da shi basilicon carbide substratemasana'antun don cimma raguwar farashi da haɓaka ingantaccen aiki. A cikin aiwatar da yankan8-inch silicon carbide substrates, siffar farfajiyar da aka samu ta hanyar yankan waya ba shi da kyau, kuma halayen lambobi irin su WARP da BOW ba su da kyau.
Yanke mataki ne mai mahimmanci a masana'antar substrate semiconductor. Masana'antar koyaushe tana ƙoƙarin sabbin hanyoyin yankan, kamar yankan wayar lu'u-lu'u da cirewar Laser. Ana neman fasahar cire Laser sosai kwanan nan. Gabatar da wannan fasaha yana rage raguwar hasara kuma yana inganta ingantaccen aiki daga ka'idar fasaha. Maganin cirewar Laser yana da manyan buƙatu don matakin sarrafa kansa kuma yana buƙatar fasahar ɓacin rai don yin aiki tare da shi, wanda ke cikin layi tare da jagorar ci gaba na gaba na sarrafa kayan aikin silicon carbide. Yawan yanki na yankan turmi na gargajiya gabaɗaya shine 1.5-1.6. Gabatar da fasahar cire Laser na iya ƙara yawan amfanin ƙasa zuwa kusan 2.0 (koma zuwa kayan aikin DISCO). A nan gaba, yayin da girma na fasahar cire laser ya karu, za a iya inganta yawan amfanin gona; a lokaci guda, cirewar Laser shima yana iya inganta ingancin yankan. Dangane da binciken kasuwa, shugaban masana'antar DISCO ya yanke yanki a cikin kusan mintuna 10-15, wanda ya fi inganci fiye da yankan wayar turmi na yanzu na mintuna 60 a kowane yanki.
Matakan tsarin yankan waya na gargajiya na siliki carbide substrates sune: waya yankan-m nika-lafiya nika-m polishing da lafiya polishing. Bayan tsarin cirewar Laser ya maye gurbin yankan waya, ana amfani da tsarin ɓacin rai don maye gurbin tsarin niƙa, wanda ke rage asarar yanki da inganta ingantaccen aiki. The Laser tsiri aiwatar da yankan, nika da polishing na silicon carbide substrates ya kasu kashi uku matakai: Laser surface scanning-substrate tsiri-ingot flattening: Laser surface scanning ne don amfani da ultrafast Laser bugun jini aiwatar da surface na ingot samar da wani modified. Layer a cikin ingot; Tsirewar ƙasa shine ya raba ƙasan da ke sama da ingantaccen Layer daga ingot ta hanyoyin jiki; ingot flattening shine a cire gyare-gyaren Layer akan saman ingot don tabbatar da shimfidar saman ingot.
Silicon carbide Laser tsiri tsari
2. Ci gaban kasa da kasa a cikin fasahar cire laser da kamfanoni masu shiga masana'antu
Kamfanonin kasashen ketare sun fara amfani da tsarin cire Laser: A cikin 2016, DISCO na Japan ya haɓaka sabuwar fasahar slicing Laser KABRA, wanda ke samar da layin rabuwa kuma ya raba wafers a ƙayyadadden zurfin ta hanyar ci gaba da haskaka ingot tare da Laser, wanda za'a iya amfani dashi don nau'ikan daban-daban. iri SiC ingots. A cikin Nuwamba 2018, Infineon Technologies ya sami Siltectra GmbH, fara yanke wafer, akan Yuro miliyan 124. Ƙarshen ya haɓaka tsarin Cold Split, wanda ke amfani da fasaha na Laser ƙwararrakin don ayyana kewayon tsagawa, sutura kayan aikin polymer na musamman, tsarin sanyaya damuwa da ke haifar da damuwa, daidaitaccen kayan tsaga, da niƙa da tsabta don cimma yankan wafer.
A cikin 'yan shekarun nan, wasu kamfanoni na cikin gida sun shiga cikin masana'antar kera kayan aikin laser: manyan kamfanoni sun hada da Han's Laser, Delong Laser, West Lake Instrument, Intelligence Universal, China Electronics Technology Group Corporation da Cibiyar Semiconductor na Kwalejin Kimiyya ta kasar Sin. A cikin su, kamfanonin Han's Laser da Delong Laser da aka jera sun daɗe suna cikin tsarin, kuma abokan ciniki suna tantance samfuran su, amma kamfanin yana da layukan samfura da yawa, kuma kayan cire Laser ɗin ɗaya ne kawai daga cikin kasuwancinsu. Samfuran taurari masu tasowa irin su West Lake Instrument sun sami jigilar kayayyaki; Intelligence Universal, China Electronics Technology Group Corporation 2, Cibiyar Semiconductors na Kwalejin Kimiyya ta kasar Sin da sauran kamfanoni sun fitar da ci gaban kayan aiki.
3. Abubuwan tuƙi don haɓaka fasahar cire Laser da haɓakar gabatarwar kasuwa
Rage farashin 6-inch silicon carbide substrates yana haifar da haɓaka fasahar cire Laser: A halin yanzu, farashin 6-inch silicon carbide substrates ya faɗi ƙasa da yuan 4,000 / yanki, yana gabatowa farashin farashin wasu masana'antun. Tsarin cirewar Laser yana da ƙimar yawan amfanin ƙasa da riba mai ƙarfi, wanda ke haifar da ƙimar shigar da fasahar cire laser don haɓaka.
Silicon carbide substrates mai inch 8-inch yana haifar da haɓaka fasahar cire laser: Kauri na 8-inch silicon carbide substrates a halin yanzu 500um, kuma yana haɓaka zuwa kauri na 350um. Tsarin yankan waya ba shi da tasiri a cikin sarrafa silikon carbide na 8-inch (bangon ƙasa ba shi da kyau), kuma ƙimar BOW da WARP sun lalace sosai. Ana ɗaukar cirewar Laser azaman fasaha mai mahimmanci don sarrafa 350um silicon carbide substrate, wanda ke motsa ƙimar shigar da fasahar cire Laser don haɓaka.
Tsammanin kasuwa: SiC substrate Laser kayan cire kayan aikin yana fa'ida daga haɓakar 8-inch SiC da rage farashin SiC-inch 6. Mahimmin mahimmancin masana'antu na yanzu yana gabatowa, kuma ci gaban masana'antar za a haɓaka sosai.
Lokacin aikawa: Jul-08-2024